IP Library Granted Patent US 12,337,600
Granted Patent B2
US 12,337,600 · App. 18/334,211 · Granted Jun 24, 2025

Liquid ejection head

Inventors: Keita Takahashi (Mishima Shizuoka, JP); Takashi Tozuka (Sunto Shizuoka, JP); Minoru Koyata (Mishima Shizuoka, JP)
Assignee: RISO Technologies Corporation
B41J2/14233B41J2002/14306
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Quick Facts
Patent No.
US 12,337,600
App. No.
18/334,211
Granted
Jun 24, 2025
Kind
B2
Abstract

According to one embodiment, a liquid ejection head includes a substrate with a hole, a nozzle plate with a plurality of nozzles, and an actuator on a first surface of the substrate. The actuator has a plurality of pressure chambers aligned to the plurality of nozzles. An electrode has a first portion on the first surface of the substrate and a second portion on a second surface of the substrate. The second surface is on an opposite side of the substrate from the first surface. A manifold has a first liquid hole facing the hole in the substrate and a second liquid hole facing another portion of the substrate other than the hole. A shielding member is between the substrate and the manifold and covers the second liquid hole.

Claims (42)

1. A liquid ejection head, comprising:

a substrate with a hole;

a nozzle plate with a plurality of nozzles;

an actuator on a first surface of the substrate, the actuator having a plurality of pressure chambers aligned to the plurality of nozzles;

an electrode having a first portion on the first surface of the substrate and a second portion on a second surface of the substrate, the second surface being on an opposite side of the substrate from the first surface;

a manifold with a first liquid hole facing the hole in the substrate and a second liquid hole facing another portion of the substrate other than the hole; and

a shielding member between the substrate and the manifold and covering the second liquid hole.

2. The liquid ejection head according to claim 1 , wherein the manifold includes:

a first liquid flow path for a first liquid, the first liquid flow path connected to the first liquid hole, and

a second liquid flow path for a second liquid different from the first liquid, the second liquid flow path connected to the second liquid hole.

3. The liquid ejection head according to claim 1 , wherein the shielding member includes a through-hole connecting the hole in the substrate and the first liquid hole in the manifold.

4. The liquid ejection head according to claim 1 , wherein the shielding member is a polyimide film.

5. The liquid ejection head according to claim 1 , wherein the shielding member is ceramic.

6. The liquid ejection head according to claim 1 , wherein the difference between a linear expansion coefficient of the shielding member and a linear expansion coefficient of the substrate is 25×10 −6 (/K) or less.

7. The liquid ejection head according to claim 6 , wherein the difference between a linear expansion coefficient of the manifold and the linear expansion coefficient of the shielding member is 25×10 −6 (/K) or less.

8. The liquid ejection head according to claim 1 , wherein

the second portion of the electrode covers substantially the entire second surface of the substrate, and

the shielding member covers substantially the entire second portion of the electrode.

9. The liquid ejection head according to claim 8 , wherein the shielding member has the same outer planar shape as the second surface of the substrate.

10. The liquid ejection head according to claim 8 , wherein the shielding member has the same outer planar shape as a surface of the manifold facing the second surface of the substrate.

11. The liquid ejection head according to claim 1 , wherein the shielding member has the same outer planar shape as the second surface of the substrate.

12. The liquid ejection head according to claim 1 , wherein the difference between a linear expansion coefficient of the manifold and the linear expansion coefficient of the shielding member is 25×10 −6 (/K) or less.

13. A liquid ejection apparatus, comprising:

a media support; and

an inkjet head configured to eject liquid towards the media support, the inkjet head including:

a substrate with a hole;

a nozzle plate with a plurality of nozzles;

an actuator on a first surface of the substrate, the actuator having a plurality of pressure chambers aligned to the plurality of nozzles;

an electrode having a first portion on the first surface of the substrate and a second portion on a second surface of the substrate, the second surface being on an opposite side of the substrate from the first surface;

a manifold with a first liquid hole facing the hole in the substrate and a second liquid hole facing another portion of the substrate other than the hole; and

a shielding member between the substrate and the manifold and covering the second liquid hole.

14. The liquid ejection apparatus according to claim 13 , wherein the manifold includes:

a first liquid flow path for a first liquid, the first liquid flow path connected to the first liquid hole, and

a second liquid flow path for a second liquid different from the first liquid, the second liquid flow path connected to the second liquid hole.

15. The liquid ejection apparatus according to claim 13 , wherein the shielding member includes a through-hole connecting the hole in the substrate and the first liquid hole in the manifold.

16. The liquid ejection apparatus according to claim 13 , wherein the shielding member is a polyimide film.

17. The liquid ejection apparatus according to claim 13 , wherein the shielding member is ceramic.

18. The liquid ejection apparatus according to claim 13 , wherein the difference between a linear expansion coefficient of the shielding member and a linear expansion coefficient of the substrate is 25×10 −6 (/K) or less.

19. The liquid ejection apparatus according to claim 18 , wherein the difference between a linear expansion coefficient of the manifold and the linear expansion coefficient of the shielding member is 25×10 −6 (/K) or less.

20. The liquid ejection apparatus according to claim 13 , wherein

the second portion of the electrode covers substantially the entire second surface of the substrate, and

the shielding member covers substantially the entire second portion of the electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2024
From: TOSHIBA TEC KABUSHIKI KAISHA
To: RISO TECHNOLOGIES CORPORATION
Reel/Frame 068493/0970 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2023
From: TAKAHASHI, KEITA; TOZUKA, TAKASHI; KOYATA, MINORU
To: TOSHIBA TEC KABUSHIKI KAISHA
Reel/Frame 063938/0149 →
Priority Claims (1)
JP 2022-135260 · Aug 26, 2022 · national
Continuity (1)
Related Publication 20240066867A1 · Feb 29, 2024
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