IP Library Granted Patent US 12,526,961
Granted Patent B2
US 12,526,961 · App. 18/330,480 · Granted Jan 13, 2026

Systems for cooling module assembly for inverter for electric vehicle

Inventors: Edward Choi (Lake Orion, MI); Andreas Mayer (Auburn Hills, MI)
Assignee: BorgWarner US Technologies LLC
H05K7/20418H05K7/1432H05K7/20854H05K7/209
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,526,961
App. No.
18/330,480
Granted
Jan 13, 2026
Kind
B2
Abstract

A system for an electric vehicle includes: a first heat sink including a first mounting hole extending through the first heat sink; a second heat sink positioned adjacent to the first heat sink in an axial direction; and a spacer between the first heat sink and the second heat sink to set a distance between the first heat sink and the second heat sink, the spacer including: a flange that is coupled to both the first heat sink and the second heat sink, the flange having a thickness in the axial direction, and a protrusion extending away from the flange, the protrusion received by the first mounting hole of the first heat sink.

Claims (54)

1 . A system for an electric vehicle, the system comprising:

a first heat sink including a first mounting hole extending through the first heat sink;

a second heat sink positioned adjacent to the first heat sink in an axial direction; and

a spacer between the first heat sink and the second heat sink to set a distance between the first heat sink and the second heat sink, the spacer including:

a flange that is coupled to both the first heat sink and the second heat sink, the flange having a thickness in the axial direction, and

a protrusion extending away from the flange, the protrusion received by the first mounting hole of the first heat sink,

wherein the second heat sink includes a surface facing the first heat sink, wherein the surface includes an integrated spacer to cooperate with the flange of the spacer to control the distance between the first heat sink and the second heat sink.

2 . The system of claim 1 , wherein the second heat sink includes fins.

3 . The system of claim 2 , further comprising:

a housing of an inverter, the housing including a cavity to receive the fins.

4 . The system of claim 1 , further comprising:

a fastener,

wherein the second heat sink includes a second mounting hole, and

wherein the fastener passes through the first mounting hole, the spacer, and the second mounting hole to fasten the first heat sink to the second heat sink.

5 . The system of claim 4 , further comprising:

a spring washer for the fastener.

6 . The system of claim 1 , further comprising:

a power module configured to convert direct current (DC) from a battery to alternating current (AC) current,

wherein the power module is positioned between the first heat sink and the second heat sink.

7 . The system of claim 1 , wherein the spacer provides galvanic compliance between the first heat sink and the second heat sink.

8 . An inverter comprising the system of claim 1 .

9 . A vehicle comprising the inverter of claim 8 .

10 . A cooling module assembly system for an inverter, the cooling module assembly system comprising:

a first heat sink;

a second heat sink including a surface facing the first heat sink, wherein the surface includes an integrated spacer; and

a spacer between the first heat sink and the second heat sink to cooperate with the integrated spacer to control a distance between the first heat sink and the second heat sink, wherein, along an axial direction of the spacer, the spacer includes a wider portion and a narrower portion.

11 . The cooling module assembly system of claim 10 , further comprising:

a fastener,

wherein the first heat sink includes a first mounting hole,

wherein the second heat sink includes a second mounting hole, and

wherein the fastener passes through the first mounting hole, the spacer, and the second mounting hole to fasten the first heat sink to the second heat sink.

12 . The cooling module assembly system of claim 10 , wherein the second heat sink includes fins.

13 . The cooling module assembly system of claim 12 , further comprising:

a housing of the inverter, the housing including a cavity to receive the fins.

14 . The cooling module assembly system of claim 10 , wherein a thickness of the integrated spacer is equal to a thickness of a power module of the inverter and a thickness of thermal interface material to connect the power module to the cooling module assembly system between the first heat sink and the second heat sink.

15 . The cooling module assembly system of claim 10 , wherein the integrated spacer includes a gap to accommodate a power module of the inverter.

