IP Library Patent Application 18468903
Patent Application
App. No. 18/468,903

SINTERED BODY AND PARTS INCLUDING SAME

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Patent No.
US None
App. No.
18/468,903
Abstract

The sintered body including boron carbide, wherein the sintered body includes a zone, in which a volume ratio of grains having a grain size of greater than 30 μm and 60 μm or less is in a range of 50% to 70% based on a total volume of grains, as observed on a surface of the sintered body, is disclosed.

Claims (26)

1 . A sintered body comprising boron carbide, wherein the sintered body comprises a zone, in which a volume ratio of grains having a grain size of greater than 30 μm and 60 μm or less is in a range of 50% to 70% based on a total volume of grains, as observed on a surface of the sintered body.

2 . The sintered body of claim 1 , wherein a volume ratio of the grains having a grain size of 10 μm or less is in a range of 0.01% to 1% based on the total volume of grains.

3 . The sintered body of claim 1 , wherein a volume ratio of the grains having a grain size of greater than 60 μm and 80 μm or less is in a range of 12% to 20% based on the total volume of grains.

4 . The sintered body of claim 1 , wherein the sintered body has an average grain size of 30 μm to 70 μm.

5 . The sintered body of claim 1 , wherein the sintered body has a boron and carbon content of 97% by weight or more based on a total weight of the sintered body.

6 . The sintered body of claim 1 , wherein the sintered body has an etching rate of 1.8% or less, as measured according to the following Equation 1 under plasma etching conditions, where a chamber pressure is 100 mTorr, a plasma power is 800 W, an exposure time is 300 minutes, a CF 4 gas flow rate is 50 sccm, an Ar gas flow rate is 100 sccm, and an O 2 gas flow rate is 20 sccm in the chamber:

Etching Rate={(Thickness before etching−Thickness after etching)/(Thickness after etching)}×100%   [Equation 1]

7 . The sintered body of claim 1 , wherein the sintered body has a thermal conductivity at 25° C. of 23 W/mK or more and 42 W/mK or less.

8 . A sintered body comprising boron carbide, wherein the sintered body has a carbon content of 30% by weight to 43% by weight based on the total weight of the sintered body, as measured by X-ray fluorescence spectrometry.

9 . The sintered body of claim 8 , wherein the sintered body has an oxygen content of 0.1% by weight to 0.9% by weight based on the total weight of the sintered body, as measured by X-ray fluorescence spectrometry.

10 . The sintered body of claim 8 , wherein the sintered body has a silicon content of 0.05% by weight to 0.5% by weight based on the total weight of the sintered body, as measured by X-ray fluorescence spectrometry.

11 . The sintered body of claim 8 , wherein the sintered body has a boron and carbon content of 97% by weight or more.

12 . The sintered body of claim 8 , wherein the sintered body has an etching rate of 1.8% or less, as measured according to the following Equation 1 under plasma etching conditions, where a chamber pressure is 100 mTorr, a plasma power is 800 W, an exposure time is 300 minutes, a CF 4 gas flow rate is 50 sccm, an Ar gas flow rate is 100 sccm, and an O 2 gas flow rate is 20 sccm in the chamber:

Etching Rate={(Thickness before etching−Thickness after etching)/(Thickness after etching)}×100%   [Equation 1]

13 . The sintered body of claim 8 , wherein the sintered body has a thermal conductivity at 25° C. of 23 W/mK or more and 42 W/mK or less.

14 . A method of manufacturing a sintered body comprising:

thermally treating a molded body, which is manufactured by molding a raw material composition, at a temperature of 500° C. to 1,000° C., to prepare a carbonized molded body;

thermally treating the carbonized molded body at a temperature of 2,100° C. to 2,300° C. to prepare a first sintered molded body; and

thermally treating the first sintered molded body at a temperature of 2,200° C. to 2,320° C. to prepare a second sintered molded body,

wherein the raw material composition comprises boron carbide, a carbon-based material, and a sinterability enhancer.

15 . The method of claim 14 , wherein the raw material composition comprises raw material granules obtained by spray drying a raw material slurry comprising boron carbide, a carbon-based material, a sinterability enhancer, and a solvent.

16 . The method of claim 14 , wherein the first sintered molded body and the second sintered molded body are prepared by sintering at a pressure of 0.2 MPa or less.

17 . The method of claim 14 , wherein the first sintered molded body is prepared by sintering for 0.5 hours to 2 hours.

18 . The method of claim 14 , wherein the second sintered molded body is prepared by sintering for 1 hour to 3 hours.

19 . A part included in a plasma processing apparatus, wherein the part comprises the sintered body of claim 1 .

20 . A part included in a plasma processing apparatus, wherein the part comprises the sintered body of claim 8 .

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME FROM SK ENPULSE CO. TO SK ENPULSE CO., LTD PREVIOUSLY RECORDED AT REEL: 67502 FRAME: 481. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 28, 2024
From: SK ENPULSE CO., LTD.
To: SOLMICS CO., LTD.
Reel/Frame 067555/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2024
From: SK ENPULSE CO.
To: SOLMICS CO., LTD.
Reel/Frame 067502/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2023
From: MIN, KYUNG YEOL; CHOI, YONGSOO; HWANG, SUNGSIC; KIM, KYUNG IN; KANG, JUNG KUN; CHAE, SU MAN
To: SK ENPULSE CO., LTD.
Reel/Frame 064934/0970 →