Electronic device
An electronic device includes an insulating layer, a first conductive portion, a second conductive portion, a connective portion, a processing unit and an electronic element. The first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer. The connective portion is at least partially disposed in the insulating layer. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer. The processing unit and the electronic element are overlapped with the connective portion. The thickness of the processing unit is greater than the thickness of the first conductive portion.
1. An electronic device, comprising:
an insulating layer;
a first conductive portion and a second conductive portion, wherein the first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer;
a connective portion at least partially disposed in the insulating layer, wherein the first conductive portion is electrically connected to the second conductive portion through the connective portion; and
a processing unit and an electronic element, wherein the processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer,
wherein the processing unit and the electronic element are overlapped with the connective portion, and
wherein a thickness of the processing unit is greater than a thickness of the first conductive portion.
2. The electronic device as claimed in claim 1 , wherein the electronic element comprises a passive electronic element.
3. The electronic device as claimed in claim 2 , wherein the electronic element comprises an active electronic element.
4. The electronic device as claimed in claim 1 , wherein the first conductive portion and the second conductive portion are overlapped with the connective portion.
5. The electronic device as claimed in claim 1 , further comprising a plurality of connective portions at least partially disposed in the insulating layer.
6. The electronic device as claimed in claim 5 , wherein the processing unit is overlapped with the plurality of connective portions.
7. The electronic device as claimed in claim 5 , wherein the electronic element is overlapped with the plurality of connective portions.
8. The electronic device as claimed in claim 1 , wherein the processing unit comprises an integrated circuit.
9. The electronic device as claimed in claim 1 , wherein a projection area of the processing unit onto the insulating layer is greater than a projection area of the first conductive portion onto the insulating layer.
10. The electronic device as claimed in claim 1 wherein a thickness of the electronic element is greater than a thickness of the second conductive portion.
11. The electronic device as claimed in claim 1 , wherein a projection area of the processing unit onto the insulating layer is different from a projection area of the electronic element onto the insulating layer.