IP Library Patent Application 18422732
Patent Application
App. No. 18/422,732

FORMATION OF ELECTRICALLY CONDUCTIVE LAYERS AT NEAR AMBIENT TEMPERATURE USING SILVER NANOPARTICULATE PROCESSING AND INKS FOR FORMING THE LAYERS

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Patent No.
US None
App. No.
18/422,732
Abstract

Near ambient temperature processing has successfully resulted in highly conductive coatings formed from silver nanowires. The electrically conductive materials can have a high loading of silver and low resistivities. The highly conductive materials can be formed using aqueous inks with high loadings of silver nanowires with greater than 3 wt % metal that is primarily silver nanowires. Methods of preparing the high loading inks can comprise forming a good dispersion of the silver nanowires and removing solvent to concentrate the dispersions. A range of binders can be used including, for example, UV crosslinkable binders. Generally, the organic concentration of the highly conductive materials is no more than 25 wt %, although this can correspond to higher volume fractions of organics while still achieving good electrical conduction.

Claims (21)

1 . An electrically conductive composite material comprising from about 75 wt % to about 98 wt % silver particulates and least about 2 wt % polymer binder, wherein the silver particulates comprise at least about 67 wt % silver nanowires having an aspect ratio of at least about 75.

2 . The electrically conductive composite material of claim 1 having a resistivity of no more than about 5×10 −3 Ohm-cm.

3 . The electrically conductive composite material of claim 1 having a resistivity of no more than about 5×10 −4 Ohm-cm.

4 . The electrically conductive composite material of claim 1 wherein the composite material has at least about 25 vol % silver.

5 . The electrically conductive composite material of claim 1 wherein the polymer binder comprises a polysaccharide.

6 . The electrically conductive composite material of claim 1 wherein the polymer binder comprises a polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyacrylate, poly(methyl methacrylate), polyamide, polyimide, polysulfone, polysiloxane, polyester, epoxy, polyurethane, polyvinyl alcohol, polyvinyl acetate, copolymers thereof, or blends of polymers.

7 . The electrically conductive composite material of claim 1 wherein the composite material consists essentially of the discrete silver particulates, the polymer binder and no more than about 2 wt % crosslinking agents and/or viscosity modifiers.

8 . The electrically conductive composite material of claim 1 wherein the silver nanowires have an average diameter from about 15 nm to about 80 nm and an aspect ratio from about 100 to about 1500.

9 . The electrically conductive composite material of claim 1 wherein the silver particulates comprise at least about 90 wt % nanowires.

10 . The electrically conductive composite material of claim 1 comprising at least about 90 wt % silver particulates.

11 . An electrically conductive structure comprising the electrically conductive composite material of claim 1 and having a transmittance of visible light of no more than about 70%.

12 . The electrically conductive structure of claim 11 wherein the electrically conductive structure comprises a layer having an average thickness of from about 0.2 microns to about 2 millimeters.

13 . The electrically conductive structure of claim 11 wherein the electrically conductive structure comprises a layer having an average thickness of no more than about 5 microns and a sheet resistance of no more than about 5 Ohms/sq.

14 . The electrically conductive structure of claim 11 wherein the electrically conductive structure comprises an opaque layer having an average thickness of no more than about microns and a sheet resistance of no more than about 1 Ohms/sq.

15 . The electrically conductive structure of claim 11 wherein the electrically conductive structure comprises a layer comprising at least about 90 wt % silver particulates and wherein the silver particulates comprise at least about 90 wt % silver nanowires.

16 . The electrically conductive structure of claim 11 wherein the electrically conductive composite material has a resistivity of no more than about 5×10 −4 Ohm-cm.

17 . The electrically conductive structure of claim 11 wherein the composite does not have deposits of in situ reduced metal.

18 . The electrically conductive structure of claim 11 wherein the electrically conductive structure comprises the electrically conductive composite material disposed on a heat sensitive substrate unstable over about 100° C.

19 . The electrically conductive structure of claim 11 wherein the electrically conductive composite material is in the form of an electrical interconnect.

20 . The electrically conductive structure of claim 11 wherein the electrically conductive structure (composite material) is processed at temperatures below about 100 C.

21 . The electrically conductive structure of claim 11 wherein the electrically conductive composite material is disposed on a substrate in roll form.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2024
From: C3 NANO, INC.
To: EKC TECHNOLOGY, INC.
Reel/Frame 069719/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2024
From: YANG, XIQIANG; CHENG, ARTHUR YUNG-CHI; FANG, MICHAEL; LIU, PEI-KANG; VIRKAR, AJAY
To: C3 NANO, INC.
Reel/Frame 066623/0378 →