Additive manufacturing, bond modifying system and method
An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control a state of matter of each successive additive layer. Accordingly, the system may be used to alter the chemical bond arrangement of the material forming the various additive layers.
1. An apparatus, comprising:
a print bed configured to support one or more layers of a material comprising at least two chemical elements chemically bonded together;
at least one energy source configured to generate first radiant energy and second radiant energy, the second radiant energy having an intensity greater than an intensity of the first radiant energy and a duration shorter than a duration of the first radiant energy;
a mask; and
a computer system configured to control the print bed, the at least one energy source and the mask, the computer system comprising a processor and a memory operably connected to the processor, wherein the processor is configured to execute instructions stored in the memory to perform operations comprising:
distributing a first layer of the material over a substrate;
directing the first radiant energy at a first portion of the first layer to heat the first portion; and
after heating the first portion, directing the second radiant energy at the first portion to overcome an activation energy barrier of a reaction between the at least two chemical elements corresponding to the first portion such that, as a result of the overcoming, additional chemical bonds form between the at least two chemical elements corresponding to the first portion.
2. The apparatus of claim 1 , wherein the material comprises a ceramic in a granular form.
3. The apparatus of claim 2 , wherein the forming of the additional chemical bonds converts the ceramic to a solid in a non-granular form.
4. The apparatus of claim 1 , wherein:
the directing the first radiant energy at the first portion occurs for a first period of time;
the directing the second radiant energy at the first portion occurs for a second period of time; and
the first period of time is at least an order of magnitude greater than the second period of time.
5. The apparatus of claim 4 , wherein the first period of time is within a range from about 1 microsecond to about 1 millisecond and the second period of time is within a range from about 1 nanoseconds to about 1 microsecond.
6. The apparatus of claim 1 , wherein the processor is further configured to perform operations comprising:
controlling a solid-state pulsed laser of the at least one energy source to generate at least a portion of the second radiant energy.
7. The apparatus of claim 1 , wherein the first radiant energy comprises an electron beam or a laser beam.
8. The apparatus of claim 1 , wherein the second radiant energy comprises an electron beam or a laser beam.
9. The apparatus of claim 1 , wherein the overcoming comprises altering a preponderance of covalent chemical bonds within the first portion.
10. The apparatus of claim 1 , wherein the overcoming comprises altering a preponderance of ionic chemical bonds within the first portion.
11. The apparatus of claim 1 , wherein the overcoming comprises altering a preponderance of metallic chemical bonds within the first portion.
12. The apparatus of claim 1 , wherein at least one of the directing the first radiant energy and the directing the second radiant energy comprises directing co-linear laser beams that sequentially target the first portion.
13. The apparatus of claim 1 , wherein at least one of the directing the first radiant energy and the directing the second radiant energy comprises directing a plurality of non-co-linear laser beams that sequentially target the first portion.
14. The apparatus of claim 1 , wherein the processor is further configured to perform operations comprising:
distributing, after the forming, a second layer of the material over the first layer.
15. The apparatus of claim 1 , wherein the processor is further configured to perform operations comprising:
controlling a solid-state pulsed laser of the at least one energy source to generate at least a portion of the second radiant energy.
16. The apparatus of claim 1 , further comprising:
an energy patterning unit,
wherein at least one of the first radiant energy and the second radiant energy passes through at least one light valve of the energy patterning unit to result in patterning of the at least one of the first radiant energy and the second radiant energy onto the first layer by controlling a temporal pulse shape of the at least one of the first radiant energy and the second radiant energy and rejecting unused radiant energy.