Card having a fingerprint sensor and manufacturing method of the same
A card having a fingerprint sensor and a manufacturing method of the same are provided. The fingerprint sensor is disposed between a substrate and a protection layer. The protection layer has a first area and a second area thereon. The roughness of the second area is smaller than the roughness of the first area. The second area corresponds to the sensing area of the fingerprint sensor. When the user's finger is wet, the second area may effectively keep the water from remaining on it. Thus, the water does not affect the effect of fingerprint sensing.
1 . A card comprising:
a main layer having a circuit;
a fingerprint sensor disposed on the main layer, electrically connecting to the circuit of the main layer, and having a sensing area; and
a protective layer made of one unitary material, covering the main layer and the fingerprint sensor and having a surface including a first area and a second area, wherein a surface roughness of the first area is greater than a surface roughness of the second area and the second area covers the sensing area of the fingerprint sensor, wherein the first area and the second area are pre-formed on the protective layer prior to use and before any contact with a finger.
2 . The card as claimed in claim 1 , wherein the surface roughness of the second area is less than or equal to 1.13 μm.
3 . The card as claimed in claim 1 , wherein a hydrophobic material is applied to the second area.
4 . The card as claimed in claim 2 , wherein a hydrophobic material is applied to the second area.
5 . The card as claimed in claim 1 further comprising an integrated circuit (IC), wherein
the IC is disposed on the main layer; and
the protective layer has a through hole formed there through and corresponding to the IC, which allows the IC to be exposed from the protective layer.
6 . The card as claimed in claim 2 further comprising an integrated circuit (IC), wherein
the IC is disposed on the main layer; and
the protective layer has a through hole formed there through and corresponding to the IC, which allows the IC to be exposed from the protective layer.
7 . The card as claimed in claim 4 further comprising an integrated circuit (IC), wherein
the IC is disposed on the main layer; and
the protective layer has a through hole formed there through and corresponding to the IC, which allows the IC to be exposed from the protective layer.
8 . A manufacturing method of a card comprising steps of:
a. providing a main layer;
b. disposing a fingerprint sensor on the main layer, wherein the fingerprint sensor has a sensing area;
c. covering a protective layer on the main layer and the fingerprint sensor, wherein the protective layer is made of one unitary material; and
d. processing a surface treatment to a surface of the protective layer to form a first area and a second area, wherein the second area covers the sensing area of the fingerprint sensor, and a surface roughness of the first area is greater than a surface roughness of the second area, and the first area and the second area are pre-formed on the protective layer prior to use and before any contact with a finger.
9 . The method as claimed in claim 8 , wherein the step d includes a step of deforming the surface of the protective layer by using a workpiece to form the first area and the second area.
10 . The method as claimed in claim 8 , wherein
in the step c, the surface of the protective layer is formed as the second area; and
the step d includes a step of deforming the surface of the protective layer except for corresponding to the sensing area of the fingerprint sensor by using a workpiece to form the first area.
11 . The method as claimed in claim 8 , wherein
in the step c, the surface of the protective layer is formed as the first area; and
the step d includes a step of deforming the surface of the protective layer corresponding to the sensing area of the fingerprint sensor by using a workpiece to form the second area.
12 . The method as claimed in claim 8 further comprising steps of:
e. forming a through hole through the protective layer and communicating to the main layer; and
f. disposing an integrated circuit (IC) on the main layer and in the through hole of the protective layer to expose a contact surface of the IC from the protective layer.