Granted Patent B2

US 12,269,635 · App. 18/385,215 · Granted Apr 8, 2025

Inventors: Jeffrey S. Bailey (Cumming, GA); Bobby O. Archer (Lebanon, MO); Kimberly Hawkes (Powell, OH)

Assignee: Remedi Technology Holdings, LLC

B65B5/105B25J15/0014B25J15/0253B65B35/36B65B35/54B65G47/08B65G47/80B65G47/90G07F17/0092G16H20/13B65G47/28B65G47/5113B65G2812/02613

Abstract

Claims (14)

1. A package insert module, comprising:

a turntable having a circular surface and rotatable about a turntable axis; and

an insert assembly mounted on the circular surface of the turntable and off-set from an axis bisecting the circular surface, the insert assembly including a finger arrangement for offloading a plurality of packages, the finger arrangement including a lower finger assembly and an upper finger assembly, wherein

the upper finger assembly is moveable relative to the lower finger assembly in a direction parallel to the turntable axis to clamp and release the packages between the upper finger assembly and the lower finger assembly,

the upper finger assembly and the lower finger assembly is moveable in a direction orthogonal to the turntable axis, and

every finger of the upper finger assembly is aligned directly above an inner finger of the lower finger assembly.

2. The package insert module according to claim 1 , wherein an array of the plurality of the packages includes at least four parallel rows, and

wherein the lower finger assembly includes five spaced and generally parallel fingers such that an outer two of the fingers are positioned on an outside of a first row and a fourth row of the four parallel rows and an inner three of the fingers are positioned between adjacent packages in the array.

3. The package insert module according to claim 2 , wherein the upper finger assembly includes three spaced and generally parallel fingers aligned with the inner three of the fingers of the lower finger assembly such that, when the fingers of the upper finger assembly are positioned over the array of the plurality of the packages, the fingers of the upper finger assembly are superimposed onto overlapping edges of the packages.

4. The package insert module according to claim 1 , wherein the upper finger assembly is initially spaced from the lower finger assembly to insert the array of the plurality of the packages between the upper finger assembly and lower finger assembly.

5. The package insert module according to claim 1 , wherein the insert assembly includes a lower mounting block mounted atop the turntable and an upper mounting block mounted on the lower mounting block, and

wherein the finger arrangement is mounted to the upper mounting block.

6. The package insert module according to claim 1 , wherein the turntable is configured to rotate the finger arrangement between a first position to offload the plurality of the packages from the nest and a second position to offload the plurality of the packages to a bag formation module.

7. The package insert module according to claim 1 , wherein each package of the plurality of the packages includes a unit dose of medicine.

Assignments (2)

Continuity (6)

References Cited (139)