IP Library Granted Patent US 12,218,112
Granted Patent B2
US 12,218,112 · App. 18/323,201 · Granted Feb 4, 2025

Method of forming light-emitting diodes with light coupling and conversion layers

Inventor: Florian Pschenitzka (San Francisco, CA)
Assignee: Kateeva, Inc.
H01L25/0753H01L33/32H01L33/504H01L33/505H01L33/508H01L2933/0041H01L2933/0091
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Quick Facts
Patent No.
US 12,218,112
App. No.
18/323,201
Granted
Feb 4, 2025
Kind
B2
Abstract

Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.

Claims (44)

1. A method, comprising:

forming a first confinement feature over a first light-emitting diode of a substrate;

forming a first scattering layer comprising scattering particles over the first light-emitting diode;

forming a red light-emission layer comprising red-emitting particles and scattering particles over the first scattering layer;

forming a second confinement feature over a second light-emitting diode of the substrate;

forming a second scattering layer comprising scattering particles over the second light-emitting diode; and

forming a green light-emission layer comprising green-emitting particles and scattering particles over the second scattering layer.

2. The method of claim 1 , wherein at least one of the first scattering layer, the red light-emission layer, the second scattering layer, and the green light-emission layer is formed using inkjet printing.

3. The method of claim 1 , wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode integrated into the substrate.

4. The method of claim 1 , wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode.

5. The method of claim 1 , wherein each of the first light-emitting diode and the second light-emitting diode is an ultraviolet light-emitting diode.

6. The method of claim 5 , further comprising:

forming a third confinement feature over a third light-emitting diode of the substrate;

forming a coupling layer over the third-light emitting diode; and

forming a blue light-emission layer comprising blue-emitting particles and scattering particles over the coupling layer.

7. The method of claim 6 , wherein the first scattering layer forms a curved interface with the red light-emission layer, the second scattering layer forms a curved interface with the green light-emission layer, the coupling layer forms a curved interface with the blue light-emission layer, or a combination thereof.

8. The method of claim 1 , further comprising forming a protective layer over the red light-emission layer and the green light-emission layer.

9. A method of forming a color conversion display device, the method comprising forming a plurality of pixels on a display device substrate using the method of claim 1 .

10. A method of forming a display, the method comprising:

forming a plurality of pixels on a semiconductor substrate each pixel comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and each pixel formed by:

forming a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode on the semiconductor substrate;

forming a first confinement feature over the first light-emitting diode;

forming a second confinement feature over the second light-emitting diode;

forming a red light emission-layer comprising red-emitting particles and scattering particles over the first light-emitting diode to provide the red sub-pixel;

forming a green light emission layer comprising green-emitting particles and scattering particles over the second light-emitting to provide the green sub-pixel; and

forming a blue light emission layer comprising blue light-emitting particles and scattering particles over the third light-emitting to provide the blue sub-pixel.

11. The method of claim 10 , wherein each of the first, second, and third light-emitting diodes is a gallium nitride-based light-emitting diode integrated into the substrate.

12. The method of claim 10 , wherein the green sub-pixels have emission surface areas that are larger than emission surface areas of the red sub-pixels and the emission surface areas of the blue sub-pixels.

13. The method of claim 10 , wherein at least one of the red light-emission layer, the green light-emission layer, and the blue light-emission layer is formed using inkjet printing.

14. A method, comprising:

forming a first confinement feature over a first light-emitting diode of a substrate;

forming a first scattering layer comprising scattering particles over the first light-emitting diode;

forming a red light-emission layer comprising red-emitting quantum dots and scattering particles over the first scattering layer, the red-emitting quantum dots having a graded concentration in at least a portion of the red light-emission layer;

forming a second confinement feature over a second light-emitting diode of the substrate;

forming a second scattering layer comprising scattering particles over the second light-emitting diode; and

forming a green light-emission layer comprising green-emitting quantum dots and scattering particles over the second scattering layer, the green-emitting quantum dots having a graded concentration in at least a portion of the green light-emission layer.

15. The method of claim 14 , wherein at least one of the red light-emission layer and the green light-emission layer is formed using inkjet printing.

16. The method of claim 14 , wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode integrated into the substrate.

17. The method of claim 14 , wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode.

18. The method of claim 14 , wherein each of the first light-emitting diode and the second light-emitting diode is an ultraviolet light-emitting diode.

19. The method of claim 18 , further comprising:

forming a third confinement feature over the third light-emitting diode; and

forming a blue light-emission layer comprising scattering particles over the third light-emitting diode.

20. The method of claim 14 , further comprising forming a protective layer over the red light-emission layer and the green light-emission layer.

Assignments (1)
SECURITY INTEREST Recorded Nov 13, 2025
From: KATEEVA, INC.
To: SINO XIN JI LIMITED
Reel/Frame 072891/0259 →
Cited By (1)
US 12,635,303