THROUGH BOARD VIA HEAT SINK
An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls. The cooling plate comprises the thermally conductive material and the thermally conductive material within the plurality of openings forms extensions from the cooling plate.
1 . An electronic device, comprising:
an integrated circuit component including a plurality of solder balls on one side;
a substrate including a first side adjacent the one side of the integrated circuit component, the substrate including a plurality of openings in the substrate, at least some of the plurality of openings being aligned with the solder balls;
a cooling plate situated toward a second side of the substrate; and
a thermally conductive material within the plurality of openings and thermally coupled with the cooling plate, at least some of the thermally conductive material being thermally coupled with the solder balls;
wherein the cooling plate comprises the thermally conductive material and the thermally conductive material within the plurality of openings forms extensions from the cooling plate.
2 . The electronic device of claim 1 , wherein
the plurality of openings comprise vias through the substrate, and
the vias are lined with a conductive material that surrounds the thermally conductive material.
3 . The electronic device of claim 1 , wherein the thermally conductive material within the plurality of openings is configured as a plurality of fins.
4 . The electronic device of claim 1 , wherein the thermally conductive material within the plurality of openings is configured as a plurality of posts.
5 . The electronic device of claim 1 , comprising a thermal interface material between the cooling plate and the second side of the substrate.
6 . The electronic device of claim 1 , comprising a plurality of fins thermally coupled to the cooling plate, the plurality of fins being on a side of the cooling plate that is opposite the second side of the substrate.
7 . The electronic device of claim 6 , comprising a second cooling plate thermally coupled to the plurality of fins wherein the plurality of fins are situated between the cooling plate and the second cooling plate.
8 . The electronic device of claim 1 , comprising a fan associated with the second cooling plate, the fan being configured to cause airflow across the plurality of fins.
9 . The electronic device of claim 1 , wherein the thermally conductive material comprises a metal including at least one of copper, aluminum or bronze.
10 . A method of cooling an electronic device including an integrated circuit component having a plurality of solder balls on one side and a substrate having a first side adjacent the one side of the integrated circuit component, the method comprising:
situating a cooling plate toward a second side of the substrate;
situating a thermally conductive material within a plurality of openings in the substrate such that the thermally conductive material is coupled with the cooling plate and at least some of the thermally conductive material is thermally coupled with the solder balls; and
dissipating heat from the integrated circuit component by conducting the heat along the thermally conductive material whereby the heat can be radiated from the cooling plate;
wherein:
the cooling plate comprises the thermally conductive material,
the thermally conductive material within the plurality of openings forms extensions from the cooling plate, and
situating the thermally conductive material comprises inserting the extensions into the openings in the substrate.
11 . The method of claim 10 , wherein
the plurality of openings comprise vias through the substrate, and
the vias are lined with a conductive material that surrounds the thermally conductive material.
12 . The method of claim 10 , wherein
the thermally conductive material within the plurality of openings is configured as a plurality of fins, and
situating the thermally conductive material comprises inserting the fins into the openings in the substrate.
13 . The method of claim 10 , wherein
the thermally conductive material within the plurality of openings is configured as a plurality of posts, and
situating the thermally conductive material comprises inserting the posts into the openings in the substrate.
14 . The method of claim 10 , comprising placing a thermal interface material between the cooling plate and the second side of the substrate.
15 . The method of claim 10 , comprising thermally coupling a plurality of fins to the cooling plate on a side of the cooling plate that is opposite the second side of the substrate.
16 . The method of claim 15 , comprising thermally coupling a second cooling plate to the plurality of fins, wherein the plurality of fins are situated between the cooling plate and the second cooling plate.
17 . The method of claim 10 , comprising using a fan associated with the second cooling plate to cause airflow across the plurality of fins.
18 . The method of claim 10 , wherein the thermally conductive material comprises a metal including at least one of copper, aluminum or bronze.