Wafer cleaning brush
A wafer cleaning brush includes: a brush including a hollow formed inside the brush and through which a cleaning liquid is discharged, and a plurality of protrusions formed on an outer surface of the brush; and a film surrounding the outer surface of the brush, wherein the film includes a plurality of holes through which the protrusions pass.
1. A wafer cleaning brush comprising:
a brush including a hollow formed inside the brush and through which a cleaning liquid is discharged, and a plurality of protrusions formed on an outer surface of the brush; and
a film surrounding the outer surface of the brush,
wherein the film includes a plurality of holes through which the protrusions pass,
wherein a guide having a shape that protrudes inward than other regions is disposed on an inner surface of the film, which faces the outer surface of the brush.
2. The wafer cleaning brush of claim 1 , wherein a material of the film includes various materials such as polyethylene terephthalate (PET) or polyvinyl chloride (PVC).
3. The wafer cleaning brush of claim 1 , wherein a sectional area of the protrusion is smaller than a sectional area of the hole.
4. The wafer cleaning brush of claim 1 , further comprising a nonwoven fabric disposed on a surface or an inner side of the film.
5. A wafer cleaning brush comprising:
a brush including a hollow formed inside the brush and through which a cleaning liquid is discharged, and a plurality of protrusions formed on an outer surface of the brush; and
a film surrounding the outer surface of the brush,
wherein the film includes a plurality of holes through which the protrusions pass,
wherein the film includes an inclined surface, and
the inclined surface is disposed on an outer side of the hole.
6. The wafer cleaning brush of claim 5 , wherein the inclined surface has a shape in which a distance to the outer surface of the brush gradually becomes farther as the hole becomes closer.