Granted Patent B2

US 12,548,741 · App. 18/349,557 · Granted Feb 10, 2026

Inventors: Kyungyeol Min (Seoul, KR); Yongsoo Choi (Seoul, KR); SungSic Hwang (Seoul, KR); Kyungin Kim (Seoul, KR); Jungkun Kang (Seoul, KR); Su Man Chae (Seoul, KR)

Assignee: Solmics Co., Ltd.

H01J37/32642H01J37/32715

Abstract

Claims (33)

1 . A focus ring for mounting an etching target in a plasma etching device, the focus ring comprising:

a seating portion, including a seating surface configured to accommodate the etching target; and

a main body, formed on an outer circumference of the seating portion, comprising a groove portion having a groove disposed in an upper surface of the main body,

wherein a height of an upper surface of the groove portion is lower than a maximum height of the upper surface of the main body,

a ratio Vg/Vf of a volume Vg of the groove to a sum Vf of the volume Vg of the groove and a volume of the focus ring ranges from 0.1 to 0.5, and

the volume Vg is:

Vg =( Hb−Hg )× W avg× L sum,

where Hb denotes a maximum height of the upper surface of the main body, Hg denotes an average height of the upper surface of the groove portion, Wavg denotes an average width of the groove portion viewed in a radial direction of the focus ring, and Lsum denotes the sum of lengths of the groove portion based on a circumferential direction of the focus ring.

2 . The focus ring of claim 1 , wherein the main body comprises

a connector disposed on the outer circumference of the seating portion,

the groove portion disposed on an outer circumference of the connector, and

an edge portion disposed on an outer circumference of the groove portion.

3 . The focus ring of claim 2 , wherein a ratio of a width Ws of the connector to a width Wg of the groove portion, Ws/Wg, ranges from 0.04 to 0.2.

4 . The focus ring of claim 1 , wherein, in the radial direction of the focus ring, a maximum width of the groove portion ranges from 15 mm to 25 mm.

5 . The focus ring of claim 1 , wherein an average thickness of the focus ring is 3.2 mm or less.

6 . The focus ring of claim 1 , wherein a ratio of an average thickness Tg of the groove portion to an average thickness Tb of the main body, Tg/Tb, excluding the groove portion, ranges from 0.16 to 0.72.

7 . The focus ring of claim 6 , wherein the average thickness of the groove portion ranges from 0.5 mm to 2.3 mm.

8 . The focus ring of claim 6 , wherein the average thickness of the main body, excluding the groove portion, ranges from 2.2 mm to 3.2 mm.

9 . The focus ring of claim 1 , wherein an average thickness of the seating portion ranges from 1 mm to 2 mm.

10 . The focus ring of claim 1 , wherein a width of the seating portion ranges from 2 mm to 8 mm based on the radial direction of the focus ring.

11 . The focus ring of claim 1 , wherein an upper surface roughness Ra of the main body ranges from 0.05 μm to 0.5 μm.

12 . The focus ring of claim 1 , wherein an average thickness of the main body, excluding the groove portion, ranges from 2.2 mm to 3.2 mm.

13 . The focus ring of claim 2 , wherein:

a bottom surface of the edge portion includes a lower groove portion; and

a minimum width from a bottom surface of the groove portion to the lower groove portion ranges from about 0.5 mm to 5 mm based on the radial direction of the focus ring.

14 . The focus ring of claim 1 , wherein an incline step difference of a bottom surface of the focus ring between an innermost circumference and an outermost circumference of the bottom surface ranges from 0.1 μm to 12 μm.

15 . A plasma etching device comprising:

the focus ring of claim 1 ;

a chamber; and

an electrostatic chuck and an upper electrostatic chuck disposed inside the chamber,

wherein the focus ring surrounds an outer circumference of an etching target mounted on the upper electrostatic chuck,

the electrostatic chuck is disposed below the focus ring, and

an electrode of the electrostatic chuck is disposed in a region below the focus ring.

Assignments (3)

Priority Claims (1)

Continuity (1)

References Cited (50)