Interlayer heat sink for cooling system of an electronic card of a supercomputer
View Patent ↗An interlayer heat sink for a liquid cooling system for an electronic card, the interlayer heat sink including a cold inlet connector, a hot inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of the cooling block divides the flow of heat transfer fluid entering through the cold inlet connector into a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card by being conveyed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector, to convey the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector where it fuses with the heated-up flow in the lower part of the cooling block.
1 . An interlayer heat sink for a liquid cooling system for an electronic card, said electronic card comprising at least one electronic component, said liquid cooling system comprising a cold plate for receiving said interlayer heat sink, said cold plate being dimensioned to cover at least partly the electronic card and comprising a cooling circuit comprising channels in which a cold heat transfer fluid for supplying at least said interlayer heat sink circulates, and a discharge circuit comprising channels in which a hot heat transfer fluid that has heated up through the interlayer heat sink circulates, the interlayer heat sink comprising:
a cooling block comprising a lower part constituting a main heat exchange zone and an upper part to be connected to the cold plate,
a cold inlet connector configured to be fluidly connected to a cold outlet connector of an upstream heat sink and fluidly connected to the upper part of said cooling block such that said cooling block is supplied with the cold heat transfer fluid,
a hot inlet connector configured to be fluidly connected to a hot outlet connector of said upstream heat sink and fluidly connected to the upper part of said cooling block,
a hot outlet connector configured to be fluidly connected to a hot inlet connector of a downstream heat sink, and
a cold outlet connector configured to be fluidly connected to a cold inlet connector of said downstream heat sink,
wherein the upper part of the cooling block is configured to
divide a flow of heat transfer fluid entering through the cold inlet connector into
a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card and then conveyed to the hot outlet connector, and
a second flow, oriented directly towards the cold outlet connector,
convey heated-up heat transfer fluid flow received on the hot inlet connector directly to the hot outlet connector.
2 . The interlayer heat sink according to claim 1 , wherein the at least one electronic component is a processor, a voltage regulator, or a memory module.
3 . The interlayer heat sink according to claim 1 , wherein the cooling block is made of a heat-conducting material.
4 . A system for liquid cooling of an electronic card, said electronic card comprising at least one electronic component, said system comprising:
a cold plate and at least one assembly of heat sinks, the cold plate being configured to receive said at least one assembly of heat sinks, being dimensioned to at least partly cover the electronic card, and wherein said cold plate comprises
a cooling circuit comprising channels inside which a cold heat transfer fluid for supplying at least one of the heat sinks of said at least one assembly of heat sinks circulates, and
a discharge circuit comprising channels inside which a hot heat transfer fluid has heated up through at least one of the heat sinks of said at least one assembly of heat sinks circulates,
wherein each heat sink of said at least one assembly of heat sinks comprises a main heat exchange zone capable of bearing against one electronic component of the at least one electronic component,
wherein each assembly of heat sinks of the at least one assembly of heat sinks comprises at least one interlayer heat sink an inlet heat sink, and an outlet heat sink,
wherein each interlayer heat sink of said at least one interlayer heat sink comprises
a cooling block comprising a lower part constituting a main heat exchange zone and an upper part to be connected to the cold plate,
a cold inlet connector configured to be fluidly connected to a cold outlet connector of an upstream heat sink and fluidly connected to the upper part of said cooling block such that said cooling block is supplied with the cold heat transfer fluid,
a hot inlet connector configured to be fluidly connected to a hot outlet connector of said upstream heat sink and fluidly connected to the upper part of said cooling block,
a hot outlet connector configured to be fluidly connected to a hot inlet connector of a downstream heat sink, and
a cold outlet connector configured to be fluidly connected to a cold inlet connector of said downstream heat sink,
wherein the upper part of the cooling block is configured to
divide a flow of heat transfer fluid entering through the cold inlet connector into
a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card and then conveyed to the hot outlet connector, and
a second flow, oriented directly towards the cold outlet connector,
convey heated-up heat transfer fluid flow received on the hot inlet connector directly to the hot outlet connector,
wherein said inlet heat sink comprises
a cooling block comprising a lower part constituting a main heat exchange zone and an upper part to be connected to the cold plate,
