POLYAMIDE COMPOSITIONS WITH DUAL COPPER STABILIZERS
A polyamide composition comprising from 15-70 wt % of a first polyamide; from 5-40 wt % of a second polyamide; from 0.01-10 wt % of a stabilizer comprising a lanthanoid-based compound; from 0.01-10 wt % of a first stabilizer comprising a copper-based compound; from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and from 20-65 wt % filler.
1 . A polyamide composition comprising:
from 15-70 wt % of a first polyamide;
from 5-40 wt % of a second polyamide;
from 0.01-10 wt % of a stabilizer comprising a lanthanum-based compound;
from 0.01-10 wt % of a first stabilizer comprising a copper-based compound;
from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and
from 20-65 wt % filler.
2 . The composition of claim 1 , wherein the first polyamide comprises a non-aromatic polyamide, and the non-aromatic polyamide is a cycloaliphatic copolymer comprising from 50 wt % to 90 wt % PA66, and from 10 wt % to 50 wt % cyclohexane diacid.
3 . The composition of claim 2 , wherein the non-aromatic polyamide is a cycloaliphatic copolymer comprising from 60 wt % to 80 wt % PA66, and from 20 wt % to 40 wt % cyclohexane diacid.
4 . The composition of claim 1 , wherein the first polyamide comprises PA66/6C.
5 . The composition of claim 4 , wherein the first polyamide is present in an amount ranging from 30 wt % to 45 wt %.
6 . The composition of claim 1 , wherein the first polyamide is selected from the group consisting of PA6,6/6; PA6,6/610; PA6,6/611; PA6,6/612; PA6,6/10; PA6,6/11; PA6,6/12; PA6/6,6; PA6/610; PA6/611; PA6/612; PA6/10; PA6/11; PA6/12; PA6T/66; PA66/6T; PA6T/66/6I; PA9T; PA10T; and PA6TDT.
7 . The composition of claim 1 , wherein the polyamide of the second polyamide is an aliphatic copolymer.
8 . The composition of claim 1 , wherein the second polyamide comprises PA66/6.
9 . The composition of claim 8 , wherein the second polyamide is present in an amount ranging from 10 wt % to 20 wt %.
10 . The composition of claim 1 , wherein the lanthanum-based compound is a lanthanum-based heat stabilizer.
11 . The composition of claim 1 , wherein the lanthanum-based compound comprises a lanthanum ligand selected from the group consisting of acetates, hydrates, oxyhydrates, phosphates, bromides, chlorides, oxides, nitrides, borides, carbides, carbonates, ammonium nitrates, fluorides, nitrates, polyols, amines, phenolics, hydroxides, oxalates, oxyhalides, chromoates, sulfates, or aluminates, perchlorates, the monochalcogenides of sulphur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulphonates, acetylacetonates, alcoholates, 2-ethylhexanoates, or combinations thereof.
12 . The composition of claim 11 , wherein the lanthanum-based compound is lanthanum hydroxide.
13 . The composition of claim 1 , wherein at least one of the first and second stabilizers comprising copper-based compounds includes a CuI/KBr compound.
14 . The composition of claim 1 , wherein the composition comprises at least one additional polyamide.
15 . The composition of claim 14 , wherein the additional polyamide is PA66 and/or PA6.
16 . The composition of claim 15 , wherein the PA6 is present in an amount ranging from 1 wt % to 10 wt %.
17 . The composition of claim 1 , wherein the first polyamide contains a non-aromatic structure that crystallizes or co-crystallizes with the acids of the other polyamide(s).
18 . The polyamide composition of claim 1 , wherein the filler comprises a glass fiber.
19 . The polyamide composition of claim 18 , wherein the glass fiber is present in an amount ranging from 25 wt % to 50 wt %.
20 . The polyamide composition of claim 1 , wherein the lanthanum stabilizer is present in an amount ranging from 0.1 wt % to 1 wt %.
21 . The polyamide composition of claim 1 , wherein the first and the second copper stabilizers are each present in an amount ranging from 1 wt % to 5 wt %.
22 . The polyamide composition of claim 1 , wherein the lanthanum stabilizer is present in an amount ranging from 0.1 wt % to 1 wt %, the first copper stabilizer is present in an amount ranging from 1 wt % to 5 wt %, and the second copper stabilizer is present in an amount ranging from 1 wt % to 5 wt %.
23 . The polyamide composition of claim 1 , wherein the polyamide composition, when heat aged for 3000 hours at a temperature of 210° C., demonstrates a tensile strength of 146 or higher, as measured at 23° C.
24 . The polyamide composition of claim 1 , wherein the polyamide composition, when heat aged for 3000 hours at a temperature of 210° C., demonstrates a tensile strength reduction of 0.85 or higher, as measured at 23° C.
25 . The polyamide composition of claim 24 , wherein the polyamide composition, when heat aged for 3000 hours at a temperature of 210° C., demonstrates a tensile elongation of 1.39 or higher, as measured at 23° C.
26 . An article for use in high temperature applications, wherein the article is formed from the polyamide composition of claim 1 , wherein the article is used for fasteners, circuit breakers, terminal blocks, connectors, automotive parts, furniture parts, appliance parts, cable ties, sports equipment, gun stocks, window thermal breaks, aerosol valves, food film packaging, automotive/vehicle parts, textiles, industrial fibers, carpeting, or electrical/electronic parts.