Solar cell wafer wire bonding system
A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
1. A solar cell wafer wire bonding system comprising:
a movable platform that supports a solar cell wafer;
a plurality of feed tubes, each feed tube of the plurality of feed tubes being configured to receive a wire of a plurality of wires;
for each feed tube of the plurality of feed tubes, a soldering heater tip that is disposed in a vicinity of an exit end of the feed tube, the heater tip being configured to solder a wire drawn through the feed tube to the solar cell wafer; and
for each feed tube of the plurality of feed tubes, a cutter that is configured to cut a wire drawn through the feed tube.
2. The system of claim 1 , further comprising:
for each feed tube of the plurality of feed tubes, a plurality of rollers that contact a wire in the feed tube.
3. The system of claim 2 , wherein the plurality of rollers includes a pair of opposing rollers.
4. The system of claim 3 , wherein the pair of opposing rollers includes:
a first roller; and
a second roller, the second roller including a groove that forms a space for accepting a wire with the first roller.
5. The system of claim 4 , wherein the first roller is a rubber roller and the second roller has V-groove.
6. The system of claim 1 , wherein the plurality of feed tubes comprises capillary tubes.
7. The system of claim 1 , wherein the heater tip comprises a pulse heater.
8. The system of claim 1 , wherein the cutter is disposed adjacent to the heater tip.