Electronic device
An electronic device is provided. The electronic device includes a substrate, a plurality of diodes, at least one transistor, a chip, a conductive layer and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The plurality of diodes are disposed on the first surface of the substrate. The at least one transistor is disposed on the first surface of the substrate and electrically connected to at least one of the plurality of diodes. The chip is disposed on the second surface of the substrate and electrically connected to the at least one transistor. The conductive layer is disposed between the substrate and the chip. The protection layer is disposed between the conductive layer and the chip. Moreover, the protection layer has an opening and through which the chip is electrically connected to the conductive layer.
1 . An electronic device, comprising:
a substrate having a first surface, a second surface opposite to the first surface, a first side surface, a second side surface opposite to the first side surface and a plurality of through holes penetrating from the first surface to the second surface, wherein the first side surface and the second side surface are connected to the first surface and the second surface respectively;
a plurality of diodes disposed on the first surface of the substrate;
at least one transistor disposed on the first surface of the substrate and electrically connected to at least one of the plurality of diodes;
a chip disposed on the second surface of the substrate and electrically connected to the at least one transistor;
a conductive layer disposed between the substrate and the chip; and
a protection layer disposed between the conductive layer and the chip, wherein the protection layer has an opening and through which the chip is electrically connected to the conductive layer,
wherein, in a cross-sectional view of the electronic device, the chip has a first side surface and a second side surface opposite to the first side surface of the chip, the first side surface of the chip is closer to the first side surface of the substrate than the second side surface of the chip, a distance along a first direction parallel to the first surface of the substrate between the first side surface of the chip and the first side surface of the substrate is less than a distance along the first direction between the second side surface of the chip and the second side surface of the substrate, a first through hole and a second through hole of the plurality of through holes are adjacent to the first side surface of the substrate, the first through hole is disposed between the first side surface of the substrate and the second through hole, and the distance along the first direction between the first side surface of the chip and the first side surface of the substrate is greater than a distance along the first direction between the first side surface of the substrate and one of the plurality of diodes closest to the first side surface of the substrate and less than a distance along the first direction between the first side surface of the substrate and the second through hole.
2 . The electronic device as claimed in claim 1 , wherein a material of the substrate comprises glass, polyimide, or a combination thereof.
3 . The electronic device as claimed in claim 1 , further comprising a conductive material disposed in the opening.
4 . The electronic device as claimed in claim 3 , wherein the conductive material comprises metal alloy, solder paste, silver glue, or a combination thereof.
5 . The electronic device as claimed in claim 3 , wherein the conductive material comprises an anisotropic conductive film.
6 . The electronic device as claimed in claim 1 , wherein the at least one of the plurality of diodes is configured to produce an electromagnetic radiation.
7 . The electronic device as claimed in claim 6 , wherein the electromagnetic radiation is a visible light.
8 . The electronic device as claimed in claim 1 , further comprising an insulating layer disposed between the substrate and the plurality of diodes.
9 . The electronic device as claimed in claim 1 , further comprises a plurality of conductive structures disposed in the substrate.
10 . The electronic device as claimed in claim 9 , wherein the chip is electrically connected to the at least one transistor through at least one of the plurality of conductive structures.