MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

1 . An ultrasound device, comprising:

ultrasonic transducer cavities;

a membrane comprising a silicon layer that seals the ultrasonic transducer cavities;

electrode regions configured to control vibration of the membrane; and

a complementary metal-oxide-semiconductor (CMOS) substrate including integrated circuitry that is electrically coupled to the electrode regions,

wherein the ultrasonic transducer cavities are disposed between the membrane and the integrated circuitry along a vertical direction of the ultrasound device.

2 . The ultrasound device of claim 1 , further comprising:

isolation regions disposed between the electrode regions of adjacent ultrasound transducer cavities when viewed in the vertical direction,

wherein the isolation regions are doped.

3 . The ultrasound device of claim 1 , further comprising:

an embedded electrical contact between the CMOS substrate and an engineered substrate that includes the ultrasonic transducer cavities,

wherein ends of the embedded electrical contact directly connect:

a bond point between the CMOS substrate and the engineered substrate; and

an electrical contact disposed on the membrane.

4 . The ultrasound device of claim 3 ,

wherein the embedded electrical contact protrudes though the engineered substrate along the vertical direction.

5 . The ultrasound device of claim 4 ,

wherein the embedded electrical contact protrudes though the membrane along the vertical direction.