IP Library Patent Application 18359455
Patent Application
App. No. 18/359,455

BUILD SUBSTRATE FOR DIRECTED ENERGY DEPOSITION ADDITIVE MANUFACTURING

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Quick Facts
Patent No.
US None
App. No.
18/359,455
Abstract

A build substrate for supporting an article during a directed energy deposition (DED) process includes a clad metal layer defining a build surface, where the article is fused to the build surface during deposition. The build substrate also includes a support substrate configured to support stresses and temperatures experienced during deposition. The support substrate defines an upper surface and a lower surface, and at least a portion of the upper surface of the support substrate is covered with the clad metal layer.

Claims (26)

1 . A build substrate for supporting an article during a directed energy deposition (DED) process, the build substrate comprising:

a clad metal layer defining the build surface, wherein the article is fused to the build surface during deposition; and

a support substrate configured to support stresses and temperatures experienced during deposition, wherein the support substrate defines an upper surface and a lower surface and at least a portion of the upper surface of the support substrate is covered with the clad metal layer.

2 . The build substrate of claim 1 , wherein the build substrate is constructed of a material having a melt temperature that is higher than a melt temperature of a build material, and wherein the article is constructed of the build material.

3 . The build substrate of claim 1 , wherein the build substrate is constructed of a material having a melt temperature that is higher than a degradation temperature of a build material, and wherein the article is constructed of the build material.

4 . The build substrate of claim 1 , wherein the clad metal layer is constructed of a metal that is soluble in a substance that the build material is insoluble within.

5 . The build substrate of claim 4 , wherein the article is constructed of a build material, and wherein the build material includes one or more of the following: titanium, stainless steel, aluminum, copper, nickel, Inconel, cobalt alloys, Zircalloy, tantalum, tungsten, niobium, molybdenum, and their alloys.

6 . The build substrate of claim 5 , wherein the build material is stainless steel, the clad metal layer is constructed of copper, and the support substrate is constructed of a glass-reinforced epoxy laminate material (FR4).

7 . The build substrate of claim 1 , wherein the support substrate is constructed of a porous material configured to promote the diffusion of a solvent to a back face of the clad metal layer.

8 . The build substrate of claim 7 , wherein the porous material is fritted glass.

9 . The build substrate of claim 1 , wherein only a portion of the upper surface of the support substrate is covered with the clad metal layer.

10 . The build substrate of claim 9 , wherein the clad metal layer is applied as a pattern upon the upper surface of the support substrate.

11 . The build substrate of claim 10 , wherein the pattern is a cross-hatched pattern or a dot-matrix pattern.

12 . The build substrate of claim 10 , wherein a partial bond exists between the build surface of the support substrate and the article.

13 . The build substrate of claim 10 , wherein the pattern results in between 25 to 75 percent of the upper surface of the support substrate being covered by the clad metal layer.

14 . The build substrate of claim 10 , wherein the clad metal layer is constructed of copper and the support substrate is constructed of a ceramic material.

15 . The build substrate of claim 1 , wherein the support substrate is soluble in water.

16 . The build substrate of claim 15 , wherein the support substrate is a water-soluble ceramic binder including either glass powder or fiber as a matrix material and potassium carbonate as a binder.

17 . The build substrate of claim 15 , wherein the thickness of the clad metal layer ranges from about 0.089 millimeters to about millimeters.

18 . A method of creating an article by a DED process, the method comprising:

depositing a build material by a nozzle upon a build substrate, wherein the build substrate supports the article during the DED process; and

fusing the article to a build surface, wherein the build surface is defined by a clad metal layer, and wherein the build substrate further includes a support substrate configured to support stresses and temperatures experienced during deposition, wherein the support substrate defines an upper surface and a lower surface and at least a portion of the upper surface of the support substrate is covered with the clad metal layer.

19 . The method of claim 18 , wherein the method further comprises:

once the DED process is complete, removing the article from the build substrate.

20 . The method of claim 18 , wherein the method further comprises:

once the DED process is complete, placing the build substrate in a solvent bath to dissolve the clad metal layer, wherein the article remains intact in the solvent bath.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jun 10, 2025
From: U.S. BANK TRUST COMPANY
To: NEXA3D INC.; NXT FACTORY INC.; NEXA3D APS
Reel/Frame 071534/0581 →
SECURITY INTEREST Recorded Nov 15, 2024
From: NEXA3D INC.; NXT FACTORY INC.; NEXA3D APS
To: U.S. BANK TRUST COMPANY
Reel/Frame 069381/0694 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2024
From: ESSENTIUM IPCO, LLC.
To: NEXA3D INC.
Reel/Frame 066339/0185 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2023
From: SWEENEY, CHARLES BRANDON
To: ESSENTIUM, INC.
Reel/Frame 065482/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2023
From: ESSENTIUM, INC.
To: ESSENTIUM IPCO, LLC
Reel/Frame 065491/0630 →