Optical module
View Patent ↗An optical module including a circuit board, a circuit adapter board disposed on and electrically connected to the circuit board, a silicon optical chip disposed on and electrically connected to the circuit adapter board, an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon, and a light source disposed on and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon; wherein a thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board, the silicon optical chip is provided with optical waveguide end facet on a side thereof configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon, and the circuit adapter board has a notch on a side thereof proximate to the optical waveguide end facets.
1. An optical module, comprising:
a circuit board;
a circuit adapter board disposed on the circuit board and electrically connected to the circuit board, a thermal expansion coefficient of the circuit adapter board being lower than that of the circuit board;
a silicon optical chip disposed on the circuit adapter board and electrically connected to the circuit adapter board;
an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon; and
a light source disposed on the circuit board, and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon, wherein
the silicon optical chip comprises optical waveguide end facets disposed on a side of the silicon optical chip, the optical waveguide end facets being configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon;
the circuit adapter board comprises a notch located on a side of the circuit adapter board proximate to the optical waveguide end facets.
2. The optical module according to claim 1 , wherein
the circuit adapter board comprises a first bonding pad disposed on an upper surface of the circuit adapter board, a second bonding pad disposed on a lower surface of the circuit adapter board, and an internal wiring connecting the first bonding pad and the second bonding pad;
the silicon optical chip comprises a third bonding pad disposed on a surface of the silicon optical chip proximate to or away from the circuit adapter board; and
the silicon optical chip is electrically connected to the circuit adapter board through the first bonding pad and the third bonding pad, and the circuit adapter board is electrically connected to the circuit board through the second bonding pad.
3. The optical module according to claim 2 , wherein the circuit adapter board comprises a top sub-circuit adapter board and a bottom sub-circuit adapter board, and wherein
a surface of the top sub-circuit adapter board away from the bottom sub-circuit adapter board is the upper surface of the circuit adapter board;
a surface of the bottom sub-circuit adapter board away from the top sub-circuit adapter board is the lower surface of the circuit adapter board; and
the top sub-circuit adapter board is electrically connected to the bottom sub-circuit adapter board through the internal wiring.
4. The optical module according to claim 1 , wherein
the optical module has an optical port;
the side of the silicon optical chip provided with the optical waveguide end facets is located near an edge of the circuit adapter board proximate to the optical port; and
the silicon optical chip is bridged over the notch.
5. The optical module according to claim 4 , wherein
there is a distance between the side of the silicon optical chip provided with the optical waveguide end facets and the side of the circuit adapter board provided with the notch; and
the side of the circuit adapter board provided with the notch is closer to the optical port than the side of the silicon optical chip provided with the optical waveguide end facets.
6. The optical module according to claim 1 , wherein corners of the notch are arc-shaped corners.
7. The optical module according to claim 1 , further comprising:
a first optical fiber ribbon connector configured to clamp an end of the first optical fiber ribbon and an end of the second optical fiber ribbon that are optically connected to the silicon optical chip; and
a second optical fiber ribbon connector configured to clamp an end of the second optical fiber ribbon optically connected to the light source.
8. The optical module according to claim 7 , wherein the first optical fiber ribbon connector comprises:
a first fixing component having a first clamping surface and a second clamping surface;
a second fixing component having a third clamping surface, and the third clamping surface cooperates with the first clamping surface to clamp optical fiber segments without protective layers in the first optical fiber ribbon and the second optical fiber ribbon; and
a third fixing component having a fourth clamping surface, and the fourth clamping surface cooperates with the second clamping surface to clamp optical fiber segments with protective layers in the first optical fiber ribbon and the second optical fiber ribbon.
9. The optical module according to claim 7 , further comprising a connector fixing component, wherein
the connector fixing component is configured to fix the first optical fiber ribbon connector and the silicon optical chip after optical fibers in the first optical fiber ribbon connector is optically connected to the silicon optical chip.
10. The optical module according to claim 9 , wherein the connector fixing component comprises a first fixing surface and a second fixing surface, and the first fixing surface and the second fixing surface are in a stepped shape; and
the first fixing surface is fixed on a surface of the silicon optical chip away from the circuit adapter board, the second fixing surface is fixed on a surface of the first optical fiber ribbon connector away from the circuit board, and there is a gap between the circuit board and a surface of the first optical fiber ribbon connector proximate to the circuit board.
11. The optical module according to claim 10 , wherein a height of the second fixing surface relative to the circuit board is greater than a height of the first fixing surface relative to the circuit board.
12. The optical module according to claim 9 , wherein a thermal expansion coefficient of the connector fixing component is less than the thermal expansion coefficient of the circuit board.
13. The optical module according to claim 9 , wherein an absolute value of a difference between the thermal expansion coefficient of the connector fixing component and a thermal expansion coefficient of the first optical fiber ribbon connector is less than a preset value; and/or
an absolute value of a difference between the thermal expansion coefficient of the connector fixing component and a thermal expansion coefficient of the silicon optical chip is less than the preset value.
14. The optical module according to claim 1 , wherein
the light source and the circuit board are electrically connected through a flexible circuit board;
the light source is disposed on an upper surface of the circuit board, and laser driving pads are provided on a lower surface of the circuit board, and the flexible circuit board, after being bent, bypasses a side face of the circuit board to be electrically connected to the laser driving pads; and
the light source is disposed on a long side of the circuit board and near a corner.