Granted Patent B2

US 12,388,042 · App. 18/370,150 · Granted Aug 12, 2025

Inventors: Angelo Gulino (Cranbury, NJ); Bogdan Bankiewicz (Philadelphia, PA); Oscar Khaselev (Monmouth Junction, NJ); Anna Lifton (Bridgewater, NJ); Michael T. Marczi (Chester, NJ); Girard Sidone (Bordentown, NJ); Paul Salerno (Bridgewater, NJ); Paul J. Koep (Madison, NJ)

Assignee: Alpha Assembly Solutions Inc.

H01L24/29B23K35/262B23K35/302C22C13/00H01L24/83B23K2101/42H01L2224/29209H01L2224/29211H01L2224/29216H01L2224/29239H01L2224/29247H01L2224/29311H01L2224/29324H01L2224/29339H01L2224/29347H01L2224/29355H01L2224/29364H01L2224/29369H01L2224/83815H01L2924/01013H01L2924/01028H01L2924/01029H01L2924/01046H01L2924/01047H01L2924/01049H01L2924/0105H01L2924/01078H01L2924/01082H01L2924/014

Abstract

Claims (26)

1. A solder material comprising:

a solder, and

a thermal conductivity modifying component, the thermal conductivity modifying component being in the form of a wire,

wherein:

the solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K,

the solder material is in the form of a solder preform,

the solder comprises tin,

the thermal conductivity modifying component comprises tin plated copper, and

the solder material comprises between about 40 wt. % and about 90 wt. % of the solder and about 60 wt. % to about 10 wt. % of the thermal conductivity modifying component.

2. The solder material according to claim 1 , wherein the wire comprises a plurality of wires that are used in parallel and the parallel wires are packed close together.

3. The solder material according to claim 1 , wherein the wire is embedded in the solder.

4. The solder material according to claim 1 , wherein the solder has a thermal conductivity of between about 20 and about 70 W/m-K.

5. The solder material according to claim 1 , wherein the solder has a thermal conductivity of between about 19 and about 80 W/m-K.

6. The solder material according to claim 1 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 100 W/m-K.

7. The solder material according to claim 6 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 200 W/m-K.

8. The solder material according to claim 7 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 300 W/m-K.

9. The solder material according to claim 8 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 400 W/m-K.

10. The solder material according to claim 1 , wherein the solder material has a bulk thermal conductivity of between about 80 and about 110 W/m-K.

11. The solder material according to claim 1 , wherein the diameter of the wire is greater than 5 microns, greater than 25 microns, or greater than 50 microns.

12. A solder joint comprising the solder material of claim 1 .

13. The solder joint according to claim 12 , wherein the solder joint is rectangular and the wire is oriented parallel to a shorter dimension of the rectangular solder joint, wherein the wires create a shorter path for gases to escape.

14. A method of making a solder joint between a substrate and a component, the method comprising:

applying the solder material of claim 1 to a substrate;

disposing a component on the solder material; and

reflowing the solder material to create the solder joint between the substrate and the component.

15. The method of claim 14 , wherein reflowing the solder material is carried out in a vacuum oven.

Assignments (2)

Continuity (3)

References Cited (17)