Semiconductor device, semiconductor component and display panel including the same
The present disclosure provides a semiconductor device including a semiconductor structure, a first metal element-containing structure, and a layer. The semiconductor structure includes a first semiconductor layer having a first material, a second semiconductor layer, an active region between the first semiconductor layer and the second semiconductor layer. The first metal element-containing structure is located on the semiconductor structure and includes a first metal element. The layer has a second material and a second metal element and is located between the first semiconductor layer and the first metal element-containing structure. The first material has a conduction band edge Ec and a valence band edge Ev, and the second material has a work function WF 1 , when the first semiconductor layer is of an n-type conductivity, the work function WF 1 fulfills WF 1 <(Ec+Ev)/2, and when the first semiconductor layer is of a p-type conductivity, the work function WF 1 fulfills WF 1 >(Ec+Ev)/2.
1. A semiconductor device, comprising:
a semiconductor structure including a first semiconductor layer having a first material, a second semiconductor layer, an active region between the first semiconductor layer and the second semiconductor layer;
a first metal element-containing structure located on the semiconductor structure and comprising a first metal element; and
a layer having a second material and a second metal element, located between the first semiconductor layer and the first metal element-containing structure;
wherein the first material has a conduction band edge Ec and a valence band edge Ev, and the second material has a work function WF 1 , when the first semiconductor layer is of an n-type conductivity, the work function WF 1 fulfills WF 1 <(Ec+Ev)/2, and when the first semiconductor layer is of a p-type conductivity, the work function WF 1 fulfills WF 1 >(Ec+Ev)/2.
2. The semiconductor device of claim 1 , wherein the layer physically contacts the first metal element-containing structure and the first semiconductor layer.
3. The semiconductor device of claim 1 , wherein the first metal element has a second work function WF 2 , the layer is of an n-type conductivity and the second work function WF 2 is greater than the first work function WF 1 .
4. The semiconductor device of claim 1 , wherein the first metal element has a second work function WF 2 , the layer is of a p-type conductivity, and the first work function WF 1 is greater than the second work function WF 2 .
5. The semiconductor device of claim 1 , further comprising a third semiconductor layer between the active region and the first semiconductor layer, wherein the second semiconductor layer, the active region and the third semiconductor layer forms a first mesa structure, and the first semiconductor layer forms a second mesa structure.
6. The semiconductor device of claim 5 , wherein the first mesa structure has a first width W 1 and the second mesa structure has a second width W 2 larger than the first width W 1 .
7. The semiconductor device of claim 5 , further comprising an insulating structure located on the semiconductor structure and having a first opening, and a first electrode pad which covers a portion of the insulating structure and fills the first opening.
8. The semiconductor device of claim 5 , wherein the first electrode pad covers a portion of the first mesa structure.
9. The semiconductor device of claim 5 , wherein the first mesa structure has a first side surface, a second side surface and a first top surface, the layer covers and physically contacts the first side surface, the second side surface and the first top surface.
10. The semiconductor device of claim 1 , further comprising a second metal element-containing structure located between the insulating structure and the semiconductor structure and comprising a second metal element.
11. The semiconductor device of claim 10 , wherein the layer physically contacts the second metal element-containing structure, and is not overlapped with the second metal element-containing structure in a vertical direction.
12. The semiconductor device of claim 11 , wherein the second metal element-containing structure has a third side surface, a fourth side surface and a second top surface, and the layer covers a portion of the second top surface, a third side surface, and a fourth side surface.
13. The semiconductor device of claim 1 , further comprising an insulating structure located on the semiconductor structure, wherein the semiconductor structure has a total thickness t 0 , and the insulating structure has a thickness t 1 less than 15% of the total thickness t 0 .
14. The semiconductor device comprising:
a first semiconductor layer having a first portion and a second portion;
a first mesa disposed on the first portion without being on the second portion, the first mesa having a side surface and a top surface;
a layer covering the first portion of the first semiconductor layer, the side surface and the top surface of the first mesa, and electrically connected to the first semiconductor layer;
a first metal element-containing layer disposed on the second portion and directly contacting the layer; and
a first electrode pad disposed on the second portion and directly contacting the first metal element-containing layer.
15. The semiconductor device of claim 14 , wherein the first metal element-containing layer has a first area and the first electrode pad has a second area in a top view, and the first area is smaller than the second area.
16. The semiconductor device of claim 15 , wherein the layer has a third area in the top view, and the first area is smaller than the third area.
17. The semiconductor device of claim 14 , further comprising an insulating structure located on the layer and having a first opening.
18. The semiconductor device of claim 14 , further comprising a second metal element-containing layer disposed on the first mesa and the layer covers a portion of the second metal element-containing layer.
19. A semiconductor component, comprising:
a bonding substrate;
a plurality of semiconductor devices located on the bonding substrate; and
an adhesive structure between the bonding substrate and the plurality of semiconductor devices;
wherein one of the plurality of semiconductor devices is the semiconductor device of claim 1 , the bonding substrate includes a first area covered by the adhesive structure and a second area not covered by the adhesive structure.
20. A display panel, comprising:
a carrier substrate; and
a plurality of pixel units on the carrier substrate;
wherein one of the plurality of pixel units comprises the semiconductor device of claim 1 .