IP Library Granted Patent US 12,371,760
Granted Patent B2
US 12,371,760 · App. 18/480,674 · Granted Jul 29, 2025

Apparatus and method for production of high purity copper-based alloys

Inventor: Timothy Frederick Strelitz (Long Beach, CA)
Assignee: Doggone Investment Co. LLC
C22C1/02C22C9/00F27B3/22F27B14/04F27B14/061F27D1/1626C22C9/02C22C9/04C22C9/06F27B2014/0843F27D2007/063H05B6/02
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Quick Facts
Patent No.
US 12,371,760
App. No.
18/480,674
Granted
Jul 29, 2025
Kind
B2
Abstract

In an aspect, a method of manufacturing a high purity copper-based alloy comprises providing in a melting furnace a feedstock and melting the feedstock. The method additionally includes bubbling an inert gas into the molten copper-based alloy to form the high purity copper-based alloy. Aspects are also directed to an apparatus and a method of fabricating an apparatus for manufacturing the high purity copper-based alloy.

Claims (24)

1. An apparatus for manufacturing a copper-based alloy, the apparatus comprising:

a melting furnace configured to form a molten copper-based alloy comprising at least 50 weight % copper and to bubble-an inert gas through the molten copper-based alloy using a diffusive lining comprising an aluminum-silicate to contact the molten copper-based alloy; and

a transfer ladle configured to receive the molten copper-based alloy and to transfer the molten copper-based alloy into one or more molds or a shot pit configured to solidify the molten copper-based alloy.

2. The apparatus of claim 1 , further comprising a velocity control element configured to receive the molten copper-based alloy from the melting furnace and to transfer the molten copper-based alloy to the transfer ladle at a first controlled velocity.

3. The apparatus of claim 2 , wherein the velocity control element comprises a ramp.

4. The apparatus of claim 3 , wherein the first controlled velocity is less than 100 in/s.

5. The apparatus of claim 2 , further comprising a second velocity control element configured to receive the molten copper-based alloy from the transfer ladle and to transfer the molten copper-based alloy to the one or more molds or the shot pit at a second controlled velocity different from the first controlled velocity.

6. The apparatus of claim 5 , wherein the second velocity control element comprises a second ramp.

7. The apparatus of claim 6 , wherein the second controlled velocity is less than 30 in/s.

8. The apparats of claim 1 , wherein the diffusive lining is disposed at a bottom inner surface of the melting furnace.

9. The apparatus of claim 8 , wherein the diffusive lining comprises mullite.

10. The apparatus of claim 8 , wherein the diffusive lining substantially covers the bottom inner surface of the melting furnace.

11. The apparatus of claim 8 , wherein the diffusive lining is further disposed at a side inner surface of the melting furnace such that the diffusive lining is adapted for bubbling the inert gas into the molten copper-based alloy from the bottom and side inner surfaces.

12. An apparatus for manufacturing a copper-based alloy, the apparatus comprising:

a melting furnace configured to form a molten copper-based alloy comprising at least 50 weight % copper and to bubble an inert gas through the molten copper-based alloy using a diffusive lining comprising an aluminum-silicate to contact the molten copper-based alloy; and

a velocity control element configured to receive the molten copper-based alloy from the melting furnace and to transfer the molten copper-based alloy to a transfer ladle at a first controlled velocity.

13. The apparatus of claim 12 , wherein the transfer ladle is configured to receive the molten copper-based alloy from the velocity control element, and to transfer the molten copper-based alloy into one or more molds or a shot pit configured to solidify the molten copper-based alloy.

14. The apparatus of claim 13 , wherein the velocity control element comprises a ramp.

15. The apparatus of claim 14 , wherein the first controlled velocity is less than 100 in/s.

16. The apparatus of claim 13 , further comprising a second velocity control element configured to transfer the molten copper-based alloy from the transfer ladle to the one or more molds or the shot pit at a second controlled velocity different from the first controlled velocity.

