Granted Patent B2

US 12,446,194 · App. 18/473,827 · Granted Oct 14, 2025

Inventor: Michael Darrill Moore (Senoia, GA)

Assignee: Panasonic Automotive Systems America, LLC.

H05K7/2049H05K7/20272

Abstract

Claims (34)

1. A cooling arrangement for electronics, the arrangement comprising:

a plurality of modular electronics enclosures, each modular electronics enclosure including:

at least one electronic component; and

a heat sink engaging the electronic component; and

a cold box having a plurality of recesses, each of the recesses being at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant, each of the recesses receiving a respective one of the modular electronics enclosures, the cold box including a plurality of springs each biasing a respective said heat sink of a respective said modular electronics enclosure against a corresponding said wall.

2. The arrangement of claim 1 wherein each said modular electronics enclosure includes a bottom cover, at least one electronic component being disposed between the heat sink and the bottom cover, each said spring of the cold box engaging a respective said bottom cover.

3. The arrangement of claim 1 wherein at least one electronic component includes a printed circuit board.

4. The arrangement of claim 1 wherein each of the recesses includes an elongate notch receiving an elongate flange of the respective one of the modular electronics enclosures.

5. The arrangement of claim 1 wherein each said spring is mounted on a second wall partially defining the recess and opposing the wall having at least one channel therein.

6. The arrangement of claim 1 further comprising a motherboard engaging an edge of the wall having at least one channel therein.

7. The arrangement of claim 1 wherein the spring comprises a flat spring that is configured to be increasingly compressed by the respective modular electronics enclosure as the respective modular electronics enclosure is inserted into its respective said recess of the cold box.

8. A cooling arrangement for electronics, the arrangement comprising:

two modular electronics enclosures, each modular electronics enclosure including:

at least one electronic component; and

a heat sink engaging the electronic component; and

a cold box having two recesses, each of the recesses being at least partially defined by a common wall disposed between the two recesses, the common wall having at least one channel therein carrying liquid coolant, each of the recesses receiving a respective one of the modular electronics enclosures, the cold box including two springs each biasing a respective said heat sink of a respective said modular electronics enclosure against a respective side of the common wall.

9. The arrangement of claim 8 wherein each said modular electronics enclosure includes a bottom cover, at least one electronic component being disposed between the heat sink and the bottom cover, each said spring of the cold box engaging a respective said bottom cover.

10. The arrangement of claim 8 wherein at least one electronic component includes a printed circuit board.

11. The arrangement of claim 8 wherein each of the recesses includes an elongate notch receiving an elongate flange of the respective one of the modular electronics enclosures.

12. The arrangement of claim 8 wherein each said spring is mounted on a second wall partially defining the recess and opposing the common wall.

13. The arrangement of claim 8 further comprising a motherboard engaging an edge of the common.

14. The arrangement of claim 8 wherein the spring comprises a flat spring that is configured to be increasingly compressed by the respective modular electronics enclosure as the respective modular electronics enclosure is inserted into its respective said recess of the cold box.

15. A cooling arrangement for electronics, the arrangement comprising:

a plurality of modular electronics enclosures, each modular electronics enclosure including:

at least one electronic component; and

a heat sink engaging the electronic component;

a cold box having a plurality of recesses, each of the recesses being at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant, each of the recesses receiving a respective one of the modular electronics enclosures, the cold box including a plurality of springs each biasing a respective said heat sink of a respective said modular electronics enclosure against a respective said wall;

a radiator in fluid communication with the channel; and

a pump in fluid communication with the channel and the radiator, the pump being configured to circulate the liquid coolant through the channel and the radiator.

16. The arrangement of claim 15 wherein each said modular electronics enclosure includes a bottom cover, at least one electronic component being disposed between the heat sink and the bottom cover, each said spring of the cold box engaging a respective said bottom cover.

17. The arrangement of claim 15 wherein each of the recesses includes an elongate notch receiving an elongate flange of the respective one of the modular electronics enclosures.

18. The arrangement of claim 15 wherein each said spring is mounted on a second wall partially defining the recess and opposing the wall having at least one channel therein.

19. The arrangement of claim 15 further comprising a motherboard engaging an edge of the wall having at least one channel therein.

20. The arrangement of claim 15 wherein the spring comprises a flat spring that is configured to be increasingly compressed by the respective modular electronics enclosure as the respective modular electronics enclosure is inserted into its respective said recess of the cold box.

Assignments (3)

Continuity (2)

References Cited (19)