Layered window in thermophotovoltaic devices
A layered window in thermophotovoltaic (TPV) devices is disclosed herein. The device may include two or more front window layers, including an outer front window layer nearest the light source that is thin and highly doped and a lower doped inner front window layer nearest a TPV absorber layer. In some embodiments, there may be additional front window layers between the outer front window layer and the inner front window layer. In some embodiments, the TPV device also may include a front contact, a back contact, and other components.
1. A thermophotovoltaic device comprising:
a thermophotovoltaic absorber having a first side configured to receive electromagnetic radiation radiated from a thermal source and generate electricity from the received electromagnetic radiation; and
a front window positioned on the first side of the thermophotovoltaic absorber such that electromagnetic radiation travels through the front window before reaching the first side of the thermophotovoltaic absorber, the front window comprising an outer front window layer and an inner front window layer positioned between the outer front window layer and the first side of the thermophotovoltaic absorber, wherein
the outer front window layer comprises a material having a first bandgap;
the inner front window layer comprises a material having a second bandgap;
the thermophotovoltaic absorber comprises a material having a third bandgap;
the first bandgap is the same as or larger than the second bandgap; and
the first bandgap and the second bandgap are both the same as or larger than the third bandgap.
2. The thermophotovoltaic device of claim 1 , wherein the first bandgap is greater than 1 eV, the third bandgap is less than 1 eV, and the second bandgap is between the first bandgap and the third bandgap.
3. The thermophotovoltaic device of claim 1 , further comprising an intermediate front window layer positioned between the outer front window layer and the inner front window layer, the intermediate front window layer having a bandgap between the first bandgap and the second bandgap.
4. The thermophotovoltaic device of claim 1 , wherein:
the outer front window layer comprises a material having a first doping concentration;
the inner front window layer comprises a material having a second doping concentration; and
the first doping concentration is the same as or larger than the second doping concentration.
5. The thermophotovoltaic device of claim 4 , wherein the inner front window layer is doped with Si, Te, Se, or S and the outer front window layer is doped with Si, Te, Se, or S.
6. The thermophotovoltaic device of claim 4 , wherein
the inner front window layer is doped to a concentration of between 5×10 16 cm −3 and 5×10 18 cm −3 ; and
the outer front window layer is doped to a concentration of between 2.5×10 18 cm −3 and 5×10 19 cm −3 .
7. The thermophotovoltaic device of claim 6 , wherein:
the outer front window layer further comprises a material having a first conduction band energy level and a first valence band energy level;
the inner front window layer comprises a material having a second conduction band energy level and a second valence band energy level;
the thermophotovoltaic absorber comprises a material having a third conduction band energy level and a third valence band energy level;
the first conduction band energy level is greater than the second conduction band energy level;
the second conduction band energy level is greater than the third conduction band energy level;
the first valence band energy level is less than the second valence band energy level; and
the second valence band energy level is less than the third valence band energy level.
8. The thermophotovoltaic device of claim 7 , wherein:
the thermophotovoltaic absorber has an n-type doping;
the difference between the first conduction band energy level and the second conduction band energy level is less than 77 meV;
the difference between the second conduction band energy level and the third conduction band energy level is less than 77 meV;
the inner front window layer and the outer front window layer have n-type doping and are doped to a concentration of greater than 1×10 18 cm −3 ; and
the difference between the first valence band energy level and the second valence band energy level and/or the difference between the second valence band energy level and the third valence band energy level is greater than 77 meV; such that
electrons move between and through the conduction bands of the outer front window layer, the inner front window layer, and the thermophotovoltaic absorber more freely than holes move between and through the valence bands of the outer front window layer, the inner front window layer, and the thermophotovoltaic absorber to form an electron-selective contact.
9. The thermophotovoltaic device of claim 7 , wherein:
the thermophotovoltaic absorber has an p-type doping;
the difference between the first valence band energy level and the second valence band energy level is less than 77 meV;
the difference between the second valence band energy level and the third valence band energy level is less than 77 meV;
the inner front window layer and the outer front window layer have p-type doping and are doped to a concentration of greater than 1×10 18 cm −3 ; and
the difference between the first conduction band energy level and the second conduction band energy level and/or the difference between the second conduction band energy level and the third conduction band energy level is greater than 77 meV; such that
holes move between and through the valence bands of the outer front window layer, the inner front window layer, and the thermophotovoltaic absorber more freely than electrons move between and through the conduction bands of the outer front window layer, the inner front window layer, and the thermophotovoltaic absorber to form a hole-selective contact.
