METHOD FOR FIXING ELECTRONIC COMPONENT PIN
A method for fixing an electronic component pin is provided, and relates to the technical field of printed circuit board assembly (PCBA), for improving the soldering effect of the electronic component in being soldered. The method includes performing bending treatment on a pin of an electronic component; performing stress relieving forming to the pin after being subjected to the bending treatment; placing the electronic component after being subjected to the stress relieving forming in a height-controlling support jig, where the distance between the electronic component and a circuit board is defined by the height-controlling support jig; mounting the height-controlling support jig, in which the electronic component is placed, in a corresponding position of the electronic component on the circuit board; and soldering the electronic component onto the circuit board.
1 . A method for fixing an electronic component pin, applied to fixing pins of an insulated gate bipolar transistor (IGBT) or a metal-oxide-semiconductor field-effect transistor (MOSFET), comprising:
performing bending treatment on a pin of an electronic component;
performing stress relieving forming on the pin after being subjected to the bending treatment;
placing the electronic component after being subjected to the stress relieving forming in a height-controlling support jig, wherein a distance between the electronic component and a circuit board is defined by the height-controlling support jig;
mounting the height-controlling support jig, in which the electronic component is placed, in a corresponding position of the electronic component on the circuit board; and
soldering the electronic component onto the circuit board.
2 . The method for fixing the electronic component pin according to claim 1 , wherein a bending angle for the bending treatment of the pin is 90°±3°.
3 . The method for fixing the electronic component pin according to claim 2 , wherein a distance between a bending position for the bending treatment of the pin and a body of the electronic component is greater than or equal to 2.5 mm.
4 . The method for fixing the electronic component pin according to claim 1 , wherein the stress relieving forming is performed on the pin after being subjected to the bending treatment by a forming processing device.
5 . The method for fixing the electronic component pin according to claim 1 , wherein the performing stress relieving forming to the pin after being subjected to the bending treatment comprises processing the pin after being subjected to the bending treatment into a hook shape.
6 . The method for fixing the electronic component pin according to claim 1 , wherein the performing stress relieving forming to the pin after being subjected to the bending treatment comprises processing the pin after being subjected to the bending treatment into an S-shape.
7 . The method for fixing the electronic component pin according to claim 1 , wherein after the electronic component is soldered on the circuit board, a distance between a top plane surface of a body of the electronic component and the circuit board ranges from 7.80 mm to 8.20 mm.
8 . The method for fixing the electronic component pin according to claim 1 , wherein the height-controlling support jig comprises a bottom plate, a cover plate and a fastening screw; the cover plate is provided with a plurality of recesses, each of the plurality of recesses corresponds to one module, and a body of the electronic component is placed in the recess.
9 . The method for fixing the electronic component pin according to claim 8 , wherein a number of the recesses provided in the cover plate is determined according to deformation degrees of the bottom plate and the cover plate when the bottom plate and the cover plate are pressed.
10 . The method for fixing the electronic component pin according to claim 8 , wherein the height-controlling support jig is a two-module jig or a four-module jig, and two or four electronic components after being subjected to the stress relieving forming are placed in the two-module jig or the four-module jig.
11 . The method for fixing the electronic component pin according to claim 4 , wherein the performing stress relieving forming to the pin after being subjected to the bending treatment comprises processing the pin after being subjected to the bending treatment into a hook shape.
12 . The method for fixing the electronic component pin according to claim 4 , wherein the performing stress relieving forming to the pin after being subjected to the bending treatment comprises processing the pin after being subjected to the bending treatment into an S-shape.
13 . The method for fixing the electronic component pin according to claim 9 , wherein the height-controlling support jig is a two-module jig or a four-module jig, and two or four electronic components after being subjected to the stress relieving forming are placed in the two-module jig or the four-module jig.