IP Library Patent Application 18529896
Patent Application
App. No. 18/529,896

WIDE PRESSURE COOKER

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Quick Facts
Patent No.
US None
App. No.
18/529,896
Abstract

An apparatus configured to perform pressure cooking includes a housing comprising a rim; a lid coupled to the housing, the lid configured to engage the rim to form an air-tight seal that enables pressure cooking within the housing; and a cooking vessel defining a chamber in which food to be cooked is disposed. A maximum inner diameter of the cooking vessel is at least 1.5 times greater than a maximum vessel depth of the cooking vessel. In addition, or alternatively, at least a portion of a power circuit that controls a heating element, and/or at least a portion of a power circuit housing that houses the power circuit, is higher than a bottom of the cooking vessel.

Claims (31)

1 . A pressure cooking apparatus comprising:

a housing comprising a rim;

a lid coupled to the housing, the lid configured to engage the rim to form an air-tight seal that enables pressure cooking within the housing;

a cooking vessel defining a chamber in which food to be cooked by the pressure cooking apparatus is disposed,

wherein a maximum inner diameter of the cooking vessel is at least 1.5 times greater than a maximum vessel depth of the cooking vessel.

2 . The cooking apparatus of claim 1 , wherein the maximum inner diameter of the cooking vessel is at least 2 times greater than the maximum vessel depth of the cooking vessel.

3 . The cooking apparatus of claim 2 , wherein the maximum inner diameter of the cooking vessel is at least 2.2 times greater than the maximum vessel depth of the cooking vessel.

4 . The cooking apparatus of claim 1 , further comprising:

a heating element disposed below the cooking vessel; and

a power printed circuit board (PCB) configured to control the heating element, the power PCB disposed within the housing not below a bottom of the cooking vessel.

5 . The cooking apparatus of claim 4 , wherein the power PCB is disposed outside of a width-depth profile of the cooking vessel.

6 . The cooking apparatus of claim 4 , further comprising a control interface coupled to the housing, wherein the power PCB is circumferentially positioned about the cooking vessel at least 90 degrees from the control interface.

7 . The cooking apparatus of claim 6 , wherein the power PCB is circumferentially disposed about 180 degrees from the control interface.

8 . The cooking apparatus of claim 1 , wherein the maximum inner diameter is at least 250 millimeters.

9 . The cooking apparatus of claim 1 , wherein the maximum vessel depth is at most 150 millimeters.

10 . The cooking apparatus of claim 1 , wherein a lift-over height of the pressure cooking apparatus is less than 250 millimeters.

11 . The cooking apparatus of claim 1 , wherein a vessel removal height of the pressure cooking apparatus is less than 150 millimeters.

12 . A pressure cooking apparatus comprising:

a housing comprising a rim;

a lid coupled to the housing, the lid configured to engage the rim to form an air-tight seal that enables pressure cooking within the housing;

a cooking vessel defining a chamber in which food to be cooked by the pressure cooking apparatus is disposed;

a heating element disposed below the cooking vessel; and

a power circuit housing that houses a power circuit configured to control the heating element, wherein at least a portion of the power circuit housing is higher than a bottom of the cooking vessel.

13 . The cooking apparatus of claim 12 , wherein the maximum inner diameter of the cooking vessel is at least 2 times greater than the maximum vessel depth of the cooking vessel.

14 . The cooking apparatus of claim 13 , wherein the maximum inner diameter of the cooking vessel is at least 2.2 times greater than the maximum vessel depth of the cooking vessel.

15 . The cooking apparatus of claim 12 , further comprising a control interface coupled to the housing, wherein the power PCB is circumferentially positioned about the cooking vessel at least 90 degrees from the control interface.

16 . The cooking apparatus of claim 15 , wherein the power PCB is circumferentially disposed about 180 degrees from the control interface.

17 . The cooking apparatus of claim 12 , wherein the maximum inner diameter is at least 250 millimeters.

18 . The cooking apparatus of claim 12 , wherein the maximum vessel depth is at most 150 millimeters.

19 . The cooking apparatus of claim 12 , wherein a lift-over height of the pressure cooking apparatus is less than 250 millimeters.

20 . The cooking apparatus of claim 12 , wherein a vessel removal height of the pressure cooking apparatus is less than 150 millimeters.

Assignments (3)
SECURITY INTEREST Recorded Jan 7, 2025
From: IB APPLIANCES US HOLDINGS, LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 069837/0553 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2024
From: INSTANT BRANDS HOLDINGS INC.
To: IB APPLIANCES US HOLDINGS LLC
Reel/Frame 069587/0012 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2023
From: LEPINSKE, JASON
To: INSTANT BRANDS HOLDINGS INC.
Reel/Frame 065776/0444 →