IP Library Granted Patent US 12,644,789
Granted Patent B2
US 12,644,789 · App. 18/476,114 · Granted Jun 2, 2026

Pressure sensor with flat flange and central elevated portion

Inventors: Luca Maggi (Garlate, IT); Marco Del Sarto (Monza, IT); Alex Gritti (Vimercate, IT)
Assignee: STMicroelectronics International N.V.
G01L19/143G01L19/0069G01L19/0645
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Quick Facts
Patent No.
US 12,644,789
App. No.
18/476,114
Granted
Jun 2, 2026
Kind
B2
Abstract

A sensor module includes an organic substrate, a MEMS pressure sensor mounted to the organic substrate, and a unitary lid mounted on the substrate. The unitary lid includes a central elevated portion housing the MEMS pressure sensor, an aperture in the central elevated portion, and a flat flange extending from the central elevated portion to an edge of the organic substrate.

Claims (37)

1 . A sensor module, comprising:

an organic substrate;

a MEMS pressure sensor mounted to the substrate;

a unitary lid mounted on the substrate and including:

a central elevated portion housing the MEMS pressure sensor;

an aperture in the central elevated portion; and

a flat flange extending from the central elevated portion toward an edge of the organic substrate, wherein a width of the flat flange from a first edge of the flat flange to an opposite edge of flat flange is at least five times as large as a height of the central elevated portion.

2 . The sensor module of claim 1 , comprising an ASIC electrically coupled to the MEMS pressure sensor and mounted on the substrate below the central elevated portion.

3 . The sensor module of claim 1 , comprising a sealing gel within central elevated portion.

4 . The sensor module of claim 1 , wherein the central elevated portion is less than 3 mm in height above the substrate.

5 . The sensor module of claim 1 , wherein the central aperture is less than 1 mm in diameter.

6 . The sensor module of claim 1 , wherein the substrate has a rectangular surface having four lateral edges, wherein the flat flange extends to within 0.2 mm of each lateral edge.

7 . The sensor module of claim 1 , wherein the flange has grooves in a top surface.

8 . The sensor module of claim 1 , wherein the organic substrate has a circular top surface, wherein the flange has a circular edge.

9 . A method, comprising:

mounting a MEMS pressure sensor on a substrate;

mounting a unitary lid on the substrate, the unitary lid including:

a central elevated portion housing the MEMS pressure sensor;

an aperture in the central elevated portion; and

a flat flange extending from the central elevated portion to an edge of the substrate, wherein a width of the flat flange from a first edge of the flat flange to an opposite edge of flat flange is at least five times as large as a height of the central elevated portion;

partially filling the central elevated portion with a sealing gel;

performing a first curing process of the sealing gel;

filling a remainder of the central elevated portion with the sealing gel after performing the first curing process; and

performing a second curing process of the sealing gel.

10 . The method of claim 9 , wherein mounting the unitary lid to the substrate includes gluing the flange to the substrate.

11 . The method of claim 9 , comprising mounting an ASIC to the substrate prior to mounting the unitary lid to the substrate.

12 . The method of claim 9 , comprising gluing a housing of an electronic device to a top surface of the flange.

13 . The method of claim 12 , wherein the gluing the housing to the top surface of the flange includes gluing the housing to a grooved portion of the top surface.

14 . The method of claim 9 , wherein the unitary lid is stainless steel.

15 . The method of claim 9 , wherein the central elevated portion is less than 3 mm in height above the substrate.

16 . The method of claim 9 , wherein the substrate has a rectangular surface having four lateral edges, wherein the flat flange extends to within 1 mm of each lateral edge.

17 . A method, comprising:

generating, with a MEMS pressure sensor coupled to a substrate, analog pressure signals;

receiving, with an ASIC electrically coupled to the MEMS pressure sensor, digital pressure signals based on the analog pressure signals;

passing the digital pressure signals to a control circuit of an electronic device, wherein the MEMS pressure sensor and the ASIC are positioned within a central elevated portion of a unitary lid mounted on the substrate and including an aperture in the central elevated portion and a flat flange extending from the central elevated portion to an edge of the substrate, wherein a width of the flat flange from a first edge of the flat flange to an opposite edge of flat flange is at least five times as large as a height of the central elevated portion.

18 . The method of claim 17 , wherein the electronic device is a smart watch.

19 . The method of claim 17 , wherein the electronic device is a smart phone.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2023
From: MAGGI, LUCA; DEL SARTO, MARCO; GRITTI, ALEX
To: STMICROELECTRONICS S.R.L.
Reel/Frame 065067/0660 →
Continuity (1)
Related Publication 20250102391A1 · Mar 27, 2025
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