Optoelectronic device and method for manufacturing the same
An optoelectronic device includes a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; a first insulating layer on the second semiconductor layer and including a plurality of first openings exposing the first semiconductor layer, wherein the first openings include a first group and a second group; a third electrode on the first insulating layer and including a first extended portion and a second extended portion, wherein the first extended portion and the second extended portion are respectively electrically connected to the first semiconductor layer through the first group of the first openings and the second group of the first openings, and wherein the number of the first group of the first openings is different from the number of the second group of the first openings; and a plurality of fourth electrodes on the second insulating layer and electrically connected to the second semiconductor layer, wherein in a top view of the optoelectronic device, the first extended portion is located between the fourth electrodes.
1. An optoelectronic device, comprising:
a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer, wherein in a top view of the optoelectronic device, the first semiconductor layer comprises multiple boundaries and a peripheral frame region, wherein the peripheral frame region is not covered by the active layer and the second semiconductor layer, and wherein the peripheral frame region is adjacent to the multiple boundaries and encircles the second semiconductor layer;
a first insulating layer formed on the semiconductor stack and comprising a plurality of first openings exposing the first semiconductor layer on the peripheral frame region;
a third electrode formed on the first insulating layer and comprising a first extended portion and a plurality of second extended portions connected to the first extended portion, wherein the first extended portion is formed on the second semiconductor layer, the plurality of second extended portions is formed on the peripheral frame region and electrically connected to the first semiconductor layer through the plurality of first openings, and the semiconductor stack comprises a plurality of concave parts respectively opposite to the plurality of second extended portions of the third electrode in the top view of the optoelectronic device;
a second insulating layer formed on the first insulating layer and comprising one or a plurality of second openings formed on the second semiconductor layer; and
one or a plurality of fourth electrodes formed on the second insulating layer and electrically connected to the second semiconductor layer through the one or the plurality of second openings.
2. The optoelectronic device of claim 1 , wherein the plurality of second openings is covered by the one or a plurality of fourth electrodes.
3. The optoelectronic device of claim 1 , wherein the semiconductor stack comprises multiple internal regions not covered by the active layer and the second semiconductor layer, and the multiple internal regions are surrounded by the peripheral frame region.
4. The optoelectronic device of claim 3 , wherein the plurality of first openings comprises a first group on the multiple internal regions and a second group on the peripheral frame region.
5. The optoelectronic device of claim 4 , wherein the first extended portion is electrically connected to the first semiconductor layer through the first group of the plurality of first openings on the multiple internal regions.
6. The optoelectronic device of claim 4 , wherein in the top view of the optoelectronic device, the first group of the plurality of first openings comprises a first total area and the second group of the plurality of first openings comprises a second total area, and the first total area is different from the second total area.
7. The optoelectronic device of claim 6 , wherein the first total area is larger than the second total area.
8. The optoelectronic device of claim 1 , wherein in the top view of the optoelectronic device, the first extended portion comprises a portion formed between the plurality of fourth electrodes.
9. The optoelectronic device of claim 1 , wherein in the top view of the optoelectronic device, the multiple boundaries comprise a first boundary and a second boundary connected to the first boundary, the plurality of second extended portions comprises a first amount of contact portions on the first boundary and a second amount of contact portions on the second boundary, and the first amount of contact portions is larger than the second amount of contact portions.
10. The optoelectronic device of claim 1 , wherein in the top view of the optoelectronic device, the first extended portion comprises a convex shape corresponding to a concave shape of the one or the plurality of fourth electrodes.
11. The optoelectronic device of claim 1 , wherein the third electrode comprise a projected area on the first semiconductor layer larger than that of the one or the plurality of fourth electrodes on the first semiconductor layer.
12. The optoelectronic device of claim 1 , wherein a ratio of a projected area of the third electrode on the first semiconductor layer and that of the one or the plurality of fourth electrodes on the first semiconductor layer is between 110-120%.
13. The optoelectronic device of claim 1 , wherein the first insulating layer comprises a Distributed Bragg Reflector (DBR) structure.
14. The optoelectronic device of claim 1 , wherein a distance between a boundary of the third electrode and a boundary of the one fourth electrode is between 50-200 μm.
15. A light-emitting module, comprising:
a carrier;
an optoelectronic device formed on the carrier, comprising
a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer, wherein in a top view of the optoelectronic device, the first semiconductor layer comprises multiple boundaries and a peripheral frame region, wherein the peripheral frame region is not covered by the active layer and the second semiconductor layer, and wherein the peripheral frame region is adjacent to the multiple boundaries and encircles the second semiconductor layer;
a first insulating layer formed on the semiconductor stack and comprising a plurality of first openings exposing the first semiconductor layer on the peripheral frame region;
a third electrode formed on the first insulating layer and comprising a first extended portion and a plurality of second extended portions connected to the first extended portion, wherein the first extended portion is formed on the second semiconductor layer, the plurality of second extended portions is formed on the peripheral frame region and electrically connected to the first semiconductor layer through the plurality of first openings, and the semiconductor stack comprises a plurality of concave parts respectively opposite to the plurality of second extended portions of the third electrode in the top view of the optoelectronic device;
a second insulating layer formed on the first insulating layer and comprising one or a plurality of second openings formed on the second semiconductor layer; and
one or a plurality of fourth electrodes formed on the second insulating layer and electrically connected to the second semiconductor layer through the one or the plurality of second openings; and
a glue surrounding the optoelectronic device.
16. The light-emitting module of claim 15 , wherein the semiconductor stack comprises multiple internal regions not covered by the active layer and the second semiconductor layer, and the multiple internal regions are surrounded by the peripheral frame region.
17. The light-emitting module of claim 16 , wherein the plurality of first openings comprises a first group on the multiple internal regions and a second group on the peripheral frame region.
18. The light-emitting module of claim 17 , wherein the first extended portion is electrically connected to the first semiconductor layer through the first group of the plurality of first openings on the multiple internal regions.
19. The light-emitting module of claim 17 , wherein in the top view of the optoelectronic device, the first group of the plurality of first openings comprises a first total area and the second group of the plurality of first openings comprises a second total area, and the first total area is different from the second total area.