10. The thermophotovoltaic device of claim 1 , wherein the thermophotovoltaic absorber comprises a III/V semiconductor material.
11. The thermophotovoltaic device of claim 10 , wherein the inner front window layer comprises a III/V semiconductor material and the outer front window layer comprises a III/V semiconductor material.
12. The thermophotovoltaic device of claim 11 , wherein:
the thermophotovoltaic absorber comprises GaAs;
the inner front window layer comprises InGaP or AlGaAs; and
the outer front window layer comprises AlInP, AlInGaP, InGaP or AlGaAs.
13. The thermophotovoltaic device of claim 11 , wherein:
the thermophotovoltaic absorber comprises InGaAs;
the inner front window layer comprises InP, GaAsSb, or InGaAsP; and
the outer front window layer comprises InP.
14. The thermophotovoltaic device of claim 11 , wherein:
the thermophotovoltaic absorber comprises GaSb;
the inner front window layer comprises AlGaSb or AlAsSb; and
the outer front window layer comprises AlGaSb or AlAsSb.
15. A method of making a thermophotovoltaic device comprising:
depositing an outer front window layer;
depositing an inner front window layer; and
depositing a thermophotovoltaic absorber on the inner front window layer such that a first side of the thermophotovoltaic absorber contacts the inner front window layer and the inner front window layer is positioned is positioned between the thermophotovoltaic absorber and the outer front window layer; wherein
the thermophotovoltaic absorber is configured to receive electromagnetic radiation radiated from a thermal source and generate electricity from the received electromagnetic radiation, and wherein
the outer front window layer comprises a material having a first bandgap;
the inner front window layer comprises a material having a second bandgap;
the thermophotovoltaic absorber comprises a material having a third bandgap;
the first bandgap is the same as or larger than the second bandgap; and
the first bandgap and the second bandgap are both the same as or larger than the third bandgap.
16. The method of claim 15 , wherein:
depositing the outer front window layer comprises depositing a III/V semiconductor material having a bandgap of greater than 1 eV;
depositing the thermophotovoltaic absorber comprises depositing a III/V semiconductor material having a bandgap of less than 1 eV; and
depositing the inner front window layer comprises depositing a III/V semiconductor material having a bandgap between the bandgap of the material of the outer front window layer and the bandgap of the material of the thermophotovoltaic absorber.
17. The method of claim 15 , wherein:
depositing the outer front window layer comprises depositing a material having a first doping concentration;
depositing the inner front window layer comprises depositing a material having a second doping concentration; and
the first doping concentration is the same as or larger than the second doping concentration.
18. The method of claim 17 , wherein:
depositing the inner front window layer comprises depositing a III/V semiconductor material doped with Si, Te, Se, or S; and
depositing the outer front window layer comprises depositing a III/V semiconductor material doped with Si, Te, Se, or S.
19. The method of claim 18 , wherein:
depositing the thermophotovoltaic absorber comprises depositing GaAs;
depositing the inner front window layer comprises depositing InGaP or AlGaAs; and
depositing the outer front window layer comprises depositing AlInP, AlInGaP, InGaP or AlGaAs.
20. The method of claim 18 , wherein:
depositing the thermophotovoltaic absorber comprises depositing InGaAs;
depositing the inner front window layer comprises depositing InP, GaAsSb, or InGaAsP; and
depositing the outer front window layer comprises depositing InP.
21. The method of claim 18 , wherein:
depositing the thermophotovoltaic absorber comprises depositing GaSb;
depositing the inner front window layer comprises depositing AlGaSb or AlAsSb; and
depositing the outer front window layer comprises depositing AlGaSb or AlAsSb.
22. The method of claim 15 , wherein depositing the inner front window layer comprises
depositing the inner front window layer onto the outer front window layer.
23. The method of claim 15 , further comprising:
depositing a buffer layer onto a growth substrate; and
depositing a release layer into the buffer layer; and wherein
depositing the outer front window layer comprises depositing the outer front window layer onto the release layer.