IMPLANTABLE MEDICAL DEVICE WITH A SLOT ANTENNA

1 . An implantable medical device (IMD) configured for implant in a body, the IMD comprising:

an enclosure formed of an electrically conductive material and comprising an outer wall and a slot extending through the outer wall;

a slot antenna comprising the enclosure;

a dielectric element that hermetically seals the slot; and

communication circuitry within the enclosure and electrically coupled with the slot antenna.

2 . The IMD of claim 1 , wherein the slot antenna has a peak radiation gain in a range of −8 dBi to −13 dBi when implanted under skin and operating in a frequency band of 2.4 GHz to 2.5 GHz.

3 . The IMD of claim 1 , wherein the slot antenna has a peak radiation gain in a range of −5 dBi to −15 dBi when implanted under skin and operating in a frequency band of 5.15 GHz to 5.85 GHz.

4 . The IMD of claim 1 , wherein the dielectric element comprises a dielectric material having a dielectric constant in a range of 2 to 20 in a frequency band in a range of at least one of 2.4 GHz to 2.5 GHz or from 5.15 GHz to 5.85 GHz.

5 . The IMD of claim 1 , wherein the dielectric element is formed of a non-metallic, biocompatible material and has a thickness in a range of a 20 mil to 100 mil (˜0.5 mm to 2.5 mm).

6 . The IMD of claim 1 , wherein the dielectric element is configured to extend to at least partially through a thickness of the slot.

7 . The IMD of claim 1 , wherein the dielectric element is configured to cover the slot without extending into the slot.

8 . The IMD of claim 1 , wherein the dielectric element comprises:

a dielectric filler; and

a metallic boundary that surrounds the dielectric filler.

9 . The IMD of claim 8 , wherein the metallic boundary is formed of electrically conductive material and is electrically coupled with the outer wall.

10 . The IMD of claim 8 , wherein the metallic boundary is configured to extend at least partially through a thickness of the slot.

11 . The IMD of claim 10 , wherein the dielectric element further comprises a plurality of connection pins that extend from the metallic boundary into the enclosure.

12 . The IMD of claim 1 , wherein the outer wall of the enclosure in a region of the slot is characterized by an enclosure profile and the dielectric element is characterized by a dielectric-element profile that matches the enclosure profile.

13 . The IMD of claim 12 , wherein the enclosure profile is non-linear with a first curvature and the dielectric-element profile is non-linear with a second curvature that matches the first curvature.

14 . The IMD of claim 12 , wherein the enclosure profile is flat and the dielectric-element profile is flat.

15 . The IMD of claim 1 , wherein the outer wall of the enclosure has a thickness in a range of 4 mils to 30 mils (˜0.1 mm up to 0.8 mm).

16 . The IMD of claim 1 , further comprising a transmission line electrically coupled at an enclosure end to the outer wall at each of a first connection point and a second connection point on opposite sides of the slot, and at a circuitry end to the communication circuitry.

17 . The IMD of claim 16 , wherein the transmission line comprises:

a signal conductor having an enclosure end electrically coupled to the first connection point, and a circuitry end electrically coupled to a signal terminal of the communication circuitry; and

a ground conductor having an enclosure end electrically coupled to the second connection point, and a circuitry end electrically coupled to a ground terminal of the communication circuitry.

18 . The IMD of claim 17 , wherein:

the ground conductor comprises an upper layer of electrically conductive material and a lower layer of electrically conductive material, and the upper layer is electrically coupled to the lower layer by electrically conductive vias,

the signal conductor comprises an internal layer of electrically conductive material positioned between the upper layer and the lower layer, and

the transmission line further comprises a dielectric material that separates the upper layer, the internal layer, and the lower layer.

19 . The IMD of claim 18 , wherein the ground conductor, the signal conductor, and the dielectric material are configured so the transmission line is impedance matched to a signal path between the communication circuitry and the slot of the slot antenna.

20 . The IMD of claim 19 , wherein:

the upper layer and the lower layer of the ground conductor have a cross-section width between 1 mm to 10 mm;

the internal layer has a cross-section width between 50 microns to 500 microns; and

the dielectric material has a dielectric constant between 2 and 20 and a thickness between 10 mil and 30 mil.

21 . The IMD of claim 1 , wherein:

the enclosure has a length E 1 in a range of 20 mm to 75 mm, a width E w in a range of 20 mm to 75 mm, and a height E h in a range of 3 mm to 20 mm; and

the slot has a length S 1 in a range of 10 mm to 40 mm and a width S w in a range of 0.5 mm to 5 mm.

22 . The IMD of claim 1 , wherein:

an interior volume of the enclosure is in a range of 1200 mm 3 to 112,500 mm 3 , and

the slot has an area in a range of 5 mm 2 to 200 mm 2 .