Method for manufacturing an apparatus for manipulating a droplet
An apparatus for forming a plurality of microdroplets from a droplet includes a substrate, a dielectric layer on the substrate and having a plurality of hydrophilic surface regions spaced apart from each other by a hydrophobic surface, and a plurality of electrodes covered by the dielectric layer. The electrodes are configured to form an electric field across the droplet in response to voltages provided by a control circuit to move the droplet across the dielectric layer in a lateral direction while leaving portions of the droplet on the hydrophilic surface regions to form the plurality of microdroplets on the hydrophilic surface regions.
1. A method for manufacturing an apparatus for manipulating a droplet, the method comprising:
providing a socket for receiving a package containing an integrated circuit, the socket comprising a socket body including a plurality of upper contact pins disposed on a surface of the socket body and configured to receive electrical signals from the integrated circuit;
providing a disposable substrate having a first surface including a plurality of electrodes, a second surface opposite the first surface, a plurality of vias extending through the disposable substrate, and a plurality of conductive features each having a raised portion protruding from the second surface, wherein the disposable substrate is configured to receive the droplet on the first surface; and
attaching the disposable substrate to the surface of the socket body using a fastening member so that the conductive features of the disposable substrate are in electrical and physical contact with the upper contact pins of the socket to provide the electrical signals to the electrodes for manipulating the droplet.
2. The method of claim 1 , wherein the socket is a ball grid array socket.
3. The method of claim 1 , wherein the socket is a land grid array socket.
4. The method of claim 1 , wherein the disposable substrate is a single layer substrate, wherein the electrodes and the vias comprise a same conductive material.
5. The method of claim 4 , wherein the conductive material comprises copper.
6. The method of claim 1 , wherein the conductive features are aligned with the upper contact pins.