MICRO-LED DISPLAY PANEL
A micro-LED display panel includes a micro pixel array area having a plurality of micro pixel areas, each micro pixel area including a micro-LED. The micro-LED includes at least two light emitting layers in a vertical direction and a dielectric layer formed between adjacent ones of the light emitting layers, an IC backplane formed at a back surface of the micro-LED and configured to control the light emitting layers, and a plurality of interconnected structures configured to electrically respectively connect each light emitting layer to electrodes. The interconnected structures include one or more top interconnected structures configured to electrically connect a top of each of the light emitting layers to a first electrode, and one or more bottom interconnected structures configured to electrically connect a bottom of each of the light emitting layers to the IC backplane to a second electrode. The interconnected structures are formed around each micro pixel area, one bottom interconnected structure corresponds to one micro-LED, and one top interconnected structure corresponds to adjacent micro-LEDs.
1 . A micro-LED display panel, comprising:
a micro pixel array area comprising a plurality of micro pixel areas, each micro pixel area comprising a micro-LED; wherein the micro-LED comprises at least two light emitting layers disposed in a vertical direction and a dielectric layer formed between adjacent ones of the light emitting layers, wherein the at least two light emitting layers are coaxial;
an IC backplane formed at a back surface of the micro-LED and configured to control the light emitting layers; and
a plurality of interconnected structures configured to electrically respectively connect the light emitting layer to electrodes, wherein the interconnected structures comprises one or more top interconnected structures configured to electrically connect a top of each of the light emitting layers to a first electrode, and one or more bottom interconnected structures configured to electrically connect a bottom of each of the light emitting layers to the IC backplane to a second electrode, the interconnected structures being formed around each micro pixel area, one bottom interconnected structure corresponding to one micro-LED, and one top interconnected structure corresponding to adjacent micro-LEDs.
2 . The micro-LED display panel according to claim 1 , wherein the plurality of interconnected structures are symmetrically arranged in the micro-LED display panel around each micro-LED.
3 . The micro-LED display panel according to claim 1 , wherein the interconnected structure is not directly connected with any of the light emitting layers.
4 . The micro-LED display panel according to claim 3 , wherein the micro-LED comprises three or more light emitting layers in the vertical direction; and the interconnected structures comprise two or more bottom interconnected structures which are respectively electrically connected with a bottom of each light emitting layer except for a bottom-most light emitting layer of the micro-LED.
5 . The micro-LED display panel according to claim 4 , wherein a bottom of the bottom-most light emitting layer is connected to the IC backplane by a bottom conductive connected structure which is formed between a bottom of the bottom-most light emitting layer and the IC backplane.
6 . The micro-LED display panel according to claim 4 , wherein a number of the bottom interconnected structures for the micro-LED is equal to a number of the light emitting layers of the micro-LED minus one.
7 . The micro-LED display panel according to claim 3 , wherein the light emitting layers comprise first, second, and third light emitting layers disposed in the vertical direction, the bottom interconnected structures include first bottom interconnected structures for connecting a bottom of the first light emitting layer of each of the micro-LEDs and second bottom interconnected structures for connecting a bottom of the second light emitting layer of each of the micro-LEDs; and the first bottom interconnected structures and second bottom interconnected structures are symmetrically arranged in the micro-LED display panel around each micro pixel area.
8 . The micro-LED display panel according to claim 7 , wherein the top interconnected structure is symmetrically arranged in the micro-LED display panel.
9 . The micro-LED display panel according to claim 7 , wherein a symmetric center is a center of the micro-LED.
10 . The micro-LED display panel according to claim 1 , further comprising a conductive layer network structure configured to connect the light emitting layer to the interconnected structure.
11 . The micro-LED display panel according to claim 10 , wherein the conductive layer network structure comprises one or more top conductive layers formed on a top surface of each of the light emitting layers to connect the light emitting layers with the top interconnected structures, and one or more bottom conductive layers formed at a bottom surface of each of light emitting layers to connect the light emitting layers with the bottom interconnected structures.
12 . The micro-LED display panel according to claim 11 , wherein each of the top conductive layers is continuously formed between adjacent micro-LEDs; and each of the bottom conductive layers is not continuous between the adjacent micro-LEDs, and the bottom interconnected structures are separately connected with the corresponding bottom conductive layers of each of the micro-LEDs.
13 . The micro-LED display panel according to claim 10 , wherein the conductive layer network structure is transparent.
