Process for joining overlapping thermoplastic membrane components
A method of joining overlapping thermoplastic membrane components in which a first thermoplastic membrane component and a second thermoplastic membrane component are positioned in overlapping relationship between a pair of complementary molding surfaces, with at least one of the complementary molding surfaces being defined by an electrically conductive metal susceptor. Heat is generated in the metal susceptor and transferred by thermal conduction from the metal susceptor to overlapping portions of the first and second thermoplastic membrane components to locally melt and coalesce at least a portion of the thermoplastic material of the first thermoplastic membrane component and at least a portion of the thermoplastic material of the second thermoplastic membrane component. The molten thermoplastic material of the first and second thermoplastic membrane components forms a zone of coalesced thermoplastic material that, upon cooling, forms a solid weld joint that fusion welds the first and second thermoplastic membrane components together.
1. An apparatus for joining overlapping thermoplastic membrane components using an indirect induction welding technique, the apparatus comprising:
first and second forms having complementary molding surfaces configured to receive overlapping thermoplastic membranes therebetween, wherein the first form comprises a male form including a body having an annular electrically conductive metal susceptor extending around the body of the male form, and the second form comprising a cylindrical female form, the second form configured to be disposed about at least a portion of the first form; and
an electrically conductive coil positioned about the second female form and adjacent the metal susceptor.
2. The apparatus set forth in claim 1 wherein the male form defines a first hole configured to receive a conduit and a second hole configured to receive a conduit, wherein the first and second holes are connected by an internal cooling passage configured to receive a cooling medium.
3. The apparatus as set forth in claim 1 wherein the complementary molding surface of the first form is defined by the metal susceptor.
4. The apparatus as set forth in claim 3 wherein the body of the first form comprises an electrically insulating material.
5. The apparatus as set forth in claim 4 wherein the second form comprises an electrically insulating material.
6. The apparatus as set forth in claim 3 wherein the metal susceptor comprises a non-stick surface.