Plating Tool Tooling System
An assembly is provided for movably retaining a component and includes a tooling assembly and a device. The tooling assembly includes a tooling base and a carrier. The tooling base includes a frame and a guide. The frame is configured to retain the component. The guide is associated with a multi-axis pathway. The carrier is movably coupled to the guide. The device is coupled to the carrier and is movable with the carrier along the multi-axis pathway.
1 . An assembly for movably retaining a component, the assembly comprising:
a tooling assembly having:
a tooling base, the tooling base including a frame and a guide, the frame configured to retain the component, the guide associated with a multi-axis pathway; and
a carrier movably coupled to the guide; and
a device coupled to the carrier and movable with the carrier along the multi-axis pathway.
2 . The assembly of claim 1 , wherein the multi-axis pathway is a helical pathway and the device is an electrode, wherein the device facilitates processing of the component.
3 . The assembly of claim 1 , wherein:
the component is a vane segment having a plurality of vanes;
the device includes an electrode with a plurality of plates; and
at least one of the plurality of plates is positionable adjacent at least one of the plurality of vanes along the multi-axis pathway.
4 . The assembly of claim 1 , wherein the carrier has a collar and a curved flange.
5 . The assembly of claim 4 , wherein the collar is configured to extend about the guide.
6 . The assembly of claim 1 , wherein:
the guide includes a shaft and a helical key associated with the multi-axis pathway; and
the carrier includes a collar that is configured to extend about the guide and the carrier includes a keyway that receives the helical key.
7 . The assembly of claim 1 , wherein the frame includes a stop configured to restrict movement of the carrier along the guide.
8 . The assembly of claim 1 , wherein the component includes at least one tab.
9 . The assembly of claim 8 , wherein the at least one tab is removably attached to the tooling base.
10 . The assembly of claim 1 , wherein the carrier includes a clamp configured to be movably secured to the guide.
11 . The assembly of claim 2 , wherein the device is an anode and the component forms at least part of a cathode when the assembly is used for electroplating of the component.
12 . An assembly for movably retaining a component, the assembly comprising:
a tooling assembly having:
a tooling base, the tooling base including a guide, the tooling base configured to retain the component, the guide including a shaft and a helical key associated with a helical pathway; and
a carrier movably coupled to the guide, the carrier including a collar configured to extend about the guide, the collar including a keyway that receives the helical key; and
an electrode coupled to the carrier and movable with the carrier along the helical pathway.
13 . The assembly of claim 12 , wherein:
the component is a vane segment having a plurality of vanes;
the electrode has a plurality of plates; and
at least one of the plurality of plates is positionable adjacent at least one of the plurality of vanes along the helical pathway.
14 . The assembly of claim 12 , wherein the carrier has a curved flange.
15 . The assembly of claim 12 , wherein the tooling base includes a stop configured to restrict sliding of the carrier along the guide.
16 . The assembly of claim 12 , wherein the component includes at least one tab.
17 . The assembly of claim 16 , wherein the at least one tab is removably attached to the tooling base.
18 . The assembly of claim 12 , wherein the electrode is an anode and the component forms at least part of a cathode when the assembly is used to electroplate the component.
19 . A method of positioning a component relative to an electrode for an electrically driven plating process, the method comprising:
retaining the component with a tooling base;
coupling a carrier to a guide of the tooling base, the guide being associated with a multi-axis pathway;
coupling the electrode to the carrier; and
moving the carrier and electrode relative to the component along the multi-axis pathway to position the electrode adjacent the component.
20 . The method of claim 19 , wherein the component is a vane segment having a plurality of vanes and the electrode has a plurality of plates, the plurality of plates being moved relative to the plurality of vanes along the multi-axis pathway to position at least one of the plurality of plates adjacent at least one of the plurality of vanes.