14 . The micro-LED display panel according to claim 13 , wherein a material of the conductive layer network structure is one of Indium Tin Oxides (ITO), Fluorine-doped Tin Oxide (FTO), or Aluminum-doped Zinc Oxide (AZO).
15 . The micro-LED display panel according to claim 12 , wherein a bottom conductive layer of a bottom-most light emitting layer is non-transparent.
16 . The micro-LED display panel according to claim 10 , wherein a sum of contours of the conductive layers connecting to the micro-LED is not less than a half of a perimeter of the micro pixel area.
17 . The micro-LED display panel according to claim 1 , further comprising a dielectric layer formed between the light emitting layers and around the interconnected structures.
18 . The micro-LED display panel according to claim 17 , wherein the dielectric layer is transparent.
19 . The micro-LED display panel according to claim 1 , wherein the bottom interconnected structure is formed on a top surface of the IC backplane and electrically connected with the IC backplane.
20 . The micro-LED display panel according to claim 19 , wherein a top of the bottom interconnected structures is lower than a top of a top-most light emitting layer.
21 . The micro-LED display panel according to claim 1 , wherein the top interconnected structures pass through a top and a bottom of the micro-LED, and the top of the top interconnected structure is higher than the top of the micro-LEDs.
22 . The micro-LED display panel according to claim 21 , wherein the light emitting layer is formed by a stacked P-N junction layer, the stacked P-N junction layer comprising a P-type semiconductor layer, a quantum well layer, and an N-type semiconductor layer.
23 . The micro-LED display panel according to claim 22 , wherein the P-type semiconductor layer and/or the N-type semiconductor layer comprise III-V group compound semiconductors.
24 . The micro-LED display panel according to claim 22 , wherein the quantum well layer of a top-most light emitting layer is continuously formed between adjacent micro-LEDs and continuously formed on the micro pixel array area.
25 . The micro-LED display panel according to claim 24 , wherein a top contact is provided on the quantum well layer between the adjacent micro-LEDs.
26 . The micro-LED display panel according to claim 25 , wherein an opening is formed in the quantum well layer between the adjacent micro-LEDs; and a top conductive connected structure is provided through the opening to connect the top interconnected structure with the top contact.
27 . The micro-LED display panel according to claim 26 , wherein a plurality of the top contacts are continuously connected to form a mesh structure with the micro-LED being exposed.
28 . The micro-LED display panel according to claim 26 , wherein a width of the top conductive connected structure is less than a width of the top interconnected structure; and a width of the top contact is larger than the width of the top conductive connected structure.
29 . The micro-LED display panel according to claim 28 , wherein the width of the top contact is larger than the width of the top interconnected structure.
30 . The micro-LED display panel according to claim 29 , wherein the width of the top contact is larger than a width of the bottom interconnected structure.
31 . The micro-LED display panel according to claim 1 , wherein the interconnected structures are made of conductive metal.
32 . The micro-LED display panel according to claim 1 , wherein the light emitting layers emit at least two different colors of light.
33 . The micro-LED display panel according to claim 32 , wherein the light emitting layers comprise a red light emitting layer, a blue light emitting layer, and a green light emitting layer.
34 . The micro-LED display panel according to claim 32 , wherein the light emitting layers comprise two red light emitting layers and a green light emitting layer.
35 . The micro-LED display panel according to claim 1 , wherein the light emitting layers emit a same color of light.
36 . The micro-LED display panel according to claim 1 , wherein the micro-LED further comprises a mesa structure formed by the light emitting layer.
37 . The micro-LED display panel according to claim 36 , wherein the mesa structure comprises a flat top surface.
38 . The micro-LED display panel according to claim 37 , wherein the mesa structure comprises a convex structure.
39 . The micro-LED display panel according to claim 37 , wherein a surface of the mesa structure is aligned with a surface of the micro-LED.
40 . The micro-LED display panel according to claim 36 , wherein the micro-LED further comprises a micro lens provided above the first light emitting layer, covering an area of the mesa structure.
41 . The micro-LED display panel according to claim 1 , further comprising a reflective layer formed on a bottom surface of a bottom-most light emitting layer of the at least two light emitting layers.
42 . The micro-LED display panel according to claim 1 , wherein the plurality of interconnected structures are configured to reflect light emitted from the at least two light emitting layers.
43 . The micro-LED display panel according to claim 1 , further comprising an external wire configured to connect the top interconnected structures to the first electrode, wherein the first electrode is provided on the IC backplane.