WAFER SCALE ENHANCED GAIN ELECTRON BOMBARDED CMOS IMAGER
An apparatus, system and method is provided for producing stacked wafers containing an array of image intensifiers that can be evacuated on a wafer scale. The wafer scale fabrication techniques, including bonding, evacuation, and compression sealing concurrently forms a plurality of EBCMOS imager anodes with design elements that enable high voltage operation with optional enhancement of additional gain via TMSE amplification. The TMSE amplification is preferably one or more multiplication semiconductor wafers of an array of EBD die placed between a photocathode within a photocathode wafer and an imager anode that is preferably an EBCMOS imager anode bonded to or integrated within an interconnect die within an interconnect wafer.
1 . A method of forming an image intensifier, comprising:
coupling a plurality of imager anodes to corresponding electrically isolated sets of conductive traces formed across an interconnect wafer;
aligning a plurality of openings within an insulative spacer wafer with corresponding said plurality of imager anodes;
vacuum sealing a plurality of photocathodes within a photocathode wafer over the corresponding plurality of imager anodes while maintaining the corresponding plurality of openings around and between each of the plurality of imager anodes and the corresponding plurality of photocathodes; and
dicing perpendicular to the parallel planes formed by the vacuum sealed and spaced interconnect wafer and photocathode wafer, and between the plurality of openings, to produce the image intensifier from among a plurality of concurrently produced image intensifiers.
2 . The method of claim 1 , wherein coupling comprises:
fabricating into the interconnect wafer a plurality of complementary metal oxide semiconductor (CMOS) sensors coupled to the electrically isolated sets of conductive traces; and
fabricating into the plurality of CMOS sensors a plurality of primary electron multipliers spaced from the plurality of photocathodes.
3 . The method of claim 1 , wherein coupling comprises:
bonding onto the electrically isolated sets of conductive traces of the interconnect wafer a plurality of complementary metal oxide semiconductor (CMOS) sensors formed on an imager anode wafer; and
fabricating in the imager anode wafer a primary electron multiplier on a surface of the imager anode wafer between the CMOS sensors and spaced from the plurality of photocathodes.
4 . The method of claim 1 , wherein aligning comprises:
arranging the plurality of openings a spaced distance around corresponding said plurality of imager anodes while abutting the insulative spacer against the interconnect wafer.
5 . The method of claim 1 , wherein vacuum sealing comprises evacuating below atmospheric pressure the plurality of openings at the same time.