Systems and methods for a multi-functional structural element of an inverter
An inverter including: a housing including a first surface and a second surface opposite to the first surface; a power module including a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module; a multi-functional structural element, the multi-functional structural element including a first surface and a second surface, wherein the first surface of the multi-functional structural element contacts the second surface of the heat sink; and a printed circuit board, the printed circuit board being coupled to the second surface of the multi-functional structural element; wherein the housing and heat sink define a cooling circuit.
1. An inverter comprising:
a housing including a first surface and a second surface opposite to the first surface;
a power module including a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing;
a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module;
a multi-functional structural element, the multi-functional structural element including a first surface and a second surface opposite to the first surface, wherein the first surface of the multi-functional structural element contacts the second surface of the heat sink; and
a printed circuit board, the printed circuit board being coupled to the second surface of the multi-functional structural element;
wherein the housing and heat sink define a cooling circuit, the cooling circuit including a first cooling channel and a second cooling channel, the first cooling channel being defined by a space in the housing and the second cooling channel being defined by inner walls of the heat sink.
2. The inverter of claim 1 , wherein the multi-functional structural element is coupled to the heat sink by a thermal interface material.
3. The inverter of claim 1 , wherein the multi-functional structural element is coupled to the heat sink by a hermetic seal.
4. The inverter of claim 1 , wherein the multi-functional structural element is metal.
5. The inverter of claim 1 , wherein the multi-functional structural element does not directly contact the cooling circuit.
6. The inverter of claim 1 , wherein the heat sink is a diecast heat sink or sheet metal heat sink.
7. The inverter of claim 1 , wherein the multi-functional structural element includes a first plane, the first plane being a recess within the first surface of the multi-functional structural element, the recess being configured to receive the heat sink.
8. The inverter of claim 1 , wherein an air gap exists between the printed circuit board and an external cover of the housing.
9. The inverter of claim 1 , wherein the multi-functional structural element includes a fixation point capable of receiving a screw, the screw being configured to secure the printed circuit board and the multi-functional structural element to the housing.
10. The inverter of claim 1 , wherein the multi-functional structural element has a geometric cross section greater than the power module.
11. The inverter of claim 10 , wherein the multi-functional structural element is configured to completely cover the printed circuit board from an electromagnetic field projected from the power module.
12. The inverter of claim 1 , wherein the multi-functional structural element includes a second plane that protrudes from the second surface of the multi-functional structural element and contacts the printed circuit board, wherein the second plane is configured to receive heat from the printed circuit board.
13. An inverter comprising:
a housing including a first surface and a second surface opposite to the first surface;
a power module including a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing;
a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module;
a multi-functional structural element, the multi-functional structural element including a first surface and a second surface opposite to the first surface, wherein the first surface of the multi-functional structural element contacts an outer wall of the heat sink, wherein the multi-functional structural element has a geometric cross section greater than the power module; and
a printed circuit board, the printed circuit board being coupled to the second surface of the multi-functional structural element, wherein the multi-functional structural element is configured to completely cover the printed circuit board from an electromagnetic field projected from the power module;
wherein the housing and the heat sink define a cooling circuit, the cooling circuit including a first cooling channel and a second cooling channel, the first cooling channel being defined by a space in the housing and the second cooling channel being defined by inner walls of the heat sink.
14. The inverter of claim 13 , wherein the multi-functional structural element is coupled to the heat sink by a thermal interface material.
15. The inverter of claim 13 , wherein the multi-functional structural element is coupled to the heat sink by a hermetic seal.
16. The inverter of claim 13 , wherein the multi-functional structural element is metal.
17. The inverter of claim 13 , wherein the multi-functional structural element does not directly contact the cooling circuit.
18. The inverter of claim 13 , wherein the multi-functional structural element includes a first plane, the first plane being a recess within the first surface of the multi-functional structural element, the recess being configured to receive the heat sink.
19. The inverter of claim 13 , wherein the multi-functional structural element includes a second plane that protrudes from the second surface of the multi-functional structural element and contacts the printed circuit board, wherein the second plane is configured to receive heat from the printed circuit board.
20. A multi-functional structural element for an inverter, the element comprising:
a first plane with a first surface and a second surface opposite to the first surface, the multi-functional structural element further including a second plane and a third plane, the second plane being a rectangular recess within the first surface of the first plane, the second plane being configured to receive and transfer heat to a heat sink, the third plane being a protrusion from the second surface of the first plane, the third plane being configured to contact a printed circuit board and configured to transfer heat from the printed circuit board to the first plane.