FLUORINE SUBSTITUTED ETHERS AND COMPOSITIONS, METHODS AND USES INCLUDING SAME
The fluoroether 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane (“HFE-347mcf”) may be used as a refrigerant and/or heat transfer composition, such as in single phase and two phase cooling systems, and a method of heating and/or cooling an electronic component or device includes providing a heat transfer fluid comprising at least about 10% by weight of 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane, and transferring heat between the electronic component and the heat transfer fluid. The fluoroether 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane may be synthesized by reacting 2,2,3,3,3-pentafluoro-1-propanol with chlorodifluoromethane (R-22).
1 . A method of providing heat transfer to and/or from an electronic component, article and/or device while the device is operating comprising:
providing a heat transfer composition comprising at least about 10% by weight of 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane; and
contacting the heat transfer composition with the electronic component, article and/or device while it is in operation to cool the electronic component, article and/or device.
2 . The method of claim 1 , wherein the heat transfer composition has a dielectric constant less than about 5 at 20 GHz.
3 . The method of claim 2 , wherein the heat transfer composition has a dielectric constant of about 3.4 at 20 GHz.
4 . The method of claim 1 , wherein the heat transfer composition has a boiling point of from about 35° C. to about 80° C.
5 . The method of claim 4 , wherein the heat transfer composition has a boiling point of about 46° C.
6 . The method of claim 1 , wherein the heat transfer composition has a global warming potential (GWP) of about 500 or less.
7 . The method of claim 1 , wherein the heat transfer composition is non-flammable.
8 . The method of claim 1 , wherein the heat transfer composition comprises at least about 50% by weight of 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane.
9 . The method of claim 1 , wherein the electronic device is selected from a data center and a battery.
10 . A method of heating and/or cooling an electronic component, article and/or device comprising:
(a) providing a refrigerant comprising at least about 10% by weight of 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane;
(b) immersing the electronic component, article and/or device while the electronic, article and/or device is operating in the refrigerant; and
(c) transferring heat between the immersed electronic component, article and/or device and the refrigerant.
11 . The method of claim 10 , wherein the refrigerant has a dielectric constant less than about 5 at 20 GHz.
12 . The method of claim 11 , wherein the refrigerant has a dielectric constant of about 3.4 at 20 GHz.
13 . The method of claim 10 , wherein the refrigerant has a boiling point of from about 35° C. to about 80° C.
14 . The method of claim 13 , wherein the refrigerant has a boiling point of about 46° C.
15 . The method of claim 10 , wherein the refrigerant has a global warming potential (GWP) of about 500 or less.
16 . The method of claim 10 , wherein the refrigerant is non-flammable.
17 . The method of claim 10 , wherein the refrigerant comprises at least about 50% by weight of 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane.
18 . The method of claim 10 , wherein the electronic device is selected from a data center and a battery.
19 . A method for synthesizing 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane, comprising reacting 2,2,3,3,3-pentafluoro-1-propanol with chlorodifluoromethane in the presence of a base.
20 . The method of claim 19 , further comprising at least one of the following:
the reacting step is in the presence of an organic solvent selected from diglyme, dioxane, and a combination thereof;
the base is NaOH; and
the reacting step is carried out at a temperature from about 10° C. to about 45° C.