17. The apparatus of claim 16 , wherein the second velocity control element comprises a second ramp.

18. The apparatus of claim 17 , wherein the second controlled velocity is less than 30 in/s.

19. The apparatus of claim 12 , wherein the diffusive lining substantially covers a bottom inner surface of the melting furnace.

20. The apparatus of claim 19 , wherein the diffusive lining is further disposed at a side inner surface of the melting furnace such that the diffusive lining is adapted for bubbling the inert gas into the molten copper-based alloy from the bottom and side inner surfaces.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2023
From: STRELITZ, TIMOTHY FREDERICK
To: DOGGONE INVESTMENT CO. LLC
Reel/Frame 065127/0472 →
Continuity (4)
Continuation 18295700 · Apr 4, 2023
Provisional Application 63387076 · Dec 12, 2022
Provisional Application 63362509 · Apr 5, 2022
Related Publication 20240279775A1 · Aug 22, 2024
References Cited (79)
US 2674639A · Stevenson · 1954 [cited by applicant]
US 2828813A · Holden · 1958 [cited by applicant]
US 3053525A · Leroy et al. · 1962 [cited by applicant]
US 3652068A · Truppe et al. · 1972 [cited by applicant]
US 3753690A · Emley et al. · 1973 [cited by applicant]
US 3836613A · Granitzki et al. · 1974 [cited by applicant]
US 3837630A · Kohl et al. · 1974 [cited by applicant]
US 3938790A · Knuppel et al. · 1976 [cited by applicant]
US 4222782A · Alliegro et al. · 1980 [cited by applicant]
US 4272062A · Fuziwara et al. · 1981 [cited by applicant]
US 4331471A · Langenfeld et al. · 1982 [cited by applicant]
US 4340208A · Vayssiere et al. · 1982 [cited by applicant]
US 4353534A · Janssen et al. · 1982 [cited by applicant]
US 4468012A · Daussan et al. · 1984 [cited by applicant]
US 4705563A · Poeppel et al. · 1987 [cited by applicant]
US 4762305A · Rice · 1988 [cited by applicant]
US 4935390A · Horiuchi et al. · 1990 [cited by applicant]
US 4960738A · Hori et al. · 1990 [cited by applicant]
US 4973433A · Gilbert · 1990 [cited by applicant]
US 4989218A · Tateno · 1991 [cited by applicant]
US 5007366A · Handler · 1991 [cited by applicant]
US 5037471A · Iwamura et al. · 1991 [cited by applicant]
US 5143355A · Iwamura et al. · 1992 [cited by applicant]
US 5180423A · Marcuson et al. · 1993 [cited by applicant]
US 5198179A · Bates · 1993 [cited by applicant]
US 5241560A · Omori et al. · 1993 [cited by applicant]
US 5257280A · Mimura et al. · 1993 [cited by applicant]
US 5465943A · Rinnhofer et al. · 1995 [cited by applicant]
US 5495495A · Cullan · 1996 [cited by applicant]
US 6180183B1 · Wentland et al. · 2001 [cited by applicant]
US 6231641B1 · Utigard et al. · 2001 [cited by applicant]
US 6245287B1 · Kokubo et al. · 2001 [cited by applicant]
US 6309211B1 · Dock et al. · 2001 [cited by applicant]
US 7524356B2 · Asao et al. · 2009 [cited by applicant]
US 11851730B2 · Strelitz · 2023 [cited by applicant]
US 11993828B2 · Strelitz · 2024 [cited by applicant]
US 20040100004A1 · Willoughby et al. · 2004 [cited by applicant]
US 20040248739A1 · Willoughby et al. · 2004 [cited by applicant]
US 20080078484A1 · Johns · 2008 [cited by applicant]
US 20090000288A1 · DeVoe · 2009 [cited by applicant]
US 20090165902A1 · Yoshida · 2009 [cited by examiner]
US 20100044002A1 · Leffew · 2010 [cited by applicant]
US 20130276680A1 · Piret et al. · 2013 [cited by applicant]
US 20140248739A1 · Bakke et al. · 2014 [cited by applicant]
US 20140369883A1 · Ito et al. · 2014 [cited by applicant]
