IP Library Granted Patent US 12,593,117
Granted Patent B2
US 12,593,117 · App. 18/355,204 · Granted Mar 31, 2026

Imaging system lens mounting arrangement

Inventors: Pawel Hebda (Cracow, PL); Przemyslaw Antos (Skawina, PL); Arkadiusz Rafalowski (Brzezinka, PL); Rafal G. Ochala (Jedlicze, PL)
Assignee: Aptiv Technologies AG
H04N23/52G02B7/025H01R12/718H04N23/55
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Quick Facts
Patent No.
US 12,593,117
App. No.
18/355,204
Granted
Mar 31, 2026
Kind
B2
Abstract

According to the specification there is provided an imaging system that includes: an imaging device mounted on a PCB of the imaging system; a lens; and a lens holder. The imaging system further includes an electrically conducting element configured to provide an electrical grounding connection between the lens and the PCB. According to further aspects, arrangements of a conducting element for providing an electrical grounding of lens of an imaging system are provided.

Claims (37)

1 . An imaging system comprising:

an imaging device mounted on a printed circuit board (PCB) of the imaging system;

a lens;

a lens holder; and

an electrically conducting element configured to provide an electrical grounding connection between the lens and the PCB;

wherein:

the lens is attached to the lens holder at an interface between a first upper bearing surface of the lens and a second lower bearing surface of the lens holder;

the lens is attachable to the lens holder at an adhesive layer located between the bearing surfaces at a first interface portion;

the adhesive layer is non-conducting and configured to provide a stabilized coupling between lens and the lens holder for precision alignment of optically active components;

at least one recess is provided at a second interface portion between the first bearing surface and the second bearing surface; wherein the conducting element is configured for engagement with the bearing surfaces of each of the lens and the lens holder at least one corresponding recess to provide an electrically conducting connection between the lens and lens holder; and

the conducting element is resilient and of annular or c-shaped form, deformable for location in the recess.

2 . The imaging system of claim 1 , wherein:

the first interface portion and the second interface portions are arranged radially side by side, and

the adhesive layer is located at first interface portion, and the recess is located at the second interface portion.

3 . The imaging system of claim 1 , wherein the at least one recess is at least partially defined by the adhesive layer, and portions of the first and second bearing surfaces of the lens and lens holder adjacent to the adhesive layer, said bearing surfaces being spaced apart in a vertical direction by the adhesive layer located therebetween.

4 . The imaging system of claim 1 , wherein the at least one recess is at least partially defined by a groove mechanically formed in one or both of the bearing surfaces of the lens and lens holder.

5 . The imaging system of claim 1 , wherein the conducting element comprises a conducting adhesive or paste configured to be located in a conducting layer in the recess such that engagement surfaces of the conducting layer are in contact with corresponding portions of bearing surfaces of each of the lens and the lens holder at the recess to provide an electrically conducting connection between the lens and the lens holder.

6 . The imaging system of claim 1 , wherein the conducting element comprises:

a support configured in use for engagement with a corresponding bearing surface of the lens or the lens holder; and

one or more contact arms circumferentially spaced apart on the support and extending therefrom,

wherein each contact arm comprises an engagement surface, and

wherein each contact arm is resilient and biased in a direction inwardly relative to the support, such that in use when the support is located on externally on the lens or the lens holder, the engagement surface configured for engagement in a corresponding recess such that the conducting element is in contact with a corresponding bearing surface of each of the lens and the lens holder to provide an electrically conducting connection between the lens and the lens holder.

7 . The imaging system of claim 6 ,

wherein in use, the support of the conducting element is receivable at an external portion of the lens holder, and

wherein the one or more contact arms extend upwardly from the support in the direction of the lens.

8 . The imaging system of claim 6 ,

wherein in use, the support of the conducting element is receivable at an external portion of the lens, and

wherein the one or more contact arms extend downwardly from the support in the direction of the lens holder.

9 . The imaging system of claim 6 , wherein the conducting element comprises:

a support comprising a support wall having a first internal peripheral wall and a second external peripheral wall surface and extending between a first end and a second end with an opening therebetween, in a C-shaped form, the support configured to expand for locating externally on the lens and the lens holder near the interface,

wherein the internal peripheral wall comprises an engagement surface for engagement with corresponding portions of both the lens and the lens holder to provide an electrically conducting connection between the lens and the lens holder.

10 . The imaging system of claim 9 , wherein the engagement surface is arranged according to at least one of the following:

(i) wherein the engagement surface comprises one or more protrusions formed protruding inwardly relative to the engagement surface in the direction of the lens and lens holder, each protrusion being receivable in the recess;

(ii) wherein the engagement surface comprises one or more protrusions comprising a ridge arranged extending circumferentially around the internal peripheral wall, each protrusion being receivable in the recess;

(iii) wherein the engagement surface comprises a protrusion receivable in the recess at the interface; or

(iv) wherein the engagement surface is comprised of a metal and is electrically conducting.

11 . The imaging system of claim 6 , wherein the support is resilient and is deformable for locating on a body of the lens and/or the lens holder and is biased to engage with the body of the lens and/or the lens holder.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2024
From: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
To: APTIV TECHNOLOGIES AG
Reel/Frame 066551/0219 →
MERGER Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES (2) S.À R.L.
To: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
Reel/Frame 066566/0173 →
ENTITY CONVERSION Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES LIMITED
To: APTIV TECHNOLOGIES (2) S.À R.L.
Reel/Frame 066746/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2023
From: HEBDA, PAWEL; RAFALOWSKI, ARKADIUSZ; ANTOS, PRZEMYSLAW; OCHALA, RAFAL G.
To: APTIV TECHNOLOGIES LIMITED
Reel/Frame 064328/0275 →
Priority Claims (2)
GB 2210755 · Jul 22, 2022 · national
EP 23183744 · Jul 5, 2023 · regional
Continuity (1)
Related Publication 20240027878A1 · Jan 25, 2024
References Cited (15)
US 7422382B2 · Seo · 2008 [cited by applicant]
US 20190384055A1 · Rafalowski et al. · 2019 [cited by applicant]
US 20220019130A1 · Moehrle et al. · 2022 [cited by applicant]
US 20220159159A1 · Byrne et al. · 2022 [cited by applicant]
CN 111815807 · 2020 [cited by applicant]
CN 216905047 · 2022 [cited by applicant]
EP 3226051B1 · 2020 [cited by examiner]
JP 2010278678A · 2010 [cited by examiner]
KR 20210046369 · 2021 [cited by applicant]
KR 20210046369A · 2021 [cited by examiner]
WO 2008023894 · 2008 [cited by applicant]
WO 2022028248A1 · 2022 [cited by applicant]
FIT Database Translation of Primary Reference KR-20210046369-A (Year: 2025). [cited by examiner]
“Combined Search and Examination Report”, GB Application No. 2210755.1, Jan. 20, 2023, 11 pages. [cited by applicant]
Extended European Search Report regarding European Patent Application No. 23183744.4, dated Nov. 10, 2023. [cited by applicant]