a cold inlet connector fluidly connected to the upper part of said cooling block and receiving an inlet tube of the cooling circuit such that said cooling block is supplied with heat transfer fluid from the cold plate,
a hot outlet connector,
a cold outlet connector,
wherein the upper part of the cooling block is configured to divide a flow of heat transfer fluid entering through the cold inlet connector into a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card and then conveyed to the hot outlet connector, and a second flow, oriented directly towards the cold outlet connector,
wherein said inlet heat sink comprises
a cooling block comprising a lower part constituting a main heat exchange zone and an upper part to be connected to the cold plate,
a cold inlet connector fluidly connected to the upper part of said cooling block and receiving a connecting tube of the cooling circuit such that said cooling block is supplied with heat transfer fluid from the cold plate through the inlet heat sink,
a hot inlet connector fluidly connected to the upper part of said cooling block and which is for receiving a connecting tube of a heated-up flow of the heat transfer fluid,
a hot outlet connector, the upper part of the cooling block being configured, on one hand, to convey the heated-up flow of heat transfer fluid entering through the cold inlet connector to the lower part of the cooling block so as to collect heat generated by the electronic card by being conveyed to the hot outlet connector, and, on another hand, to convey the heated-up flow of heat transfer fluid received on the hot inlet connector directly to the hot outlet connector,
wherein the hot inlet connector of the each interlayer heat sink is fluidly connected to the cold outlet connector of the inlet heat sink,
wherein the hot inlet connector of the each interlayer heat sink is fluidly connected to the hot outlet connector of the inlet heat sink,
wherein the hot outlet connector of the each interlayer heat sink is fluidly connected to the hot inlet connector of the outlet heat sink,
wherein the cold outlet connector of the each interlayer heat sink is fluidly connected to the cold inlet connector of the outlet heat sink.
5 . The system according to claim 4 , wherein
the hot outlet connector of the inlet heat sink is connected to the hot inlet connector of the each interlayer heat sink by one or more of
a flexible connecting tube, and
a rectilinear connecting tube,
the cold outlet connector of the inlet heat sink is connected to the cold inlet connector of the each interlayer heat sink through one or more of
a flexible connecting tube, and
a rectilinear connecting tube.
6 . The system according to claim 4 , wherein the at least one assembly of heat sinks comprises a plurality of assemblies of heat sinks arranged parallel to each other.
7 . The system according to claim 4 , wherein the inlet tube of said inlet heat sink is flexible.
8 . The system according to claim 4 , wherein an outlet tube of said outlet heat sink is flexible.
9 . The system according to claim 4 , wherein the each interlayer heat sink is connected to one or more of the inlet heat sink and the outlet heat sink via one or more of
flexible connecting tubes, and
rectilinear connecting tubes.
10 . A method for managing a flow of heat transfer fluid in an interlayer heat sink for a liquid cooling system for an electronic card, said electronic card comprising at least one electronic component, said liquid cooling system comprising a cold plate that receives said interlayer heat sink, said cold plate being dimensioned to cover at least partly the electronic card and comprising a cooling circuit comprising channels inside which a cold heat transfer fluid for supplying at least said interlayer heat sink circulates, and a discharge circuit comprising channels inside which a hot heat transfer fluid that has heated up through the interlayer heat sink circulates,
wherein said interlayer heat sink comprises
a cooling block comprising a lower part constituting a main heat exchange zone and an upper part to be connected to the cold plate,
a cold inlet connector configured to be fluidly connected to a cold outlet connector of an upstream heat sink and fluidly connected to the upper part of said cooling block such that said cooling block is supplied with the cold heat transfer fluid,
a hot inlet connector configured to be fluidly connected to a hot outlet connector of said upstream heat sink and fluidly connected to the upper part of said cooling block,
a hot outlet connector configured to be fluidly connected to a hot inlet connector of a downstream heat sink, and
a cold outlet connector configured to be fluidly connected to a cold inlet connector of said downstream heat sink;
said method comprising:
supplying the cold inlet connector with heat transfer fluid from the cold plate,
dividing a flow of heat transfer fluid entering through the cold inlet connector into
a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card and then conveyed to the hot outlet connector, and
a second flow, oriented directly to the cold outlet connector,
supplying the hot inlet connector with a flow of heated-up heat transfer fluid,
conveying the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector where it fuses with heated-up flow in the lower part of the cooling block.