APPARATUS FOR APPLYING THERMAL ENERGY TO A RECEPTACLE AND DETECTING AN EMISSION SIGNAL FROM THE RECEPTACLE
An apparatus comprises a thermally conductive receptacle holder including a plurality of receptacle wells configured to receive receptacles, a plurality of optical fibers having first and second ends, wherein each first end is in optical communication with one of the receptacle wells and each second end is in optical communication with an excitation signal source and/or an emission signal detector, one or more thermal elements positioned proximal to the receptacle holder for altering the temperature of the receptacle holder, a heat sink in thermal communication with the receptacle holder, and one or more thermal devices disposed within the heat sink for pre-heating the heat sink.
1 . An apparatus comprising:
a thermally conductive receptacle holder including a plurality of receptacle wells, wherein each receptacle well is configured to receive a receptacle therein;
a plurality of optical fibers, each optical fiber having first and second ends, wherein the first end is in optical communication with one of the receptacle wells, and the second end is in optical communication with at least one of an excitation signal source and an emission signal detector;
one or more thermal elements positioned proximal to the receptacle holder for altering a temperature or temperatures of the receptacle holder;
a heat sink in thermal communication with the receptacle holder; and
one or more thermal devices disposed within the heat sink for pre-heating the heat sink.
2 . The apparatus of claim 1 , wherein each receptacle well includes a through-hole extending from an inner surface of the receptacle well to an outer surface of the receptacle holder, and wherein the first end of each optical fiber is disposed outside or within, or extends through, a corresponding through-hole in each receptacle well.
3 . The apparatus of claim 2 , wherein the first end of each optical fiber is moveable within the corresponding through-hole relative to the surface of the receptacle well
4 . The apparatus of claim 1 , wherein the heat sink comprises a thermally conductive support including a portion positioned proximal to a side surface of the receptacle holder, wherein the one or more thermal elements are positioned between the support and the receptacle holder.
5 . The apparatus of claim 1 , wherein each of the one or more thermal elements is positioned proximal to a side surface of the receptacle holder.
6 . The apparatus of claim 1 , wherein each of the one or more thermal elements comprises a thermoelectric device.
7 . The apparatus of claim 6 , wherein each of the one or more thermal elements comprises a Peltier device.
8 . The apparatus of claim 1 , wherein each of the one or more thermal devices comprises a cartridge heater embedded in the heat sink.
9 . The apparatus of claim 1 , further comprising one or more thermistors in thermal contact with one or more portions of the heat sink for monitoring a temperature of the heat sink.
10 . The apparatus of claim 1 , wherein the heat sink comprises a plurality of spaced-apart fins for dissipating heat from the heat sink.
11 . The apparatus of claim 10 , further comprising a thermally conductive support in contact with the heat sink, wherein the support includes a portion positioned proximal to a side surface of the receptacle holder, and wherein the one or more thermal elements are positioned between the support and the receptacle holder.
12 . The apparatus of claim 1 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is at or below a nucleic acid annealing temperature.
13 . The apparatus of claim 12 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is above about 20° C. and at or below about 64° C.
14 . The apparatus of claim 1 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is between an annealing temperature and an elongation/extension temperature.
15 . The apparatus of claim 14 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is between about 50° C.-64° C. and about 72° C.-80° C.
16 . The apparatus of claim 1 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is between an annealing temperature and a melting/denaturation temperature.
17 . The apparatus of claim 16 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is between about 50° C.-64° C. and about 94° C.-98° C.
18 . The apparatus of claim 1 , wherein the one or more thermal devices are configured to pre-heat the heat sink to a temperature that is between about 45° C. and about 50°.