DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

1 . A display device comprising:

a lower electrode;

a rib comprising a pixel aperture which overlaps the lower electrode;

a partition which includes a lower portion provided on the rib, a first layer provided on the lower portion and protruding from a side surface of the lower portion, and a second layer provided on the first layer and having a width less than a width of the first layer;

an organic layer which covers the lower electrode through the pixel aperture and emits light based on application of voltage; and

an upper electrode which covers the organic layer and is in contact with the side surface of the lower portion.

2 . The display device of claim 1 , wherein

an upper surface of the first layer comprises:

a first area covered with the second layer; and

a second area exposed from the second layer.

3 . The display device of claim 2 , wherein

the second area is covered with part of the organic layer.

4 . The display device of claim 3 , wherein

at least a part of an upper surface of the second layer is covered with another part of the organic layer.

5 . The display device of claim 2 , wherein

the second area includes a pair of second areas, and

the first area is located between the second areas in a width direction of the partition.

6 . The display device of claim 1 , wherein

the width of the second layer is greater than a width of the lower portion.

7 . The display device of claim 6 , wherein

both end portions of the second layer in a width direction of the partition protrude relative to the side surfaces of the lower portion in the width direction.

8 . The display device of claim 1 , wherein

the second layer is thicker than the first layer.

9 . The display device of claim 1 , wherein

a total thickness of the first layer and the second layer is less than or equal to half of a thickness of the lower portion.

10 . The display device of claim 1 , wherein

the first layer is formed of a metal material, and

the second layer is formed of an inorganic insulating material.

11 . The display device of claim 1 , wherein

the first layer is formed of a metal material, and

the second layer is formed of a conductive oxide.

12 . The display device of claim 1 , wherein

each of the first layer and the second layer is formed of a metal material.

13 . The display device of claim 1 , further comprising a sealing layer which covers a thin film including the organic layer and the upper electrode, wherein

the rib and the sealing layer are formed of inorganic insulating materials.

14 . The display device of claim 13 , wherein

the thin film further includes an optical adjustment layer located between the upper electrode and the sealing layer.

15 . A manufacturing method of a display device, the method including:

forming a lower electrode;

forming a rib comprising a pixel aperture which overlaps the lower electrode;

forming a partition which includes a lower portion provided on the rib, a first layer provided on the lower portion and protruding from a side surface of the lower portion, and a second layer provided on the first layer and having a width less than a width of the first layer;

forming an organic layer which covers the lower electrode through the pixel aperture and emits light based on application of voltage; and

forming an upper electrode which covers the organic layer and is in contact with the side surface of the lower portion.

16 . The manufacturing method of claim 15 , wherein

the forming the partition includes:

forming a metal layer on the rib;

forming a first thin film on the metal layer;

forming a second thin film on the first thin film;

providing a first resist having a shape corresponding to the partition on the second thin film;

forming the second layer having a width less than a width of the first resist by removing, of the second thin film, a portion exposed from the first resist by etching and reducing a width of the second thin film;

forming the first layer by removing, of the first thin film, a portion exposed from the first resist by etching; and

forming the lower portion having a width less than the width of the first layer by removing, of the metal layer, a portion exposed from the first resist by etching and reducing a width of the metal layer.

17 . The manufacturing method of claim 15 , further including:

forming a sealing layer which covers a thin film including the upper electrode and the organic layer;

providing a second resist on the sealing layer; and

removing, of the sealing layer and the thin film, portions exposed from the second resist.