16 . A system comprising:

an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes:

a power module; and

a cooling system configured to cool the power module, wherein the cooling system includes:

a first heat sink including a first mounting hole extending through the first heat sink;

a second heat sink including an integrated spacer, the integrated spacer positioned adjacent to the first heat sink in an axial direction; and

a spacer between the first heat sink and the second heat sink, the spacer including:

a flange that is coupled to both the first heat sink and the second heat sink, the flange having a thickness in the axial direction, and

a protrusion extending away from the flange, the protrusion received by the first mounting hole of the first heat sink,

wherein a distance between the first heat sink and the second heat sink is set by a thickness of the integrated spacer and a thickness of the flange of the spacer.

17 . The system of claim 16 , wherein the thickness of the spacer is equal to a thickness of the power module and a thickness of thermal interface material to connect the power module to the cooling system between the first heat sink and the second heat sink.

18 . The system of claim 16 , wherein the second heat sink includes fins, and

wherein the inverter includes a housing including a cavity to receive the fins.

19 . The system of claim 1 , further comprising:

a power module configured to be coupled to both the integrated spacer and the spacer.

20 . The cooling module assembly system of claim 10 , further comprising:

a first surface of a power module configured to be coupled with the second heat sink; and

a second surface of a power module configured to be coupled with the spacer.

Assignments (2)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068987/0367 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2023
From: MAYER, ANDREAS; CHOI, EDWARD
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 064188/0235 →
Continuity (1)
Related Publication 20240414885A1 · Dec 12, 2024
References Cited (34)
US 6812553B2 · Gerbsch et al. · 2004 [cited by applicant]
US 6943293B1 · Jeter et al. · 2005 [cited by applicant]
US 7095098B2 · Gerbsch et al. · 2006 [cited by applicant]
US 7229855B2 · Murphy · 2007 [cited by applicant]
US 7295433B2 · Taylor et al. · 2007 [cited by applicant]
US 7538425B2 · Myers et al. · 2009 [cited by applicant]
US 7551439B2 · Peugh et al. · 2009 [cited by applicant]
US 10342119B1 · Mujcinovic · 2019 [cited by applicant]
US 20060219396A1 · Abei et al. · 2006 [cited by applicant]
US 20110188204A1 · Horiuchi · 2011 [cited by examiner]
US 20130003301A1 · Miyamoto et al. · 2013 [cited by applicant]
US 20130107457A1 · Campbell et al. · 2013 [cited by applicant]
US 20160211192A1 · Mizuno et al. · 2016 [cited by applicant]
US 20190335608A1 · Song · 2019 [cited by examiner]
US 20190341327A1 · Teysseyre et al. · 2019 [cited by applicant]
US 20200344920A1 · Lee et al. · 2020 [cited by applicant]
US 20210125768A1 · Chen et al. · 2021 [cited by applicant]
US 20210144879A1 · Kang et al. · 2021 [cited by applicant]
US 20210178859A1 · Bellino et al. · 2021 [cited by applicant]
US 20210280498A1 · Kang et al. · 2021 [cited by applicant]
US 20220042569A1 · Ott et al. · 2022 [cited by applicant]
US 20220095493A1 · Blanchard St-Jacques et al. · 2022 [cited by applicant]
US 20220132705A1 · Langenfeld · 2022 [cited by applicant]
US 20220200356A1 · Luzinski · 2022 [cited by examiner]
US 20220384106A1 · Park et al. · 2022 [cited by applicant]
US 20240030096A1 · Zhu · 2024 [cited by examiner]
US 20240317022A1 · Wiland et al. · 2024 [cited by applicant]
CN 109041504A · 2018 [cited by applicant]
CN 113746351A · 2021 [cited by applicant]
CN 114867273A · 2022 [cited by examiner]
DE 102017214490A1 · 2019 [cited by examiner]
TW M598589U · 2020 [cited by examiner]
“The X factor: X-Rings vs O-Rings”, Dec. 3, 2020, Techno Ad, Entire Document (https://www.technoad.com/x-rings-vs-o-rings/). (Year: 2020). [cited by applicant]
“X Ring vs. 0 Ring: How To Choose the Correct One”, Mar. 21, 2019, AbbeySeals, Entire Document (https://www.abbeyseals.ie/x-ri ng-vs-o-ring-how-to-choose-the-correct-one/). (Year: 2019). [cited by applicant]