ANTIMICROBIAL AGENT FOR COATING COMPOSITION
A microbe-resistant coating composition or paint including an antimicrobial agent is described. The antimicrobial agent is an inorganic bismuth-containing compound, and may be used in conjunction with other bismuth-containing compounds or other biocidal agents or methods. A method of treating an electrodeposition system for bacterial and/or fungal contamination is also described by adding an antimicrobial agent to at least a portion of the electrodeposition system.
1 .- 20 . (canceled)
21 . A method of reducing microbial contamination in an electrodeposition composition, comprising:
a) providing an effective amount of at least one antimicrobial agent as part of a pigment paste included in the electrodeposition composition,
wherein the electrodeposition composition is present in an electrodeposition system,
wherein the at least one antimicrobial agent comprises at least one inorganic bismuth-containing compound,
wherein the at least one inorganic bismuth-containing compound comprises bismuth aluminate,
wherein the electrodeposition composition further comprises at least one binder resin component, and
wherein the antimicrobial agent includes about 0.1% to 10% by weight of bismuth aluminate, based on the total weight of resin solids of the at least one binder resin component in the electrodeposition composition;
b) adding the antimicrobial agent to the electrodeposition composition within at least a part of the electrodeposition system;
c) monitoring bacterial and fungal growth in the electrodeposition system at regular intervals; and
d) adding an additional amount of the antimicrobial agent to the electrodeposition composition within the electrodeposition system to reduce the microbial population by at least 5% after seven days; and
wherein the antimicrobial agent is used as part of a continuous electrocoating process to control microorganisms in an electrodeposition system.
22 . The method of claim 21 , wherein the microbial population comprises sessile microorganisms and motile microorganisms.
23 . The method of claim 21 , wherein the at least one antimicrobial agent further comprises an organic bismuth-containing compound including bismuth citrate.
24 . The method of claim 23 , wherein the antimicrobial agent includes about 0.1% to 5% by weight of bismuth aluminate, based on the total weight of resin solids of the at least one binder resin component in the electrodeposition composition
25 . The method of claim 21 , wherein the electrodeposition system is a cathodic system.
26 . The method of claim 21 , wherein the electrodeposition system is an anodic system
27 . The method of claim 21 , wherein the electrodeposition system exhibits no growth of microbial colonies after the addition of the additional amount of the antimicrobial agent to the electrodeposition system.
28 . The method of claim 21 , wherein the antimicrobial agent is added to the electrodeposition composition within an electrodeposition bath of the electrodeposition system.
29 . The method of claim 21 , wherein the antimicrobial agent is added to the electrodeposition composition while the continuous electrocoating process is in operation.
30 . The method of claim 21 , wherein the antimicrobial agent is added to the electrodeposition composition before the start of the continuous electrocoating process.
31 . The method of claim 21 , further comprising:
circulating the antimicrobial agent through the electrodeposition system for a fixed period of time.
32 . A microbial contamination treatment system for an electrocoating process, comprising:
at least one dispensing apparatus for dispensing an effective amount of at least one antimicrobial agent to at least one system of the electrocoating process, wherein:
the at least one antimicrobial agent is dispersed in an electrocoating solution;
the at least one antimicrobial agent comprises at least one inorganic bismuth-containing compound,
the at least one inorganic bismuth-containing compound comprises bismuth aluminate,
the electrocoating solution further comprises at least one binder resin component,
the at least one antimicrobial agent includes about 0.1% to 10% by weight of bismuth aluminate, based on the total weight of resin solids of the at least one binder resin component,
the electrocoating process comprises a plurality of systems, and
an amount of the at least one antimicrobial agent is dispensed to the electrocoating solution within the electrocoating process to reduce a microbial population by at least 5% after seven days.
33 . The microbial contamination treatment system of claim 32 , wherein the microbial population comprises sessile microorganisms and motile microorganisms.
34 . The method of claim 32 , wherein the at least one antimicrobial agent further comprises an organic bismuth-containing compound including bismuth citrate.
35 . The method of claim 34 , wherein the at least one antimicrobial agent includes about 0.1% to 5% by weight of bismuth aluminate, based on the total weight of resin solids of the at least one binder resin component.
36 . The method of claim 32 , wherein the electrocoating process is a cathodic system.
37 . The method of claim 32 , wherein the electrocoating process is an anodic system
38 . The method of claim 32 , wherein the electrocoating process exhibits no growth of microbial colonies after the addition of the amount of the at least one antimicrobial agent to the electrocoating process.
39 . The method of claim 32 , wherein the at least one antimicrobial agent is added to the electrocoating process within an electrodeposition bath system of the electrocoating process.