IP Library Patent Application 18486426
Patent Application
App. No. 18/486,426

QUANTUM DOT COMPOSITE STRUCTURE AND A FORMING METHOD THEREOF

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Quick Facts
Patent No.
US None
App. No.
18/486,426
Abstract

A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.

Claims (30)

1 . A quantum dot composite structure, comprising:

a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and

an inorganic protective layer disposed on the glass particle and covering the exposed surface.

2 . The quantum dot composite structure as claimed in claim 1 , wherein a thickness of the inorganic protective layer is greater than or equal to 1 nm and less than or equal to 500 nm.

3 . The quantum dot composite structure as claimed in claim 1 , wherein the inorganic protective layer comprises inorganic oxide.

4 . The quantum dot composite structure as claimed in claim 1 , wherein the glass matrix comprises phosphosilicate glass, tellurite glass, borosilicate glass, borogermanate glass or combinations thereof.

5 . The quantum dot composite structure as claimed in claim 1 , wherein the inorganic protective layer comprises:

a first protective layer covering the glass particle and directly contacting the exposed surface; and

a second protective layer disposed on the first protective layer, wherein the first protective layer is located between the glass particle and the second protective layer.

6 . The quantum dot composite structure as claimed in claim 5 , wherein a thickness of the first protective layer is less than that of the second protective layer.

7 . The quantum dot composite structure as claimed in claim 5 , wherein a density of the first protective layer is larger than that of the second protective layer.

8 . The quantum dot composite structure as claimed in claim 5 , wherein the first protective layer comprises a plurality of sublayers.

9 . The quantum dot composite structure as claimed in claim 5 , wherein a shape of the first protective layer is conformal to that of the glass particle.

10 . The quantum dot composite structure as claimed in claim 5 , wherein the first protective layer is an inorganic oxide layer formed by an atomic layer deposition process and the second protective layer is an inorganic oxide layer formed by a sol-gel process.

11 . The quantum dot composite structure as claimed in claim 1 , wherein an emission wavelength of the plurality of quantum dots is larger than or equals to 300 nm and less than or equals to 800 nm.

12 . A method of forming a quantum dot composite structure, comprising:

providing a glass particle comprising a plurality of quantum dots;

forming a first protective layer on the glass particle by an atomic layer deposition (ALD) process to make the first protective layer cover the glass particle conformally; and

forming a second protective layer on the first protective layer by a sol-gel process to make the second protective layer cover the first protective layer.

13 . The method as claimed in claim 12 , wherein a reaction temperature of the ALD process and the sol-gel process is larger than or equals to 60° C. and less than or equals to 180° C.

14 . The method as claimed in claim 13 , wherein tris(dimethylamino)silane and ozone react at a temperature greater than or equal to 75° C. and less than or equal to 90° C. to form the first protective layer during the ALD process.

15 . The method as claimed in claim 13 , wherein azobisisobutyronitrile (AIBN) is used as an initiator to make polydimethylsiloxane (PDMS), tetraethoxysilane (TEOS), and dibutyltin dilaurate (DBTL) react at a temperature greater than or equal to 75° C. and less than or equal to 90° C. to form the second protective layer during the sol-gel process.

16 . The method as claimed in claim 12 , wherein the step of providing the glass particle further comprises:

forming a glass bulk by a melt-quench process;

performing a grinding process to break the glass bulk into the glass particles; and

performing a particle size screening process to select the glass particles with an average diameter greater than or equal to 20 μm and less than or equal to 50 μm.

17 . The method as claimed in claim 12 , wherein a thickness of the first protective layer is less than that of the second protective layer.

18 . The method as claimed in claim 12 , wherein a total thickness of the first protective layer and the second protective layer is less than or equal to 500 nm.

19 . The method as claimed in claim 12 , wherein a density of the first protective layer is larger than that of the second protective layer.

20 . The method as claimed in claim 12 , wherein the step of forming the first protective layer comprises forming a plurality of sublayers.

Assignments (2)
MERGER Recorded Apr 24, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075474/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2023
From: LIU, CHING; HUANG, WEN-TSE; LIU, RU-SHI; YAN, PEI-CONG; HSIEH, CHAI CHUN; TONG, HUNG-CHUN; LEE, YU-CHUN; TSAI, TZONG-LIANG
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 065210/0802 →