Integrated freeform optical couplers and fabrication methods thereof
The present technology is related to optics and optical systems, particularly to photonic packaging, optical coupling, optical interconnects, micro-optics, and their fabrication. The present technology includes free-form micro-optical coupler architectures and systems with superb optical performance and a high-throughput method of fabricating large-area coupler arrays for scalable manufacturing. Embodiments include chip-to-fiber-array, chip-to-chip, chip-to-interposer, and chip-to-free-space couplers for applications including photonic packaging, optical communications, LiDAR, optical trapping and manipulation, augmented reality, virtual reality, and sensing.
1 . A photonic interposer comprising:
a transparent substrate having a first side and a second side opposite the first side; and
a polymer layer disposed on the first side of the transparent substrate and formed into:
(i) a free-form optical coupler extending from the first side of the transparent substrate and configured to couple light through the transparent substrate; and
(ii) a mechanical alignment structure extending from the first side of the transparent substrate and configured to mate with a complementary mechanical alignment structure.
2 . The photonic interposer of claim 1 , wherein the free-form optical coupler comprises a metasurface.
3 . The photonic interposer of claim 1 , further comprising:
a cavity formed in the second side of transparent substrate opposite from the free-form optical coupler; and
an optical fiber having one end disposed in the cavity,
wherein the free-form optical coupler is configured to couple light through the transparent substrate and into the optical fiber.
4 . The photonic interposer of claim 1 , wherein the polymer layer is a first polymer layer, the free-form optical coupler is a first free-form optical coupler, the mechanical alignment structure is a first mechanical alignment structure, and further comprising:
a second polymer layer disposed on the second side of the transparent substrate and formed into:
(i) a second free-form optical coupler extending from the second side of the transparent substrate opposite from the first free-form optical coupler; and
(ii) a second mechanical alignment structure extending from the second side of the transparent substrate.
5 . The photonic interposer of claim 1 , wherein the polymer layer is a first polymer layer and further comprising:
a second polymer layer disposed on the second side of the transparent substrate and formed into a fiber holder opposite from the free-form optical coupler and configured to receive an end of an optical fiber.
6 . The photonic interposer of claim 5 , wherein the second polymer layer is further formed into an optical component configured to focus, redirect, and/or spatially modulate light emitted from and/or coupled into the end of the optical fiber.
7 . An assembly comprising:
the photonic interposer of claim 1 ; and
a photonic chip bonded to the photonic interposer and comprising an optical waveguide having a facet mated to a surface of the free-form optical coupler,
wherein the free-form optical coupler extends into a cavity formed in the photonic chip and the complementary mechanical alignment structure is formed in the photonic chip.
8 . The assembly of claim 7 , wherein the facet is formed on a wall of the cavity.
9 . The assembly of claim 7 , further comprising:
another layer of polymer disposed on a surface of the photonic chip facing the photonic interposer.
10 . The assembly of claim 7 , wherein the mechanical alignment structure and the complementary mechanical alignment structure form an air gap between the photonic chip and the photonic interposer.
11 . The assembly of claim 7 , wherein the free-form optical coupler is a first free-form optical coupler, the photonic chip is a first photonic chip, the optical waveguide is a first optical waveguide, the facet is a first facet, and further comprising:
a second photonic chip bonded to the photonic interposer and comprising a second optical waveguide having a second facet,
wherein the photonic chip comprises a second polymer layer disposed on the second side of the transparent substrate and formed into a second free-form optical coupler that extends from the photonic chip and into a cavity in the second photonic chip in optical communication with the second facet.
12 . The assembly of claim 11 , wherein the first optical waveguide is in optical communication with the second optical waveguide via the first free-form optical coupler, the transparent substrate, and the second free-form optical coupler.
13 . The assembly of claim 11 , further comprising:
an electrical connection between the first photonic chip and the second photonic chip.
14 . A method of making a photonic interposer, the method comprising:
disposing a polymer layer on a first side of a transparent substrate;
forming a free-form optical coupler extending from the transparent substrate in the polymer layer;
forming a mechanical alignment structure extending from the transparent substrate in the polymer layer; and
forming an optical coupler on a second side of the transparent substrate opposite from the free-form optical coupler.
15 . The method of claim 14 , wherein forming the optical coupler on the second side of the transparent substrate comprises forming a cavity in the second side of the transparent substrate opposite the free-form optical coupler, and further comprising:
disposing an end of an optical fiber in the cavity.
16 . The method of claim 14 , wherein the polymer layer is a first polymer layer and forming the optical coupler on the second side of the transparent substrate comprises:
disposing a second polymer layer on the second side of the transparent substrate;
forming a fiber holder in the second polymer layer opposite the free-form optical coupler; and
disposing an end of an optical fiber in the fiber holder.
17 . The method of claim 14 , further comprising:
bonding the photonic interposer to a photonic chip such that the free-form optical coupler extends into a cavity formed in the photonic chip in optical communication with a waveguide formed in the photonic chip.
18 . The method of claim 17 , wherein bonding the photonic interposer to the photonic chip comprises:
placing a surface of the free-form optical coupler in direct contact with a facet of the waveguide formed along a wall of the cavity.
19 . The method of claim 14 , wherein the polymer layer is a first polymer layer, the free-form optical coupler is a first free-form optical coupler, the optical coupler is a second free-form optical coupler, and forming the second free-form optical coupler on the second side of the transparent substrate comprises:
disposing a second polymer layer on the second side of the transparent substrate;
forming the second free-form optical coupler extending from the second side of the transparent substrate in the second polymer layer; and
forming a second mechanical alignment structure extending from the second side of the transparent substrate in the second polymer layer.
20 . The method of claim 19 , further comprising:
bonding the photonic interposer to a first photonic chip such that the first free-form optical coupler extends into a cavity formed in the first photonic chip in optical communication with a first waveguide formed in the first photonic chip; and
bonding the photonic interposer to a second photonic chip such that the second free-form optical coupler extends into a cavity formed in the second photonic chip in optical communication with a second waveguide formed in the second photonic chip.