Optoelectronic assembly
An optoelectronic assembly includes a printed circuit board (PCB), an integrated circuit (IC) substrate operably mounted on the PCB, the IC substrate comprising at least one of active elements and passive elements, a vertical-cavity surface-emitting laser (VCSEL) operably mounted on a first surface of the IC substrate, an optical detector operably mounted adjacent to the VCSEL on the first surface of the IC substrate, and a molding compound formed on the IC substrate encapsulating a plurality of sides of the VCSEL and a plurality of sides of the optical detector, in which at least one electrical communication path between the optical detector and the VCSEL is confined within the IC substrate.
1 . An optical transceiver device, comprising:
a printed circuit board (PCB);
an integrated circuit (IC) substrate mounted on the PCB by a first plurality of electrical connections disposed between a first surface of the PCB and a first surface of the IC substrate, the IC substrate comprising active elements embedded in the IC substrate;
a vertical-cavity surface-emitting laser (VCSEL) mounted on a second surface of the IC substrate, opposite to the first surface of the IC substrate, with a second plurality of electrical connectors therebetween; and
an optical detector mounted adjacent to the VCSEL on the second surface of the IC substrate with a third plurality of electrical connectors therebetween;
wherein the IC substrate includes a plurality of conductive pillars extending along a first direction between the first surface of the IC substrate and the second surface of the IC substrate and a plurality of interconnection layers extending along a second direction substantially normal to the first direction, and
wherein at least one active element embedded in the IC substrate provides driver operations of the VCSEL and at least one electrical communication path between an active or passive element embedded in the IC substrate and at least one of the optical detector and the VCSEL is confined within the IC substrate.
2 . The optical transceiver device of claim 1 , wherein the at least one electrical communication path between the optical detector and the VCSEL confined within the IC substrate comprises a plurality of electrical communication paths between the optical detector and the VCSEL, each confined within the IC substrate.
3 . The optical transceiver device of claim 1 , wherein the first plurality of electrical connections includes a plurality of controlled collapse chip connections (C4s).
4 . The optical transceiver device of claim 1 , wherein the second plurality of electrical connectors include solder connections and the third plurality of electrical connectors include Cu—Cu hybrid bonding.
5 . The optical transceiver device of claim 1 , wherein a first pitch between a first group of the plurality of conductive pillars underlying the optical detector is less than a second pitch between a second group of the plurality of conductive pillars underlying the VCSEL.
6 . The optical transceiver device of claim 1 , the plurality of conductive pillars comprise copper.
7 . The optical transceiver device of claim 1 , wherein a width of the plurality of conductive pillars is within a range of about 40 μm to about 120 μm.
8 . The optical transceiver device of claim 7 , wherein a pitch between the plurality of conductive pillars is within a range of about 30 to about 120 μm.
9 . The optical transceiver device of claim 1 , further comprising a thermally conductive compound disposed between the VCSEL and the second surface of the IC substrate.
10 . The optical transceiver device of claim 1 , wherein the optical detector is separated from the VCSEL by a gap have a width within a range of about 300 to about 500 μm.
11 . The optical transceiver device of claim 10 , further comprising a molding compound that extends into the gap.
12 . The optical transceiver device of claim 11 , wherein the molding compound formed on the second surface of the IC substrate covering a plurality of sides of the VCSEL and a plurality of sides of the optical detector.
13 . The optical transceiver device of claim 12 , wherein a top surface of the molding compound is below a top surface of the VCSEL and a top surface of the optical detector.
14 . The optical transceiver device of claim 1 , wherein the VCSEL is a backside emitting VCSEL.
15 . The optical transceiver device of claim 1 , wherein the VCSEL comprises III-V materials.
16 . The optical transceiver device of claim 1 , wherein the optical detector comprises InP materials.
17 . The optical transceiver device of claim 1 , wherein a top of the VCSEL and a top of the optical detector are substantially co-planar.
18 . The optical transceiver device of claim 1 , wherein a distance between a bottom surface of the VCSEL and the second surface of the IC substrate is within a range of about 50 μm to about 100 μm.
19 . An optoelectronic assembly, comprising:
a printed circuit board (PCB);
an integrated circuit (IC) substrate operably mounted on the PCB, the IC substrate comprising active elements embedded in the IC substrate;
a vertical-cavity surface-emitting laser (VCSEL) operably mounted on a first surface of the IC substrate;
an optical detector operably mounted adjacent to the VCSEL on the first surface of the IC substrate; and
a molding compound formed on the IC substrate encapsulating a plurality of sides of the VCSEL and a plurality of sides of the optical detector,
wherein at least one active element embedded in the IC substrate provides driver operations of the VCSEL and at least one electrical communication path between an active or passive element embedded in the IC substrate and at least one of the optical detector and the VCSEL is confined within the IC substrate.
20 . The optoelectronic assembly of claim 19 , wherein the IC substrate comprises:
a plurality of conductive pillars extending along a first direction between the first surface of the IC substrate and a second surface of the IC substrate, and
a plurality of interconnection layers extending along a second direction substantially normal to the first direction.
21 . The optoelectronic assembly of claim 20 , wherein the at least one electrical communication path between the optical detector and the VCSEL confined within the IC substrate is effectuated by the plurality of conductive pillars and the plurality of interconnection layers.
22 . The optoelectronic assembly of claim 20 , wherein a first pitch between a first group of the plurality of conductive pillars underlying the optical detector is less than a second pitch between a second group of the plurality of conductive pillars underlying the VCSEL.
23 . The optoelectronic assembly of claim 19 , wherein a top of the VCSEL and a top of the optical detector are substantially co-planar.
24 . The optoelectronic assembly of claim 19 , wherein a first distance between a bottom surface of the VCSEL and the first surface of the IC substrate is within a range of about 50 μm to about 100 μm.
25 . The optoelectronic assembly of claim 19 , wherein the IC substrate is operably mounted on the PCB by a first plurality of electrical connections disposed between a first surface of the PCB and a second surface of the IC substrate, opposite to the first surface of the IC substrate.
26 . The optoelectronic assembly of claim 25 , wherein the first plurality of electrical connections includes a plurality of controlled collapse chip connections (C4s).
27 . The optoelectronic assembly of claim 19 ,
wherein the VCSEL is operably mounted on the first surface of the IC substrate by a second plurality of electrical connectors therebetween, and
wherein the optical detector is operably mounted adjacent to the VCSEL on a second surface of the IC substrate, opposite to the first surface of the IC substrate, by a third plurality of electrical connectors therebetween.
28 . The optoelectronic assembly of claim 27 , wherein the second plurality of electrical connectors include solder connections and the third plurality of electrical connectors include Cu—Cu hybrid bonding.
29 . The optoelectronic assembly of claim 19 , wherein the optical detector is separated from the VCSEL by a gap have a width within a range of ˜300 μm to ˜500 μm.
30 . The optoelectronic assembly of claim 29 , wherein the molding compound extends into the gap.
31 . The optoelectronic assembly of claim 19 , wherein a top surface of the molding compound is below a top surface of the VCSEL and a top surface of the optical detector.
32 . The optoelectronic assembly of claim 19 , wherein the VCSEL is a backside emitting VCSEL.
33 . The optoelectronic assembly of claim 19 , wherein the VCSEL comprises III-V materials.
34 . The optoelectronic assembly of claim 19 , wherein the optical detector comprises InP materials.