DEVICE COOLING ENCLOSURE AND ADAPTER FOR HOUSING DEVICES OF DIFFERENT WIDTHS
Embodiments of the present invention provide a DUT air duct shroud that can receive and house DUTs of a specific form factor, and can advantageously be adapted to house and cool DUTs of a different (e.g., narrower) form factor. The DUT shrouds described herein guide the DUT into the correct position and orientation to be received by the test system for quick and convenient installation, and advantageously redirect the air flow to the narrower form factor for effective cooling during testing. The DUT shrouds can be used in conjunction with device interface boards and similar components used to test memory devices and computer hardware using active cooling systems, and embodiments are also operable to house and cool consumer memory devices of different form factors.
1 . An apparatus for housing a device under test (DUT) during testing, the apparatus comprising:
a housing operable to selectively receive a DUT comprising one of: a double-width DUT; or a single-width DUT and a DUT adapter; and wherein the housing comprises upper receiving features and lower receiving features; and
the DUT adapter comprising an upper member and a lower member, wherein the upper member and the lower member are operable to be received by the upper receiving features and the lower receiving features of the housing, respectively, to secure the DUT adapter to the housing, wherein the housing is operable to be received by a device interface board (DIB) of a test system to test either the double-width DUT or the single-width DUT, and wherein the housing is operable to receive cold air from a cooling system of the test system and direct the cold air over surfaces of a DUT housed therein for cooling.
2 . The apparatus of claim 1 , wherein the housing is further operable to receive the double-width DUT without use of an adapter.
3 . The apparatus of claim 2 , wherein the single-width DUT is approximately 7.5 mm wide, and wherein the double-width DUT is approximately 16.8 mm wide.
4 . The apparatus of claim 1 , wherein the cooling system comprises a plurality of fans and a plurality of cooling channels.
5 . The apparatus of claim 4 , wherein the DUT comprises a temperature sensor, and wherein the DUT is operable to be cooled by the cooling system according to a measurement of the temperature sensor.
6 . The apparatus of claim 1 , wherein the housing and the DUT adapter comprise electrostatic discharge (ESD) materials.
7 . The apparatus of claim 1 , wherein the housing and the DUT adapter are 3D printed.
8 . The apparatus of claim 1 , wherein the DUT comprises a solid state drive (SSD).
9 . A consumer electronic product for housing and cooling a memory device, the product comprising:
a housing comprising upper receiving features and lower receiving features for securing an adapter to the housing; and
a cooling system disposed within the housing and operable to cool a memory device operable to be disposed in the housing during normal operations thereof by blowing air towards the memory device, and wherein the housing is operable to receive air from the cooling system and to direct the air over surfaces of the memory device.
10 . The consumer electronic product for housing and cooling a memory device of claim 9 , wherein the housing is operable to selectively receive either a double-width memory device or a single-width memory device and also receive an adapter, the adapter comprising an upper member and a lower member, wherein the upper member and the lower member are operable to be received by the upper receiving features and lower receiving features of the housing, respectively, to couple the adapter to the housing.
11 . The consumer electronic product for housing and cooling a memory device of claim 9 , wherein the housing is operable to receive the double-width memory device without using an adapter.
12 . The consumer electronic product for housing and cooling a memory device of claim 9 , wherein the cooling system is operable to maintain the memory device within a prescribed temperature range during operation thereof for increased performance of the memory device.
13 . The consumer electronic product for housing and cooling a memory device of claim 9 , wherein the cooling system comprises:
a) a fan for moving air;
b) control circuits for controlling operation of the fan; and
c) thermostat elements coupled to the control circuits for measuring temperature of the memory device.
14 . An apparatus for housing a device under test (DUT) during testing, the apparatus comprising:
a housing operable to selectively receive a DUT comprising one of: a first form factor DUT; or a second form factor DUT and a DUT adapter; and wherein the housing comprising upper receiving features and lower receiving features; and
the DUT adapter comprising an upper member and a lower member, wherein the upper member and the lower member are operable to be received by the upper receiving features and the lower receiving features of the housing, respectively, to secure the DUT adapter to the housing, wherein the housing is operable to be received by a device interface board (DIB) of a test system to test either the first form factor DUT or the second form factor DUT, and wherein the housing is operable to receive cold air from a cooling system of the test system and direct the cold air over surfaces of a DUT housed therein for cooling.
15 . The apparatus of claim 14 , wherein the housing is further operable to receive the first form factor DUT without using any adapter.
16 . The apparatus of claim 14 , wherein the first form factor DUT comprises an E3.S 2T DUT, and wherein the second form factor DUT comprises an E3.S 1T DUT.
17 . The apparatus of claim 14 , wherein the first form factor DUT comprises a double-width form factor, and wherein the second form factor DUT comprises a single-width form factor width.
18 . The apparatus of claim 14 , wherein a front side of the housing is sealed to prevent air leaks.
19 . The apparatus of claim 14 , wherein the upper member and the lower member are operable to be depressed to insert the DUT adapter into the housing.
20 . The apparatus of claim 14 , wherein the upper member and the lower member are operable to be depressed to remove the DUT adapter from the housing.