Light-emitting diode testing circuit, light-emitting diode testing method and light-emitting diode manufacturing method

1. A manufacturing method for a LED, comprising:

providing a substrate with an upper surface;

preparing a plurality of LEDs on the upper surface;

wherein the upper surface is divided into a plurality of zones, the plurality of LEDs composes a plurality of LED groups, and each of the LED group is disposed in one of the plurality of zones;

preparing a testing circuit to electrically connecting the plurality of LEDs in one of the plurality of LED groups;

testing the plurality of LEDs in the one of the plurality of LED groups by the testing circuit to obtain photoelectrical characteristics of the plurality of LEDs in the one of the plurality of LED groups; and

presenting the photoelectric characteristics in an image.

2. The manufacturing method according to claim 1 , wherein the image comprises a gray scale image or a color image.

3. The manufacturing method according to claim 1 , wherein the step of testing the plurality of LEDs in the one of the plurality of LED groups by the testing circuit comprises inputting a testing current with 1 pA to 100 μA into the plurality of LEDs.

4. The manufacturing method according to claim 1 , wherein the plurality of LEDs in the one of the plurality of LED groups comprises one or more defective LEDs, and the testing method further comprises identifying the one or more defective LEDs by the image.

5. The manufacturing method according to claim 4 , further comprising:

recording a position of the one or more defective LEDs;

providing a target carrier or a module carrier; and

performing one of the following steps by the position of the one or more defective LEDs:

removing the one or more defective LEDs from the substrate, and then transferring the other of the plurality of LEDs in the one of the plurality of LED groups to the target carrier or the module carrier;

not transferring the one or more defective LEDs, but transferring the other of the plurality of LEDs in the one of the plurality of LED groups to the target carrier or the module carrier; or

transferring the plurality of LEDs in the one of the plurality of LED groups to the target carrier or the module carrier and repairing the one or more defective LEDs on the target carrier or the module carrier.

6. The manufacturing method according to claim 1 , wherein:

each of the plurality of LEDs comprises a first electrode and a second electrode; and

the testing circuit comprises a first testing pad, a second testing pad, a first wire and a second wire;

wherein the first electrode is electrically connected to the first testing pad via the first wire and the second electrode is electrically connected to the second testing pad via the second wire.

7. The manufacturing method according to claim 6 , wherein a distance between the first electrode and the second electrode of each of the plurality of LEDs is less than 30 μm.

8. The manufacturing method according to claim 1 , further comprising removing the testing circuit after the step of testing the plurality of LEDs.

9. The manufacturing method according to claim 1 , wherein the step of testing the plurality of LEDs further comprises applying a luminance meter, a spectroradiometer, a near-field measurement system, a photoluminescence (PL) measurement system to test the plurality of LEDs and obtain the image.

10. The manufacturing method according to claim 1 , wherein the substrate is a growth substrate.

11. The manufacturing method according to claim 1 , wherein the step of preparing a testing circuit comprises forming the testing circuit on the substrate.

12. The manufacturing method according to claim 1 , wherein the substrate is a temporary carrier and the one of the plurality of LED groups is joined to the temporary carrier by a bonding layer.

13. The manufacturing method according to claim 1 , further comprising:

proving a temporary carrier;

preparing the testing circuit on the temporary carrier; and

joining the plurality of LEDs in the one of the plurality of LED groups to the testing circuit on the temporary carrier to electrically connect the plurality of LEDs in the one of the plurality of LED groups and the testing circuit.

14. The manufacturing method according to claim 13 , further comprising: transferring the one of the plurality of LED groups to the temporary carrier from the substrate.

15. The manufacturing method according to claim 1 , further comprising dividing the substrate into a plurality of sub-wafers after the step of testing the plurality of LEDs.

16. The manufacturing method according to claim 1 , wherein the step of testing the plurality of LEDs comprises a selective testing or a regional testing.

17. The manufacturing method according to claim 1 , wherein each of the plurality of LEDs comprises a diagonal length less than 150 μm.

18. The manufacturing method according to claim 11 , wherein the testing circuit is on the plurality of LEDs in the one of the plurality of LED groups and an isolation region between the plurality of LEDs.

19. The manufacturing method according to claim 18 , wherein the isolation region comprises a part of the upper surface of the substrate.

20. The manufacturing method according to claim 1 , wherein the plurality of LEDs in the one of the plurality of LED groups are electrically connected in a parallel circuit or a series-parallel circuit by the testing circuit.