All-back-contact photovoltaic devices using cracked film lithography
The present disclosure relates to a device that includes an irregular network of interconnected ridges in physical contact with a planar substrate and a perovskite layer, where the planar substrate include a support layer and a first charge selective contact layer, the first charge selective contact layer is positioned between the support layer and the interconnected ridges, each ridge includes a second charge selective contact layer and an insulating layer, the insulating layer is positioned between the first charge selective contact layer and the second charge selective contact layer, and the perovskite layer substantially covers the plurality of interconnected ridges and the underlying planar substrate.
1. A device comprising:
an irregular network of interconnected ridges in physical contact with a planar substrate; and
a perovskite layer, wherein:
the planar substrate comprises a support layer and a first charge selective contact layer,
the first charge selective contact layer is positioned between the support layer and the interconnected ridges,
each of the interconnected ridges comprises a second charge selective contact layer and an insulating layer,
the insulating layer is positioned between the first charge selective contact layer and the second charge selective contact layer, and
the perovskite layer substantially covers the interconnected ridges and the underlying planar substrate laid under the perovskite layer.
2. The device of claim 1 , wherein the network is characterized by the ridges having an average width, W, between 0.05 μm and 500 μm.
3. The device of claim 1 , wherein the network is characterized by the ridges having an average height, H, between 0.01 μm and 10 μm.
4. The device of claim 1 , wherein the network is characterized by the ridges having an average spacing, S, between 0.1 μm and 1,000 μm.
5. The device of claim 1 , wherein the network is characterized by the ridges having a length, L, between 1 μm and 500 μm.
6. The device of claim 1 , wherein the first charge selective contact layer is electron selective.
7. The device of claim 6 , wherein the first charge selective contact layer comprises a transparent conductive oxide.
8. The device of claim 1 , wherein the second charge selective contact layer is hole selective.
9. The device of claim 8 , wherein:
the second charge selective contact layer comprises a metal layer and a metal oxide layer, and
the metal oxide layer is positioned between the metal layer and the insulating layer.
10. The device of claim 1 , wherein the perovskite comprises at least one of a three-dimensional (3D) structure, a two-dimensional (2D) structure, a one-dimensional (1D) structure, or a zero-dimensional (0D) structure.
11. The device of claim 10 , wherein:
the perovskite has a structure according to ABX 3 ,
A comprises a first cation,
B comprises a second cation, and
X comprises an anion.
12. The device of claim 11 , wherein A comprises at least one of cesium, methylammonium (MA), or formamidinium (FA).
13. The device of claim 11 , wherein B comprises at least one lead or tin.
14. The device of claim 11 , wherein X comprises a halide.
15. The device of claim 11 , wherein the perovskite comprises Cs 1-z (MA 1-x FA x ) z Pb(I 1-a Br a ) 3 .
16. The device of claim 15 , wherein 0.85≤z≤0.99, 0.05≤x≤0.25, and 0.05≤z≤0.25.
17. The device of claim 1 , wherein the perovskite layer has a thickness between 500 nm and 1000 nm.
18. The device of claim 1 , wherein the insulating layer comprises a metal oxide.