DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
According to one embodiment, a display device includes a circuit layer, an insulating layer comprising a contact hole, a lower electrode provided above the insulating layer and connected to the pixel circuit through the contact hole, a filling material inside the contact hole, a rib including a pixel aperture, a partition above the rib, an organic layer covering the lower electrode, and an upper electrode covering the organic layer. The rib and the partition overlap an entire of the contact hole as seen in plan view. A thickness of the filling material is less than a depth of the contact hole.
1 . A display device comprising:
a circuit layer including a pixel circuit;
an insulating layer which covers the circuit layer and comprises a contact hole;
a lower electrode provided above the insulating layer and connected to the pixel circuit through the contact hole;
a filling material located inside the contact hole and formed of an organic insulating material which covers the lower electrode;
a rib comprising a pixel aperture which overlaps the lower electrode;
a partition provided above the rib;
an organic layer which covers the lower electrode through the pixel aperture and emits light based on application of voltage; and
an upper electrode which covers the organic layer, wherein
the rib and the partition overlap an entire of the contact hole as seen in plan view, and
a thickness of the filling material is less than a depth of the contact hole.
2 . The display device of claim 1 , wherein
the filling material has a shape in which the thickness decreases toward a center of the contact hole.
3 . The display device of claim 1 , wherein
an upper surface of the filling material has a shape which is depressed toward a lower side.
4 . The display device of claim 1 , wherein
the pixel circuit includes a conductive layer exposed from the insulating layer through the contact hole, and
the lower electrode is in contact with the conductive layer inside the contact hole.
5 . The display device of claim 4 , wherein
the conductive layer comprises an end portion located inside the contact hole,
the lower electrode comprises a step portion generated by the end portion of the conductive layer, and
the filling material covers the step portion.
6 . The display device of claim 5 , wherein
the thickness of a portion of the filling material located above the step portion is greater than or equal to a thickness of the conductive layer.
7 . The display device of claim 5 , wherein
a position of the end portion of the conductive layer is not coincident with a center of the contact hole.
8 . The display device of claim 7 , wherein
a position of the step portion is not coincident with the center of the contact hole.
9 . The display device of claim 1 , wherein
the lower electrode comprises an end portion located inside the contact hole, and
the filling material covers the end portion of the lower electrode.
10 . The display device of claim 9 , wherein
the end portion of the lower electrode is located on an inner surface of the contact hole.
11 . The display device of claim 1 , wherein
each of the rib and the partition comprises a recess portion which is depressed toward inside of the contact hole.
12 . The display device of claim 1 , wherein
the partition includes a conductive lower portion and an upper portion provided on the lower portion and protruding from a side surface of the lower portion.
13 . The display device of claim 12 , wherein
a thin film including the organic layer and the upper electrode is divided by the partition.
14 . The display device of claim 13 , further comprising
a sealing layer formed of an inorganic insulating material and continuously covering a plurality of portions of the thin film divided by the partition.
15 . The display device of claim 14 , wherein
neither the thin film nor the sealing layer is provided above the contact hole.
16 . A manufacturing method of a display device, comprising:
forming a circuit layer including a pixel circuit;
forming an insulating layer which covers the circuit layer and comprises a contact hole;
forming a lower electrode connected to the pixel circuit through the contact hole above the insulating layer;
forming an insulating photosensitive material which covers the insulating layer and the lower electrode and fills at least part of the contact hole;
exposing an entire of the photosensitive material without using a photomask; and
forming a filling material having a thickness less than a depth of the contact hole inside the contact hole by developing the photosensitive material to remove a portion of the photosensitive material located outside the contact hole, and by reducing a thickness of a portion of the photosensitive material located inside the contact hole.
17 . The manufacturing method of claim 16 , wherein
the pixel circuit includes a conductive layer covered with the insulating layer,
the contact hole is formed such that the conductive layer is exposed from the insulating layer, and
the lower electrode is in contact with the conductive layer inside the contact hole.
18 . The manufacturing method of claim 17 , wherein
the conductive layer comprises an end portion located inside the contact hole,
the lower electrode comprises a step portion generated by the end portion of the conductive layer, and
the filling material is formed so as to cover the step portion.
19 . The manufacturing method of claim 16 , further comprising:
forming a rib which covers the filling material and comprises a pixel aperture overlapping the lower electrode; and
forming a partition provided above the rib.
20 . The manufacturing method of claim 19 , further comprising:
forming an organic layer which covers the lower electrode through the pixel aperture and emits light based on application of voltage; and
forming an upper electrode which covers the organic layer and is in contact with the partition.