Multi-wire bonding test circuit for a converter
Provided is a power converter including first, second, third and fourth nodes and a wire bonding test circuit. The wire bonding test circuit includes a multiplexer having a first terminal of a first side coupled to the first node and second and third terminals of a second side. The wire bonding test circuit includes a first switch having a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to the second node. The wire bonding test circuit includes a second switch having a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to the third node. The wire bonding test circuit includes a third switch having a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to the fourth node.
1 . A power converter, comprising:
a plurality of nodes including first, second, third and fourth nodes; and
a wire bonding test circuit including:
a multiplexer having:
a first terminal of a first side coupled to the first node,
a second terminal of a second side, and
a third terminal of the second side;
a first switch having:
a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
a second terminal coupled to the second node;
a second switch having:
a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
a second terminal coupled to the third node; and
a third switch having:
a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
a second terminal coupled to the fourth node;
a first switching transistor having a first conduction terminal coupled to the second node, a second conduction terminal coupled to the third node, and a control terminal configured to receive a first driving signal; and
a second switching transistor having a first conduction terminal coupled to the third node, a second conduction terminal coupled to the fourth node, and a control terminal configured to receive a second driving signal.
2 . The power converter of claim 1 , comprising:
a plurality of pads including first, second and third pads; and
a plurality of pins including first and second pins.
3 . The power converter of claim 2 , wherein:
the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, and
the second node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire.
4 . The power converter of claim 3 , comprising:
a controller configured to operate the wire bonding test circuit in a first configuration in which a path is provided between the first and second pins for testing whether the second bonding wire or the third bonding wire is non-conductive, operating the wire bonding test circuit in the first configuration includes causing:
the multiplexer to be conductive between the first and second terminals of the multiplexer;
the first switch to be conductive; and
the second and third switches to be non-conductive.
5 . The power converter of claim 4 , wherein, in the first configuration, the controller causes a first switching transistor of the power converter to be conductive and a second switching transistor of the power converter to be non-conductive.
6 . The power converter of claim 2 , wherein:
the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, and
the third node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire.
7 . The power converter of claim 6 , comprising:
a controller configured to operate the wire bonding test circuit in a second configuration in which a path is provided between the first and second pins for testing a conductivity of the second bonding wire or the third bonding wire, operating the wire bonding test circuit in the second configuration includes causing:
the multiplexer to be conductive between the first and third terminals of the multiplexer;
the second switch to be conductive; and
the first and third switches to be non-conductive.
8 . The power converter of claim 7 , wherein, in the second configuration, the controller causes a first switching transistor of the power converter to be non-conductive and a second switching transistor of the power converter to be conductive.
9 . The power converter of claim 2 , wherein:
the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, and
the fourth node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire.
10 . A power converter, comprising:
a plurality of nodes including first, second, third and fourth nodes; and
a wire bonding test circuit including:
a multiplexer having:
a first terminal of a first side coupled to the first node,
a second terminal of a second side, and
a third terminal of the second side;
a first switch having:
a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
a second terminal coupled to the second node;
a second switch having:
a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
a second terminal coupled to the third node; and
a third switch having:
a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
a second terminal coupled to the fourth node;
a plurality of pads including first, second and third pads; and
a plurality of pins including first and second pins, wherein the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, wherein the fourth node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire
a controller configured to operate the wire bonding test circuit in a third configuration in which a path is provided between the first and second pins for testing a conductivity of the second bonding wire or the third bonding wire, operating the wire bonding test circuit in the third configuration includes causing:
the multiplexer to be conductive between the first and third terminals of the multiplexer;
the third switch to be conductive; and
the first and second switches to be non-conductive.
11 . The power converter of claim 10 , wherein, in the third configuration, the controller causes a first switching transistor of the power converter to be non-conductive and a second switching transistor of the power converter to be conductive.
12 . A method, comprising:
operating a multiplexer of a wire bonding test circuit to couple a first terminal of the multiplexer to a second terminal of the multiplexer or to couple the first terminal of the multiplexer to a third terminal of the multiplexer, wherein the first terminal of the multiplexer is coupled to a first node of a power converter;
operating a first switch of the wire bonding test circuit in a conductive or a non-conductive state, wherein the first switch has a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to a second node of the power converter;
operating a second switch of the wire bonding test circuit in a conductive or a non-conductive state, wherein the second switch has a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to a third node of the power converter; and
operating a third switch of the wire bonding test circuit in a conductive or a non-conductive state, wherein the third switch has a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to a fourth node of the power converter, wherein the power converter includes:
a first switching transistor having a first conduction terminal coupled to the second node, a second conduction terminal coupled to the third node, and a control terminal configured to receive a first driving signal; and
a second switching transistor having a first conduction terminal coupled to the third node, a second conduction terminal coupled to the fourth node, and a control terminal configured to receive a second driving signal.
13 . The method of claim 12 , wherein the power converter includes:
a plurality of pads including first, second and third pads; and
a plurality of pins including first and second pins.
14 . The method of claim 13 , wherein:
the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, and
the second node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire.
15 . The method of claim 14 , comprising:
operating, by a controller, the wire bonding test circuit in a first configuration in which a path is provided between the first and second pins for testing whether the second bonding wire or the third bonding wire is non-conductive, operating the wire bonding test circuit in the first configuration includes causing:
the multiplexer to be conductive between the first and second terminals of the multiplexer;
the first switch to be conductive; and
the second and third switches to be non-conductive.
16 . The method of claim 15 , comprising:
in the first configuration, operating, by the controller, a first switching transistor of the power converter to be conductive and a second switching transistor of the power converter to be non-conductive.
17 . The method of claim 13 , wherein:
the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, and
the third node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire.
18 . The method of claim 17 , comprising:
operating, by a controller, the wire bonding test circuit in a second configuration in which a path is provided between the first and second pins for testing a conductivity of the second bonding wire or the third bonding wire, operating the wire bonding test circuit in the second configuration includes causing:
the multiplexer to be conductive between the first and third terminals of the multiplexer;
the second switch to be conductive; and
the first and third switches to be non-conductive.
19 . The power converter of claim 10 , further comprising:
a first switching transistor having a first conduction terminal coupled to the second node, a second conduction terminal coupled to the third node, and a control terminal configured to receive a first driving signal; and
a second switching transistor having a first conduction terminal coupled to the third node, a second conduction terminal coupled to the fourth node, and a control terminal configured to receive a second driving signal.