SINGLE ENDED EAM WITH ELECTRICAL COMBINING
Disclosed here are systems, methods, and apparatuses for single-ended electro-absorption modulators (EAMs) with electrical combining. In particular, systems and methods are disclosed for performing optical encoding and multiplication operation for optical signal without applying a sign value. The optical output can be converted into a photocurrent input and the sign value can be applied to the photocurrent input on an electrical layer.
1 . A device comprising:
an optical layer having one or more modulators for optically encoding a first matrix and a second matrix and performing a multiplication operation using the first and the second matrix to produce an optical signal output; and
an electrical layer connected to the optical layer, wherein the optical signal output is provided to the electrical layer where a sign value is applied.
2 . The device of claim 1 , further including a direct-detection PD, and wherein the direct-detection PD converts the optical signal output into a photocurrent input.
3 . The device of claim 2 , wherein the photocurrent input is transmitted into an integrated circuit.
4 . The device of claim 3 , wherein integrated circuit is an application-specific integrated circuit (ASIC).
5 . The device of claim 2 , further including one or more switches on the electrical layer, wherein the one or more switches performs an XOR operation to apply the sign value to the photocurrent input.
6 . The device of claim 2 , further including performing a summation with the photocurrent input after the sign value has been applied to the photocurrent input.
7 . The device of claim 1 , wherein the one or more modulators perform the multiplication operation by successively amplitude modulating light with the first and the second matrix.
8 . The device of claim 1 , wherein the one or more modulators are electro-absorption modulators.
9 . The device of claim 1 , wherein the electrical layer is connected to the optical layer via an electrical interconnect.
10 . The device of claim 9 , wherein the electrical interconnect is a copper pillar of less than 2 millimeters (mm) in length.
11 . A method comprising:
performing a multiplication operation using a first matrix and a second matrix in an optical layer having one or more modulators for optically encoding the first and the second matrix to produce an optical signal output;
providing the optical signal output to an electrical layer;
converting the optical signal output into a photocurrent input; and
applying a sign value to the photocurrent input in the electrical layer.
12 . The method of claim 11 , wherein converting the optical signal output into the photocurrent input is done at a direct-detection PD.
13 . The method of claim 12 , wherein the photocurrent input from the direct-detection PD is transmitted into an integrated circuit.
14 . The method of claim 13 , wherein the integrated circuit is an application-specific integrated circuit (ASIC).
15 . The method of claim 11 , wherein applying the sign value to the photocurrent input in the electrical layer further comprises performing an XOR operation.
16 . The method of claim 11 , wherein performing the multiplication operation using the first matrix and the second matrix further includes successively amplitude modulating light with the first and the second matrix.
17 . The method of claim 11 , wherein the one or more modulators are electro-absorption modulators.
18 . The method of claim 11 , wherein the electrical layer is connected to the optical layer via an electrical interconnect.
19 . The method of claim 18 , wherein the electrical interconnect is a copper pillar of less than 2 millimeters (mm) in length.
20 . The method of claim 11 , further comprising performing a summation with the photocurrent input after the sign value has been applied to the photocurrent input.