Liquid dispensing head and liquid dispensing device
According to an embodiment, a liquid dispensing head includes a substrate having a first surface and a piezoelectric member on the first surface of the substrate. A sidewall surface portion of the piezoelectric member is inclined at an obtuse angle with respect to the first surface. A vibration plate is positioned above the piezoelectric member in a first direction orthogonal to the first surface. An electrode wiring portion is on the sidewall surface portion and connected to an electrode wiring pattern on the first surface.
1 . A liquid dispensing head, comprising:
a substrate having a first surface;
a piezoelectric member on the first surface of the substrate, a sidewall surface portion of the piezoelectric member being inclined at an obtuse angle with respect to the first surface;
a vibration plate above the piezoelectric member in a first direction orthogonal to the first surface; and
an electrode wiring portion on the sidewall surface portion and connected to an electrode wiring pattern on the first surface.
2 . The liquid dispensing head according to claim 1 , further comprising:
a pressure chamber above the vibration plate in the first direction; and
a substrate wiring portion in the electrode wiring pattern on the first surface, the substrate wiring portion being connected to the electrode wiring portion at a position where the sidewall surface portion meets the first surface.
3 . The liquid dispensing head according to claim 2 , wherein the obtuse angle is greater than 135°.
4 . The liquid dispensing head according to claim 3 , wherein an opposite sidewall surface portion of the piezoelectric member is inclined at less than 135° with respect to the first surface.
5 . The liquid dispensing head according to claim 4 , the opposite sidewall surface portion is inclined at approximately 90° with respect to the first surface.
6 . The liquid dispensing head according to claim 2 , further comprising:
an anisotropic conductive film on the first surface, the anisotropic conductive film connecting the substrate wiring portion to a flexible wiring substrate.
7 . The liquid dispensing head according to claim 6 , further comprising:
an electronic component mounted on the flexible wiring substrate, the substrate wiring portion being electrically connected to the electronic component via the flexible wiring substrate.
8 . The liquid dispensing head according to claim 1 , an opposite sidewall surface portion is inclined at approximately 90° with respect to the first surface.
9 . The liquid dispensing head according to claim 1 , wherein
the piezoelectric member comprises a plurality of layers of piezoelectric material, each layer having a first electrode on a first main surface of the layer and a second electrode on a second main surface of the layer,
each of the first electrodes extends to the sidewall surface portion, and
each of the second electrodes extends to an opposite sidewall surface portion.
10 . The liquid dispensing head according to claim 9 , the opposite sidewall surface portion is inclined at approximately 90° with respect to the first surface of the substrate.
11 . The liquid dispensing head according to claim 10 , further comprising:
a common electrode on the first surface of the substrate, the common electrode electrically connected to each of the second electrodes.
12 . The liquid dispensing head according to claim 9 , further comprising:
a plurality of grooves extending into the piezoelectric member in the first direction from an upper surface of the piezoelectric member.
13 . An inkjet head, comprising:
a substrate having a first surface;
a piezoelectric member on the first surface of the substrate, a sidewall surface portion of the piezoelectric member being inclined at an obtuse angle with respect to the first surface, an opposite sidewall surface portion being at an approximately right angle with respect to the first surface;
a vibration plate above the piezoelectric member in a first direction orthogonal to the first surface;
a nozzle plate above the vibration in the first direction;
a plurality of pressure chambers between the vibration plate and the nozzle plate;
a plurality of grooves extending into the piezoelectric member in the first direction from an upper surface of the piezoelectric member;
a plurality of individual electrode portions on the sidewall surface portion, each individual electrode portion connected to an electrode wiring pattern on the first surface;
a plurality of common electrode portions on the opposite sidewall surface portion, each common electrode portion connected to a common electrode on the first surface;
a plurality of substrate wiring portions in the electrode wiring pattern on the first surface, each substrate wiring portion being connected to a respective individual electrode wiring portion at a position where the sidewall surface portion meets the first surface;
an anisotropic conductive film on the substrate wiring portions;
a flexible wiring substrate connected to the plurality of wiring substrate portions by the anisotropic conductive film; and
an electronic component on the flexible wiring substrate, at least one individual electrode portion being electrically connected to the electronic component.
14 . The inkjet head according to claim 13 , wherein the obtuse angle is greater than 135°.
15 . A liquid dispensing device, comprising:
a liquid supply source;
a liquid dispensing head connected to the liquid supply and including:
a substrate having a first surface;
a piezoelectric member on the first surface of the substrate, a sidewall surface portion of the piezoelectric member being inclined at an obtuse angle with respect to the first surface;
a vibration plate above the piezoelectric member in a first direction orthogonal to the first surface; and
an electrode wiring portion on the sidewall surface portion and connected to an electrode wiring pattern on the first surface.
16 . The liquid dispensing device according to claim 15 , the liquid dispensing head further comprising:
a pressure chamber above the vibration plate in the first direction; and
a substrate wiring portion in the electrode wiring pattern on the first surface, the substrate wiring portion being connected to the electrode wiring portion at a position where the sidewall surface portion meets the first surface.
17 . The liquid dispensing device according to claim 16 , wherein the obtuse angle is greater than 135°.
18 . The liquid dispensing device according to claim 16 , further comprising:
an anisotropic conductive film on the first surface, the anisotropic conductive film connecting the substrate wiring portion to a flexible wiring substrate.
19 . The liquid dispensing device according to claim 18 , further comprising:
an electronic component mounted on the flexible wiring substrate, the substrate wiring portion being electrically connected to the electronic component via the flexible wiring substrate.
20 . The liquid dispensing device according to claim 15 , an opposite sidewall surface portion is inclined at approximately 90° with respect to the first surface.