US 20190113282A1 · Feiner et al. · 2019 [cited by applicant]
US 20230349026A1 · Strelitz · 2023 [cited by applicant]
CN 101274363A · 2008 [cited by applicant]
CN 101708510B · 2011 [cited by applicant]
CN 202522062U · 2012 [cited by applicant]
CN 103658567A · 2014 [cited by applicant]
CN 105603225A · 2016 [cited by applicant]
DE 1807001A1 · 1970 [cited by applicant]
EP 1260289A1 · 2002 [cited by applicant]
EP 1750075A1 · 2007 [cited by applicant]
FR 1246828A · 1960 [cited by applicant]
FR 2671563A1 · 1992 [cited by applicant]
GB 671678A · 1952 [cited by applicant]
JP H03285739A · 1991 [cited by applicant]
KR 101965768B1 · 2019 [cited by examiner]
Andreini et al., “Characterization of Gas Bubbles Injected into Molten Metals Under Laminar Flow Conditions”, Metallurgical Transactions B, vol. 8B, Dec. 1977, pp. 625-631. [cited by applicant]
Campell, “The Mechanisms of Metallurgical Failure the Origin of Fracture”, ISBN: 978-0-12-822411-3 in 3 pages. [cited by applicant]
Copper Development Association Inc., Copper Alloy Data Sheet C96400 in 10 pages. [cited by applicant]
Copper Development Association Inc., Copper Alloy Data Sheet C99500 in 9 pages. [cited by applicant]
Copper Development Association Inc., Copper Alloy Data Sheet C89833 in 8 pages. [cited by applicant]
Copper Development Association Inc., Copper Alloy Data Sheet C87850 in 9 pages. [cited by applicant]
Friedrich et al., “Melt treatment of Copper and Aluminium—The complex step before casting”, Continuous Casting: Proceedings of the International Conference on Continuous Casting of Non-Ferrous Metals, Nov. 2005 in 21 pa… [cited by applicant]
Hornby et al., “Spal Process: Inert Atmosphere Protection of Molten Metal”, ResearchGate, Mar. 1988 in 28 pages. [cited by applicant]
Total Materia, “Melting and Casting of Copper and Aluminum Alloys: Part One”, Total Materia(totalmateria.com, published Jul. 2008 in 4 pages. [cited by applicant]
Saint-Gobain Ceramics, Technical Bulletin, Norton@ Dry Vibration Refractory VK-132, Refractor Material Data Sheet in 1 page. [cited by applicant]
Shabestari et al., “Metallurgy Effect of process variables in rotary degassing of aluminum”, ResearchGate, Article in CIM Bulletin, Feb. 2021 in 6 pages. [cited by applicant]
Teshigawara et al., “A Shaft Furnace Line for Producing Oxygen-Free Copper for Electron Devices Applications”, Furukawa Review, No. 25, 2004, pp. 53-58. [cited by applicant]
Uceda et al., “Electrochemical evaluation of Copper deposition with gas sparging”, Journal of Applied Electrochemistry, vol. 20, 1990, pp. 327-334. [cited by applicant]
Zavertkin, “Use of Vein Quartz For Lining Induction Furnaces During Melting Copper-Based Alloys”, Refractories and Industrial Ceramics, vol. 60, Issue 5, Jan. 2020, pp. 468-471. [cited by applicant]
International Search Report and Written Opinion dated Aug. 4, 2023 in Application No. PCT/US2023/017481 in 14 pages. [cited by applicant]
International Search Report and Written Opinion dated Aug. 11, 2023 in Application No. PCT/US2023/017483 in 18 pages. [cited by applicant]
International Search Report and Written Opinion dated Aug. 4, 2023 in Application No. PCT/US2023/017487 in 19 pages. [cited by applicant]
International Search Report and Written Opinion dated Aug. 27, 2024 in Application No. PCT/US2024/022892 in 21 pages. [cited by applicant]
International Search Report and Written Opinion dated Jul. 3, 2024 in Application No. PCT/US2024/022896 in 18 pages. [cited by applicant]